Socket for Memory Module Board MCR89 Series FEM Design Simulation Designed in Miniature 2 Contacts with High Precision Spring ■Features 1. High Reliability 4. Miniature Type and High Density Mounting This socket achieves high reliability in the horizontal contact spring system. 2. Low Insertion Force The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 5. Wide Effective Mounting Area This socket prevents mis-insertion force in the preload structure. 3. Easy Pattern Design The dip contact through-hole diameter is only Ø0.5, and simplifies the pattern design. This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking. 6. Easy Board Mounting The fixing pins are arranged in the same alignment as the contact, so as to easily install the connector in the board. 7. Accessories Dust covers and jigs to remove the board are available. ■Product Specifications Rating Current rating: 0.5A Operating Temperature Range: -30 to +85ç (Note 1) Storage Temperature Range: -10 to +60ç (Note 2) Voltage rating: 125V AC Operating Humidity Range: 40 to 80% Item Storage Temperature Range: 40 to 70% (Note 2) Specification Conditions 1. Contact Resistance 1000M ohms min. 500A DC 2. Withstanding voltage No flashover or insulation breakdown. 500V DC / 1 minute 3. Insulation Resistance 20m ohms max. 100mA 4. Vibration Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions. No electrical discontinuity of 10 µs or more 5. Humidity (Steady state) Insulation Resistance:1000M ohms min. 96 hours at temperature of 40ç and humidity of 90% to 95% 5 cycles under following condition; 6. Temperature Cycle No damage, cracks, or parts looseness. Temperature : -55: 30 minutes→ +5 to 35ç: 5 minutes max.→ 7. Durability (Insertion/withdrawal) Contact resistance: 20m ohms max. 200 cycles 85ç : 30 minutes→15- to 30ç 5 minutes max.) Manual soldering: 300ç for 3 seconds 8. Resistance to Soldering heat No deformation of components affecting performance. Note 1: Includes temperature rise caused by current flow. Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. D2 ■Material Part Material Insulator PPS Contact Beryllium copper Lock pin Copper alloy Finish Remarks Color : Brown UL94V-0 Contact area Selective gold plating Lead area Solder plating Solder plating ----------------------------- ■Ordering Information MCR89 - 130 D - 1.27 DSA 1 1 Series Name: MCR89 2 3 4 5 5 Board installation type 2 Number of Contacts: 130 DSA: Straight dip type, board thickness 1.6mm 3 D: Double row DSC: Straight dip type, board thickness 2.6mm 4 Contacts Pitch: 1.27mm BMounting Dimensions D3 ■Dip Straight Type Unit: mm Part Number CL No. MCR89-130D-1.27DSA(01) 548-0173-0-01 MCR89-130D-1.27DSC(01) 548-0185-9-01 Number of Contacts 130 A B 2.8 2.3 3.8 3.4 Note: 25 pieces are packaged in one set for sale. The above table indicates a packaging of 25 pieces. BPCB mounting pattern D4 BRecommended Module Board Dimensions ■Dust Cover Part Number CL No. Material Finish MCR89-130D-DC(01) 548-0180-5-01 ABS Black Note: 100 pieces are packaged in one set for sale. The above table indicates a packaging of 100 pieces. ■Module Board Extraction Jig Operating Instruction Part Number CL No. Material Finish MCR89-130D-EJ 548-0183-3 Polyamid resin Black (1) Insert the jig protrusion in the board hole. Grasping the handle, pull the board up. (2) By loosing force, the board is removed from the jig. D5