FREESCALE AN3150

Freescale Semiconductor
Application Note
AN3150
Rev 1.0, 2/2006
Soldering Recommendations for Pressure
Sensor Devices
by: Bill McDonald
INTRODUCTION
SURFACE MOUNT COMPONENTS
Pressure sensor devices require the internal cavity
containing the silicon transducer to be exposed to ambient in
order for the device to function. Exposed cavity packages
require special considerations during board assembly to
prevent damage to the device during soldering and
subsequent cleaning operations.
Components can be mounted using solder paste stencil,
screen printed or dispensed onto the PCB pads prior to
placement of the component. The volume of solder paste
applied to the PCB is normally sufficient to secure the
component during transport to the subsequent reflow
soldering process. Use of adhesives to secure component is
not recommended, but where necessary can be applied
providing the vent at the underside of the package does not
become blocked. This is applicable only to a gauge pressure
sensor device. Absolute pressure sensor devices do not have
a backside vent so vent blocking is not an issue.
Solder pastes are available in variety of metal
compositions, particle size and flux types. The solder paste
consists of metals and flux required for a reliable connection
between the component lead and the PCB pad. Flux aids the
removal of oxides that may be present on PCB pads and
prevents further oxidation from occurring during the solder
process.
The use of a No-Clean (NC) flux is recommended for
exposed cavity components. Using pressure spray or other
methods of cleaning is not recommended. If cleaning of the
pcb is performed Water Soluble (WS) flux can be used, but it
is recommended the component cavity to be protected by
adhesive Kapton tape, vinyl cap or other means prior to the
cleaning process to prevent contamination and foreign
materials from being introduced into device cavity as result of
cleaning processes. Refer to this link for info.
Figure 1. Basic Element
http://www.stockcap.com/products.asp
Figure 2. Port Adapter
Ultrasonic cleaning is not recommended as the frequencies
can damage wire bond interconnections.
Reflow soldering is typically used for surface mount
components and accomplished by convection heat from the
sides of the reflow furnace utilizing air circulation to produce
uniform temperature across the PCB. Hot spots and shielding
of the smaller components by adjacent larger components can
be minimized thus achieving more reliable solder connection.
© Freescale Semiconductor, Inc., 2006. All rights reserved.
THROUGH-HOLE (DIP) STYLE COMPONENTS
Dual in-line and other styles of through-hole components
packages are typically wave soldered where the leads
protrude through the circuit board and exposed to a flux bath
then immersed into molten solder as the board is passed over
a solder wave to create the solder connection. In this
application the top board surface and component body are not
directly exposed to high temperatures.
MPX series pressure sensors with port adapters should not
be exposed to temperatures greater than 220°C. The suffix
designations for these devices are; AP, GP, DP, AS, GS,ASX
or GSX.
SOLDERING PRECAUTIONS
Wave solder does not typically expose component to
excessive temperature, but there may be cases where
components are subjected to secondary reflow cycle during
double side board assembly.
Vapor phase soldering process is not recommended for
open cavity devices. There is a potential for liquid to ingress
into the cavity or possibility of condensation to form in cavity
of the device.
IR reflow is not recommended due to potential damage to
plastic features as result of radiation heat transfer.
MPXA, MPXH, MPXM and MPXV series pressure sensors
with port adapters should not be exposed to temperatures
greater than 245°C. Suffix designations for these devices are;
C, AP, DP and GSX.
Refer to the following table for listing of device types and
recommended maximum temperature exposure. The reflow
temperature profile for surface mount devices must be in
accordance with JEDEC STD. 020. Refer to following link for
specific profile details.
http://www.jedec.org/download/search/jstd020c.pdf
Devices provided with a mounting bracket for special
applications are to be excluded.
AN3150
2
Sensors
Freescale Semiconductor
REWORK OF SOLDERED COMPONENTS
Rework is not recommended, but should it be necessary, maximum temperature exposure for devices should not exceed the
limits shown in Table 1 with minimized duration.
Table 1. Pressure Sensors
Device Number
MPX
MPXA
MPXV
Suffix Designation
Package
Maximum Temperature °C
A,D
BASIC ELEMENT
245
AP
PORT ADAPTER
220
GP
PORT ADAPTER
220
DP
PORT ADAPTER
220
AS
PORT ADAPTER
220
GS
PORT ADAPTER
220
ASX
PORT ADAPTER
220
GSX
PORT ADAPTER
220
A
BASIC ELEMENT
245
C
PORT ADAPTER
245
GSX
PORT ADAPTER
245
G
BASIC ELEMENT
245
C
PORT ADAPTER
245
DP
PORT ADAPTER
245
GP
PORT ADAPTER
245
GVP
PORT ADAPTER
245
GSX
PORT ADAPTER
245
MPXH
A
BASIC ELEMENT
250
C
PORT ADAPTER
250
MPXM
A,D
BASIC ELEMENT
250
AS,GS
PORT ADAPTER
250
AN3150
Sensors
Freescale Semiconductor
3
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AN3150
Rev 1.0, 2/2006
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