STMICROELECTRONICS STPS10150C

STPS10150CT/CG
®
HIGH VOLTAGE POWER SCHOTTKY RECTIFIER
MAIN PRODUCT CHARACTERISTICS
A1
IF(AV)
2x5A
VRRM
150 V
Tj
175°C
VF (max)
0.75 V
K
A2
K
FEATURES AND BENEFITS
■
■
■
■
HIGH JUNCTION TEMPERATURE CAPABILITY
GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP
LOW LEAKAGE CURRENT
AVALANCHE CAPABILITY SPECIFIED
A2
K
A1
A2
A1
D2PAK
STPS10150CG
TO-220AB
STPS10150CT
DESCRIPTION
Dual center tap schottky rectifier designed for
high frequency Switched Mode Power Supplies.
ABSOLUTE RATINGS (limiting values, per diode)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
150
V
IF(RMS)
RMS forward current
10
A
5
10
A
IF(AV)
Average forward current TO-220AB
δ = 0.5
D2PAK
Tc = 155°C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
120
A
PARM
Repetitive peak avalanche power
tp = 1µs
3100
W
- 65 to + 175
°C
175
°C
10000
V/µs
Tstg
Tj
dV/dt
Storage temperature range
Maximum operating junction temperature
Critical rate of rise of reverse voltage
July 2003 - Ed: 5B
per diode
per device
Tj = 25°C
1/5
STPS10150CT/CG
THERMAL RESISTANCES
Symbol
Rth (j-c)
Parameter
Junction to case
Unit
4
°C/W
Per diode
2
Total
2.4
2
Coupling
0.7
TO-220AB / D PAK
TO-220AB / D PAK
Rth (c)
Value
2
TO-220AB / D PAK
When the diodes 1 and 2 are used simultaneously :
∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c)
STATIC ELECTRICAL CHARACTERISTICS (per diode)
Symbol
Parameter
IR *
Reverse leakage current
Tests conditions
Tj = 25°C
Min.
VR = VRRM
Tj = 125°C
VF **
Pulse test :
Forward voltage drop
Typ.
0.40
Tj = 25°C
IF = 5 A
Tj = 125°C
IF = 5 A
Tj = 25°C
IF = 10 A
Tj = 125°C
IF = 10 A
0.69
Max.
Unit
2.0
µA
2.0
mA
0.92
V
0.75
1
0.79
0.85
* tp = 5 ms, δ < 2%
** tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.65 IF(AV) + 0.02 IF2(RMS)
Fig. 1: Average forward power dissipation versus
average forward current (per diode).
PF(av)(W)
5.0
δ = 0.2
δ = 0.5
δ = 0.1
4.5
4.0
δ = 0.05
3.5
δ=1
3.0
2.5
2.0
1.5
T
1.0
0.5
IF(av) (A)
tp
δ=tp/T
0.0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
2/5
Fig. 2: Average forward current versus ambient
temperature (δ = 0.5, per diode).
IF(av)(A)
6
Rth(j-a)=Rth(j-c)
5
4
Rth(j-a)=15°C/W
3
2
T
1
0
δ=tp/T
0
25
Tamb(°C)
tp
50
75
100
125
150
175
STPS10150CT/CG
Fig. 3: Normalized avalanche power derating
versus pulse duration.
Fig. 4: Normalized avalanche power derating
versus junction temperature.
PARM(tp)
PARM(1µs)
1
1.2
PARM(tp)
PARM(25°C)
1
0.1
0.8
0.6
0.4
0.01
0.2
Tj(°C)
tp(µs)
0.001
0.01
0.1
1
0
10
100
0
1000
Fig. 5: Non repetitive surge peak forward current
versus overload duration (maximum values, per
diode).
25
50
75
100
125
150
Fig. 6: Relative variation of thermal impedance
junction to case versus pulse duration (per diode).
Zth(j-c)/Rth(j-c)
IM(A)
1.0
80
70
0.8
60
50
Tc=50°C
0.6
Tc=75°C
0.4
δ = 0.5
40
30
20
δ = 0.2
δ = 0.1
Tc=125°C
IM
10
Single pulse
t(s)
t
δ=0.5
0
1E-3
1E-2
T
0.2
1E-1
1E+0
Fig. 7: Reverse leakage current versus reverse
voltage applied (typical values, per diode)
0.0
1E-3
tp(s)
δ=tp/T
1E-2
tp
1E-1
1E+0
Fig. 8: Junction capacitance versus reverse
voltage applied (typical values, per diode).
C(pF)
IR(µA)
200
1E+5
F=1MHz
Tj=25°C
Tj=175°C
1E+4
100
Tj=150°C
1E+3
Tj=125°C
1E+2
50
Tj=75°C
1E+1
1E+0
20
Tj=25°C
1E-1
1E-2
VR(V)
VR(V)
0
25
50
75
100
125
150
10
1
2
5
10
20
50
100
200
3/5
STPS10150CT/CG
Fig. 10: Thermal resistance junction to ambient
versus copper surface under tab (Epoxy printed
circuit board, copper thickness: 35µm)
(STPS10150CG only).
Fig. 9: Forward voltage drop versus forward
current (maximum values, per diode).
IFM(A)
Rth(j-a) (°C/W)
100.0
80
70
Tj=125°C
Typical values
60
10.0
Tj=125°C
50
Tj=25°C
40
30
1.0
20
10
VFM(V)
0.1
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0
S(cm²)
0
2
4
6
8
10
12
14
16
18
PACKAGE MECHANICAL DATA
TO-220AB
DIMENSIONS
REF.
A
H2
Dia
C
L5
L7
L6
L2
F2
F1
D
L9
L4
M
G1
E
G
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
0.107
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.066
F2
1.14
1.70
0.044
0.066
G
4.95
5.15
0.194
0.202
G1
2.40
2.70
0.094
0.106
H2
10
10.40
0.393
0.409
16.4 typ.
0.645 typ.
L4
13
14
0.511
0.551
L5
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.20
6.60
0.244
0.259
L9
3.50
3.93
0.137
0.154
M
Diam.
4/5
Inches
Min.
L2
F
Millimeters
2.6 typ.
3.75
3.85
0.102 typ.
0.147
0.151
20
STPS10150CT/CG
PACKAGE MECHANICAL DATA
D2PAK
DIMENSIONS
REF.
A
E
Min.
C2
L2
D
L
L3
A1
B2
Millimeters
R
C
B
G
A2
2.0 MIN.
FLAT ZONE
V2
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2
Inches
Typ. Max. Min.
Typ. Max.
4.30
4.60 0.169
0.181
2.49
2.69 0.098
0.106
0.03
0.23 0.001
0.009
0.70
0.93 0.027
0.037
1.25 1.40
0.049 0.055
0.45
0.60 0.017
0.024
1.21
1.36 0.047
0.054
8.95
9.35 0.352
0.368
10.00
10.28 0.393
0.405
4.88
5.28 0.192
0.208
15.00
15.85 0.590
0.624
1.27
1.40 0.050
0.055
1.40
1.75 0.055
0.069
0.40
0.016
0°
8°
0°
8°
FOOT PRINT DIMENSIONS (in millimeters)
16.90
10.30
5.08
1.30
3.70
8.90
■
Ordering type
Marking
Package
Weight
Base qty
Delivery mode
STPS10150CT
STPS10150CG
STPS10150CG-TR
STPS10150CT
STPS10150CG
STPS10150CG
TO-220AB
D2PAK
D2PAK
2.2 g
1.48 g
1.48 g
50
50
1000
Tube
Tube
Tape & reel
EPOXY MEETS UL94, V0
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change without notice. This publication supersedes and replaces all information previously supplied.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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