ONSEMI MPSW05G

MPSW05, MPSW06
One Watt Amplifier
Transistors
NPN Silicon
http://onsemi.com
Features
• Pb−Free Packages are Available*
COLLECTOR
3
2
BASE
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
MPSW05
MPSW06
VCEO
60
80
Vdc
Collector −Base Voltage
MPSW05
MPSW06
VCBO
60
80
Vdc
VEBO
4.0
Vdc
Collector Current − Continuous
IC
500
mAdc
Total Device Dissipation @ TA = 25°C
Derate above 25°C
PD
1.0
8.0
W
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD
2.5
20
W
mW/°C
TJ, Tstg
−55 to +150
°C
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
RqJA
125
°C/W
Thermal Resistance, Junction−to−Case
RqJC
50
°C/W
Emitter −Base Voltage
Operating and Storage Junction
Temperature Range
1
EMITTER
1
12
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
2
TO−92 1 WATT
(TO−226)
CASE 29−10
STYLE 1
MPS
W0x
AYWW G
G
x
= 5 or 6
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping†
MPSW05G
TO−92
(Pb−Free)
5000 Units/Bulk
MPSW06G
TO−92
(Pb−Free)
5000 Units/Bulk
TO−92
2000/Tape & Reel
TO−92
(Pb−Free)
2000/Tape & Reel
MPSW06RLRA
MPSW06RLRAG
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2010
August, 2010 − Rev. 4
1
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MPSW05/D
MPSW05, MPSW06
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Max
60
80
−
−
4.0
−
−
−
0.5
0.5
−
−
0.1
0.1
−
0.1
80
60
−
−
−
0.4
−
1.2
50
−
−
12
Unit
OFF CHARACTERISTICS
Collector −Emitter Breakdown Voltage (Note 1)
(IC = 1.0 mAdc, IB = 0)
MPSW05
MPSW06
Emitter −Base Breakdown Voltage
(IE = 100 mAdc, IC = 0)
V(BR)CEO
V(BR)EBO
Collector Cutoff Current
(VCE = 40 Vdc, IB = 0)
(VCE = 60 Vdc, IB = 0)
MPSW05
MPSW06
Collector Cutoff Current
(VCB = 40 Vdc, IE = 0)
(VCB = 60 Vdc, IE = 0)
MPSW05
MPSW06
ICES
ICBO
Emitter Cutoff Current
(VEB = 3.0 Vdc, IC = 0)
IEBO
Vdc
Vdc
mAdc
mAdc
mAdc
ON CHARACTERISTICS (Note 1)
hFE
DC Current Gain
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 250 mAdc, VCE = 1.0 Vdc)
Collector −Emitter Saturation Voltage
(IC = 250 mAdc, IB = 10 mAdc)
VCE(sat)
Base−Emitter Saturation Voltage
(IC = 250 mAdc, VCE = 5.0 Vdc)
VBE(sat)
−
Vdc
Vdc
SMALL−SIGNAL CHARACTERISTICS
fT
Current −Gain − Bandwidth Product
(IC = 200 mAdc, VCE = 5.0 Vdc, f = 20 MHz)
Output Capacitance
(VCB = 10 V, f = 1.0 MHz)
Cobo
MHz
pF
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
400
hFE , DC CURRENT GAIN
TJ = 125°C
VCE = 1.0 V
200
25°C
-55°C
100
80
60
40
0.5
0.7
1.0
2.0
3.0
5.0
7.0
10
20
30
IC, COLLECTOR CURRENT (mA)
Figure 1. DC Current Gain
http://onsemi.com
2
50
70
100
200
300
500
1.0
1.0
TJ = 25°C
TJ = 25°C
0.8
0.8
IC = 10 mA
0.6
50
mA
100 mA
250 mA
V, VOLTAGE (VOLTS)
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
MPSW05, MPSW06
500 mA
0.4
0.2
VBE(sat) @ IC/IB = 10
0.6
VBE(on) @ VCE = 1.0 V
0.4
0.2
VCE(sat) @ IC/IB = 10
0
0.05
0.1
0.2
0.5
2.0
5.0
1.0
IB, BASE CURRENT (mA)
10
20
0
0.5
50
1.0
5.0
10
50
100
20
IC, COLLECTOR CURRENT (mA)
500
80
-0.8
TJ = 25°C
60
-1.2
40
-1.6
θVB for VBE
-2.0
-2.4
Cibo
20
10
8.0
6.0
-2.8
0.5
1.0
2.0
5.0
20
50
10
100
IC, COLLECTOR CURRENT (mA)
200
Cobo
4.0
0.1
500
0.2
0.5 1.0 2.0
5.0 10
20
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Base−Emitter Temperature Coefficient
50
100
Figure 5. Capacitance
300
200
VCE = 2.0 V
TJ = 25°C
IC, COLLECTOR CURRENT (mA)
f,
T CURRENT-GAIN — BANDWIDTH PRODUCT (MHz)
200
Figure 3. “On” Voltages
C, CAPACITANCE (pF)
θ VB, TEMPERATURE COEFFICIENT (mV/°C)
Figure 2. Collector Saturation Region
2.0
100
70
50
DUTY CYCLE ≤ 10%
2k
1.0 ms
1k
100 ms
500
TA = 25°C
200
100
50
20
30
2.0
3.0
5.0 7.0 10
20 30
50 70 100
IC, COLLECTOR CURRENT (mA)
10
1.0
200
Figure 6. Current−Gain − Bandwidth Product
TC = 25°C
1.0 s
dc
dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSW05
MPSW06
2.0
5.0
10
20
60 80 100
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 7. Active Region − Safe Operating Area
http://onsemi.com
3
MPSW05, MPSW06
PACKAGE DIMENSIONS
TO−92 (TO−226) 1 WATT
CASE 29−10
ISSUE O
A
B
R
STRAIGHT LEAD
BULK PACK
P
L
F
K
D
X X
G
J
H
V
C
SECTION X−X
N
1
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN DIMENSIONS P
AND L. DIMENSIONS D AND J APPLY BETWEEN DI­
MENSIONS L AND K MINIMUM. THE LEAD
DIMENSIONS ARE UNCONTROLLED IN DIMENSION
P AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.290
0.310
0.125
0.165
0.018
0.021
0.016
0.019
0.045
0.055
0.095
0.105
0.018
0.024
0.500
--0.250
--0.080
0.105
--0.100
0.135
--0.135
---
MILLIMETERS
MIN
MAX
4.44
5.21
7.37
7.87
3.18
4.19
0.46
0.53
0.41
0.48
1.15
1.39
2.42
2.66
0.46
0.61
12.70
--6.35
--2.04
2.66
--2.54
3.43
--3.43
---
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
A
BENT LEAD
TAPE & REEL
AMMO PACK
R
B
P
T
SEATING
PLANE
G
K
D
X X
J
V
1
C
N
SECTION X−X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN DIMENSIONS P
AND L. DIMENSIONS D AND J APPLY BETWEEN
DIMENSIONS L AND K MINIMUM. THE LEAD
DIMENSIONS ARE UNCONTROLLED IN DIMENSION
P AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
J
K
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.290
0.310
0.125
0.165
0.018
0.021
0.094
0.102
0.018
0.024
0.500
--0.080
0.105
--0.100
0.135
--0.135
---
MILLIMETERS
MIN
MAX
4.44
5.21
7.37
7.87
3.18
4.19
0.46
0.53
2.40
2.80
0.46
0.61
12.70
--2.04
2.66
--2.54
3.43
--3.43
---
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MPSW05/D