MICREL SY89833LMI

Precision Edge®
SY89833L
®
3.3V ULTRA-PRECISION 1:4 LVDS
FANOUT BUFFER/TRANSLATOR
WITH INTERNAL TERMINATION
Micrel, Inc.
Precision Edge
SY89833L
FEATURES
Precision Edge®
■ Guaranteed AC performance over temperature
and voltage:
• DC-to > 2GHz throughput
• <600ps propagation delay (IN-to-Q)
• <20ps within-device skew
• <190ps rise/fall times
■ Ultra-low jitter design
• <1psRMS cycle-to-cycle jitter
• <10psPP total jitter
• <1psRMS random jitter
• <10psPP deterministic jitter
■ Unique input termination and VT pin accepts DCand AC-coupled inputs
■ High-speed LVDS outputs
■ 3.3V power supply operation
■ Industrial temperature range: –40°C to +85°C
■ Available in 16-pin (3mm x 3mm) MLF® package
DESCRIPTION
The SY89833L is a 3.3V, high-speed 2GHz differential
Low Voltage Differential Swing (LVDS) 1:4 fanout buffer
optimized for ultra-low skew applications. Within device skew
is guaranteed to be less than 20ps over supply voltage and
temperature.
The differential input buffer has a unique internal
termination design that allows access to the termination
network through a VT pin. This feature allows the device to
easily interface to different logic standards. A VREF-AC
reference is included for AC-coupled applications.
The SY89833L is part of Micrel’s high-speed clock
synchronization family. For 2.5V applications, the SY89832U
provides similar functionality while operating from a 2.5V
±5% supply. For applications that require a different I/O
combination, consult the Micrel website at: www.micrel.com,
and choose from a comprehensive product line of highspeed, low-skew fanout buffers, translators and clock
generators.
APPLICATIONS
■
■
■
■
Processor clock distribution
SONET clock distribution
Fibre Channel clock distribution
Gigabit Ethernet clock distribution
FUNCTIONAL BLOCK DIAGRAM
TYPICAL PERFORMANCE
1:4
622MHz Output
Q0
/Q0
IN
–15mV Offset
(50mV/div.)
Q1
/Q1
50Ω
VT
/IN
50Ω
Q2
VREF-AC
EN
(LVTTL/CMOS)
/Q2
D
Q
Q3
/Q3
TIME (321.9ps/div.)
Precision Edge is a registered trademark of Micrel, Inc.
MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.
August 2007
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SY89833L
Micrel Inc.
/Q0
Q0
VCC
GND
PACKAGE/ORDERING INFORMATION
16
15
14
13
Ordering Information(1)
Q1
1
12
IN
/Q1
2
11
VT
10
VREF-AC
4
/IN
5
6
7
8
VCC
EN
9
Q3
/Q2
3
/Q3
Q2
Part Number
Package
Type
Operating
Range
Package
Marking
Lead
Finish
SY89833LMI
MLF-16
Industrial
833L
Sn-Pb
SY89833LMITR(2)
MLF-16
Industrial
833L
Sn-Pb
SY89833LMG(3)
MLF-16
Industrial
833L with Pb-Free
bar line indicator
NiPdAu
Pb-Free
SY89833LMGTR(2, 3)
MLF-16
Industrial
833L with Pb-Free
bar line indicator
NiPdAu
Pb-Free
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC Electricals only.
2. Tape and Reel.
3. Pb-Free package is recommended for new designs.
16-Pin MLF® (MLF-16)
PIN DESCRIPTION
Pin Number
Pin Name
Pin Function
15, 16
1, 2
3, 4
5, 6
Q0, /Q0
Q1, /Q1
Q2, /Q2
Q3, /Q3
LVDS Differential (Outputs): Normally terminated with 100Ω across the pair (Q, /Q). See “LVDS
Outputs” section, Figure 2a. Unused outputs should be terminated with a 100Ω resistor across
each pair.
8
EN
This single-ended TTL/CMOS-compatible input functions as a synchronous output enable. The
synchronous enable ensures that enable/disable will only occur when the outputs are in a logic
LOW state. Note that this input is internally connected to a 25kΩ pull-up resistor and will default
to logic HIGH state (enabled) if left open.
9, 12
/IN, IN
Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs
accept AC- or DC-Coupled differential signs as small as 100mV. Each pin of a pair internally
terminates to a VT pin through 50Ω. Note that these inputs will default to an intermediate state if
left open. Pleae refer to the “Input Interface Applications” section for more details.
10
VREF–AC
Reference Voltage: These outputs bias to VCC–1.4V. They are used when AC coupling the
inputs (IN, /IN). For AC-Coupled applications, connect VREF-AC to VT pin and bypass with
0.01µF low ESR capacitor to VCC. See “Input Interface Applications” section for more details.
Maximum sink/source current is ±1.5mA. Due to the limited drive capability, each VREF-AC pin
is only intended to drive its respective VT pin.
11
VT
Input Termination Center-Tap: Each side of the differential input pair terminates to a VT pin. The
VT pins provide a center-tap to a termination network for maximum interface flexibility. See “Input
Interface Applications” section for more detaiils.
13
GND
Ground. GND pins and exposed pad must be connected to the most negative potential of the
device ground.
7, 14
VCC
Positive Power Supply: Bypass with 0.1µF//0.01µF low ESR capacitors and place as close to
each VCC pin as possible.
TRUTH TABLE
IN
/IN
EN
Q
/Q
0
1
1
0
1
1
0
1
1
0
0
0(1)
1(1)
X
Note 1.
X
On next negative transition of the input signal (IN).
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SY89833L
Micrel, Inc.
Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) .................................. –0.5V to +4.0V
Input Voltage (VIN) ............................... –0.5V to VCC +0.3V
LVDS Output Current (IOUT) ..................................... ±10mA
Input Current
Source or Sink Current on (IN, /IN) .................. ±50mA
VREF-AC Current
Source or Sink Current on (IVT) .......................... ±2mA
Maximum Operating Junction Temperature .............. 125°C
Lead Temperature (Soldering, 20 sec.) ..................... 260°C
Storage Temperature (TS) ....................... –65°C to +150°C
Supply Voltage Range .............................. +3.0V to +3.60V
Ambient Temperature (TA) ......................... –40°C to +85°C
Package Thermal Resistance(3)
MLF® (θJA)
Still-Air ............................................................. 60°C/W
MLF® (ψJB) .......................................................... 33°C/W
DC ELECTRICAL CHARACTERISTICS(4)
TA = –40°C to +85°C, unless otherwise stated.
Symbol
Parameter
VCC
Power Supply Voltage Range
ICC
Power Supply Current
RIN
Input Resistance (IN-to-VT)
RDIFF-IN
Condition
Min
Typ
Max
Units
3.0
3.3
3.6
V
75
100
mA
45
50
55
Ω
Differential Input Resistance
(IN-to-/IN)
90
100
110
Ω
VIH
Input HIGH Voltage
(IN, /IN)
0.1
VCC+0.3
V
VIL
Input LOW Voltage
(IN, /IN)
–0.3
VIH – 0.1
V
VIN
Input Voltage Swing
(IN, /IN)
Note 3, see Figure 2c.
0.1
VCC
V
VDIFF_IN
Differential Input Voltage
Note 3, see Figure 2d.
0.2
|IIN|
Input Current
IN, /IN
VREF–AC
Reference Voltage
No load, max. VCC.
V
45
Note 5
VCC–1.525 VCC–1.425 VCC–1.325
mA
V
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng conditions for extended
periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. ψJB and θJA values
are determined for a 4-layer board in still-air number, unless otherwise stated.
4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5. Due to the internal termination (see "Input Buffer Structure" section) the input current depends on the applied voltages at IN, /IN and VT inputs. Do
not apply a combination of voltages that causes the input current to exceed the maximum limit!
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SY89833L
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LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS(6)
VCC = 3.3V ±10%, RL = 100Ω across the outputs; TA = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
Max
Units
VOUT
Output Voltage Swing
See Figure 2c.
250
325
mV
VDIFF_OUT
Differential Output Voltage Swing
See Figure 2d.
500
650
mV
VOCM
Output Common Mode Voltage
∆VOCM
Change in Common Mode Voltage
1.125
1.275
V
–50
50
mV
Max
Units
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(6)
VCC = 3.3V ±10%, TA = –40°C to +85°C
Symbol
Parameter
Condition
Min
Typ
VIH
Input HIGH Voltage
2.0
VCC
V
VIL
Input LOW Voltage
0
0.8
V
IIH
Input HIGH Current
–125
30
µA
IIL
Input LOW Current
–300
µA
Note:
6. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
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SY89833L
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AC ELECTRICAL CHARACTERISTICS(7)
VCC = +3.3V ±10%; RL = 100Ω across the outputs; TA = –40°C to +85°C unless otherwise stated.
Symbol
Parameter
Condition
Min
fMAX
Maximum Frequency
VOUT ≥ 200mV
2.0
tpd
Propagation Delay
IN-to-Q
VIN < 400mV
400
500
600
ps
IN-to-Q
VIN ≥ 400mV
330
440
530
ps
5
20
ps
200
ps
tSKEW
Within-Device Skew
Note 8
Part-to-Part Skew
Note 9
Typ
Max
Units
GHz
tS
Set-Up Time
EN to IN, /IN
Note 10
300
ps
tH
Hold Time
EN to IN, /IN
Note 10
500
ps
tJITTER
Data
Random Jitter (RJ)
Deterministic Jitter (DJ)
Note 11
Note 12
1
10
psRMS
psPP
Clock
Cycle-to-Cycle Jitter
Total Jitter (TJ)
Note 13
Note 14
1
10
psRMS
psPP
190
ps
tr, tf
Output Rise/Fall Times
(20% to 80%)
At full output swing.
60
110
Notes:
7.
High-frequency AC parameters are guaranteed by design and characterization.
8.
Within device skew is measured between two different outputs under identical input transitions.
9.
Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and no skew at the edges at the respective
inputs.
10. Set-up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous applications,
set-up and hold times do not apply.
11. Random jitter is measured with a K28.7 pattern, measured at ≤fMAX.
12. Deterministic jitter is measured at 2.5Gbps with both K28.5 and 223–1 PRBS pattern.
13. Cycle-to-cycle jitter definition: The variation period between adjacent cycles over a random sample of adjacent cycle pairs. tJITTER_CC = Tn –Tn+1,
where T is the time between rising edges of the output signal.
14. Total jitter definition: with an ideal clock input frequency of ≤ fMAX (device), no more than one output edge in 1012 output edges will deviate by more
than the specified peak-to-peak jitter value.
TIMING DIAGRAM
EN
VCC/2
tS
VCC/2
tH
/IN
IN
VIN
tpd
tpd
/Q
VOUT
Q
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SY89833L
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TYPICAL OPERATING CHARACTERISTICS
VCC = 3.3V, GND = 0V, VIN = 400mV, RL = 100Ω across the outputs, TA = 25°C, unless otherwise stated.
Propagation Delay
vs. Input Voltage Swing
Output Swing
vs. Frequency
600
PROPAGATION DELAY (ps)
350
AMPLITUDE (mV)
300
250
200
150
100
50
0
August 2007
500
400
300
200
100
0
0
0.5
1
1.5
2
FREQUENCY (GHz)
2.5
6
0
200
400
600
800
INPUT VOLTAGE SWING (mV)
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FUNCTIONAL CHARACTERISTICS
VCC = 3.3V, GND = 0V, VIN = 400mV, RL = 100Ω across the outputs; TA = 25°C, unless otherwise stated.
(150mV/div.)
–15mV Offset
622MHz Output
(150mV/div.)
–15mV Offset
155MHz Output
TIME (321.9ps/div.)
TIME (1.29ns/div.)
(150mV/div.)
–10mV Offset
1GHz Output
TIME (200ps/div.)
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INPUT STAGE
VCC
1.86k9
1.86k9
1.86k9
1.86k9
IN
VT
/IN
509
509
GND
Figure 1. Simplified Differential Input Buffer
LVDS OUTPUTS
LVDS specifies a small swing of 325mV typical, on a
nominal 1.20V common mode above ground. The common
mode voltage has tight limits to permit large variations in
ground noise between an LVDS driver and receiver.
50Ω
vOUT
100Ω
vOH, vOL
50Ω
vOH, vOL
GND
GND
Figure 2b. LVDS Common Mode Measurement
Figure 2a. LVDS Differential Measurement
VOUT, VIN
325mV
(typical)
650mV
VDIFF_IN, VDIFF_OUT
Figure 2d. Differential Swing
Figure 2c. Single-Ended Swing
August 2007
vOCM,
∆vOCM
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SY89833L
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INPUT INTERFACE APPLICATIONS
VCC = 3.3V
VCC = 3.3V
VCC = 3.3V
VCC = 3.3V
IN
CML
CML
VCC
/IN
/IN
LVPECL
/IN
SY89833L
SY89833L
NC
VCC = 3.3V
IN
IN
NC
VCC = 3.3V
VT
VT
VREF-AC
VREF-AC
SY89833L
VCC–2V
0.01µF
VT
50Ω
NC
VREF-AC
0.01µF
VCC
Figure 3a. DC-Coupled CML
Input Interface
VCC = 3.3V
VCC = 3.3V
Figure 3b. AC-Coupled CML
Input Interface
VCC = 3.3V
VCC = 3.3V
IN
IN
LVPECL
LVDS
/IN
/IN
SY89833L
Rpd
100Ω
Rpd
100Ω
Figure 3c. DC-Coupled LVPECL
Input Interface
SY89833L
VT
VREF-AC
0.01µF
NC
VT
NC
VREF-AC
VCC
Figure 3d. AC-Coupled LVPECL
Input Interface
Figure 3e. LVDS
Input Interface
RELATED PRODUCT AND SUPPORT DOCUMENTS
Part Number
Function
Data Sheet Link
SY89830U
2.5V/3.3V/5V 2.5GHz 1:4 PECL/ECL
Clock Driver with 2:1 Differential Input MUX
http://www.micrel.com/product-info/products/sy89830u.shtml
SY89831U
Ultra-Precision 1:4 LVPECL Fanout Buffer/
Translator with Internal Termination
http://www.micrel.com/product-info/products/sy89831u.shtml
SY89832U
2.5V Ultra-Precision 1:4 LVDS Fanout Buffer/
Translator with Internal Termination
http://www.micrel.com/product-info/products/sy89832u.shtml
SY89834U
2.5/3.3V Two Input, 1GHz LVTTL/CMOS-to-LVPECL http://www.micrel.com/product-info/products/sy89834u.shtml
1:4 Fanout Buffer/Translator
HBW Solutions
August 2007
16-MLF® Manufacturing Guidelines
Exposed Pad Application Note
http://www.amkor.com/products/notes_papers/MLF_appnote_0301.pdf
New Products and Termination App. Note
http://www.micrel.com/product-info/as/solutions.shtml
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Precision Edge®
SY89833L
Micrel Inc.
16-PIN EPAD MicroLeadFrame® (MLF-16)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heat Dissipation
VEE
Heavy Copper Plane
VEE
Heavy Copper Plane
PCB Thermal Consideration for 16-Pin MLF® Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form.
2. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 474-1000
WEB
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
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