MICROCHIP TC4428AVPA

TC4426A/TC4427A/TC4428A
1.5A Dual High-Speed Power MOSFET Drivers
Features:
General Description:
• High Peak Output Current – 1.5A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 18V
• High Capacitive Load Drive Capability – 1000 pF
in 25 ns (typ.)
• Short Delay Times – 30 ns (typ.)
• Matched Rise, Fall and Delay Times
• Low Supply Current:
- With Logic ‘1’ Input – 1 mA (typ.)
- With Logic ‘0’ Input – 100 μA (typ.)
• Low Output Impedance – 7Ω (typ.)
• Latch-Up Protected: Will Withstand 0.5A Reverse
Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected – 4 kV
• Pin-compatible with TC426/TC427/TC428 and
TC4426/TC4427/TC4428
• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN
Packages
The TC4426A/TC4427A/TC4428A are improved
versions of the earlier TC4426/TC4427/TC4428 family
of MOSFET drivers. In addition to matched rise and fall
times, the TC4426A/TC4427A/TC4428A devices have
matched leading and falling edge propagation delay
times.
These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
4 kV.
The TC4426A/TC4427A/TC4428A MOSFET drivers
can
easily
charge/discharge
1000 pF
gate
capacitances in under 30 ns. These devices provide
low enough impedances in both the on and off states to
ensure the MOSFET’s intended state will not be
affected, even by large transients.
Applications:
• Switch Mode Power Supplies
• Line Drivers
• Pulse Transformer Drive
Package Types
8-Pin MSOP/
PDIP/SOIC TC4426A TC4427A TC4428A
NC
IN A
GND
IN B
1
8 NC
2 TC4426A 7 OUT A
3 TC4427A 6 VDD
4 TC4428A 5 OUT B
NC
OUT A
VDD
OUT B
NC
OUT A
VDD
OUT B
8-Pin DFN(1) TC4426A TC4427A TC4428A
NC 1
IN A 2
GND 3
TC4426A
TC4427A
TC4428A
IN B 4
8
NC
NC
NC
7
OUT A
OUT A
OUT A
6
VDD
VDD
VDD
5
OUT B
OUT B
OUT B
Note 1: Exposed pad of the DFN package is electrically isolated.
© 2006 Microchip Technology Inc.
DS21423F-page 1
TC4426A/TC4427A/TC4428A
Functional Block Diagram
Inverting
VDD
500 μA
300 mV
Output
Non-Inverting
Input
Effective
Input C = 12 pF
(Each Input)
GND
4.7V
TC4426A/TC4427A/TC4428A
Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting
drivers. The TC4428A has one inverting and one non-inverting driver.
2: Ground any unused driver input.
DS21423F-page 2
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated
in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Absolute Maximum Ratings†
Supply Voltage ..................................................... +22V
Input Voltage, IN A or IN B
..................................... (VDD + 0.3V) to (GND – 5V)
Package Power Dissipation (TA ≤ 70°C)
DFN .............................................................. Note 2
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Logic ‘1’, High Input Voltage
VIH
2.4
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
–1.0
–10
—
—
+1.0
+10
μA
High Output Voltage
VOH
VDD – 0.025
—
—
V
DC Test
Low Output Voltage
VOL
—
—
0.025
V
DC Test
Output Resistance
RO
—
—
—
—
7
7
8
8
9
10
11
12
Ω
IOUT = 10 mA, VDD = 18V, TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +125°C
Peak Output Current
IPK
—
1.5
—
A
VDD = 18V
Latch-Up Protection
Withstand Reverse Current
IREV
—
> 0.5
—
A
Duty cycle ≤ 2%, t ≤ 300 μsec
VDD = 18V
Rise Time
tR
—
—
—
—
25
27
29
30
35
40
40
40
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +125°C, Figure 4-1
Fall Time
tF
—
—
—
—
25
27
29
30
35
40
40
40
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +125°C, Figure 4-1
Delay Time
tD1
—
—
—
—
30
33
35
38
35
40
45
50
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +125°C, Figure 4-1
Delay Time
tD2
—
—
—
—
30
33
35
38
35
40
45
50
ns
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
-40°C ≤ TA ≤ +125°C, Figure 4-1
IS
—
—
1.0
0.1
2.0
0.2
mA
VIN = 3V (Both inputs)
VIN = 0V (Both inputs), VDD = 18V
Input
0V ≤ VIN ≤ VDD
Output
Switching Time (Note 1)
Power Supply
Power Supply Current
Note 1:
2:
Switching times ensured by design.
Package power dissipation is dependent on the copper pad area on the PCB.
© 2006 Microchip Technology Inc.
DS21423F-page 3
TC4426A/TC4427A/TC4428A
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges
Specified Temperature Range (C)
TA
0
—
+70
°C
Specified Temperature Range (E)
TA
-40
—
+85
°C
Specified Temperature Range (V)
TA
-40
—
+125
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Storage Temperature Range
TA
-65
—
+150
°C
Package Thermal Resistances
Thermal Resistance, 8L-6x5 DFN
θJA
—
33.2
—
°C/W
Thermal Resistance, 8L-MSOP
θJA
—
206
—
°C/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
°C/W
Thermal Resistance, 8L-SOIC
θJA
—
155
—
°C/W
DS21423F-page 4
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
100
CL = 1500 pF
CL = 1000 pF
CL = 470 pF
60
40
0
5.0
7.5
10.0
FIGURE 2-1:
Voltage.
12.5
VDD (V)
17.5
Rise Time vs. Supply
10.0
FIGURE 2-4:
Voltage.
12.5
VDD (V)
15.0
17.5
Fall Time vs. Supply
60
tD1
100
90
80
70
60
50
40
30
20
15.0
CL = 1000 pF
VDD = 10V
55
Delay Time (nsec)
110
Delay Time (nsec)
40
CL= 100pF
CL = 100 pF
0
5.0
7.5
CL = 100 pF
tD2
CL = 1000 pF
tD1
50
45
tD2
40
35
30
25
20
1
2
3
FIGURE 2-2:
Amplitude.
4
5
6
7
Input Amplitude (V)
8
0
9
Delay Time vs. Input
5
FIGURE 2-5:
Supply Voltage.
10
VDD (V)
15
20
Propagation Delay Time vs.
40
28
CL = 1000 pF
VDD = 18V
Delay Time (nsec)
Time (nsec)
CL = 1500 pF
CL = 1000 pF
CL = 470 pF
60
20
20
26
TA = +25°C
CL == 2200
2200pF
C
pF
L
80
tFALL (nsec)
tRISE (nsec)
80
100
TA = +25°C
CL = 2200 pF
24
22
20
18
16
14
-100
tRISE
tFALL
-50
0
50
100
150
35
CL = 1000 pF
VDD = 18V
30
25
tD2
20
tD1
15
-100
TEMPERATURE (°C)
FIGURE 2-3:
Temperature.
Rise and Fall Times vs.
© 2006 Microchip Technology Inc.
-50
0
50
100
150
TEMPERATURE (°C)
FIGURE 2-6:
Temperature.
Propagation Delay Time vs.
DS21423F-page 5
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
30
30
TA = +125°C
25
RDS(ON) (Ω)
RDS(ON) (Ω)
25
20
TA = +25°C
15
10
15
TA = +25°C
10
5
5
0
0
5
FIGURE 2-7:
Resistance.
60
10
VDD (V)
15
20
High-State Output
CL = 2200 pF
50
40
FIGURE 2-10:
Resistance.
60
CL = 1500 pF
CL = 1000 pF
VDD = 18V
CL = 100 pF
30
20
10
VDD (V)
5
0
15
20
Low-State Output
2 MHz
VDD = 18V
900 kHz
50
ISUPPLY (mA)
0
ISUPPLY (mA)
TA = +125°C
20
40
600 kHz
30
20
200 kHz
10
10
0
0
20 kHz
0
500
1000
1500
2000
0
2500
500
FREQUENCY (kHz)
80
FIGURE 2-11:
Capacitive Load.
CL = 1500 pF
50
CL = 1000 pF
40
30
CL = 100 pF
20
40
2000
2500
600 kHz
20
0
1500
900 kHz
30
10
1000
2 MHz
50
0
500
200 kHz
20 kHz
0
500
FREQUENCY (kHz)
FIGURE 2-9:
Frequency.
DS21423F-page 6
Supply Current vs.
Supply Current vs.
60
10
0
2500
VDD = 12V
70
60
2000
80
CL = 2200 pF
VDD = 12V
70
ISUPPLY (mA)
Supply Current vs.
ISUPPLY (mA)
FIGURE 2-8:
Frequency.
1000
1500
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
1000
1500
CLOAD (pF)
2000
2500
Supply Current vs.
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.
40
40
VDD = 6V
CL = 2200 pF
30
CL = 1500 pF
25
CL = 1000 pF
20
15
CL = 100 pF
10
VDD = 6V
35
ISUPPLY (mA)
ISUPPLY (mA)
35
5
0
2 MHz
30
25
20
900 kHz
15
600 kHz
10
200 kHz
20 kHz
5
0
0
500
1000
1500
2000
0
2500
500
FREQUENCY (kHz)
Supply Current vs.
900
800 BOTH INPUTS = 1
700
600
FIGURE 2-15:
Capacitive Load.
IQUIESCENT (µA)
IQUIESCENT (µA)
FIGURE 2-13:
Frequency.
TA = 25°C
500
400
300
200
BOTH INPUTS = 0
100
0
0
5
10
15
20
Quiescent Supply Current
© 2006 Microchip Technology Inc.
1500
CLOAD (pF)
2000
2500
Supply Current vs.
1100
1000
900 BOTH INPUTS = 1
800
700
600
500
400
300
200 BOTH INPUTS = 0
100
0
-100
-50
0
VDD = 18V
50
100
150
TEMPERATURE (°C)
VDD (V)
FIGURE 2-14:
vs. Voltage.
1000
FIGURE 2-16:
vs. Temperature.
Quiescent Supply Current
DS21423F-page 7
TC4426A/TC4427A/TC4428A
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
8-Pin PDIP/
MSOP/SOIC
8-Pin
DFN
1
1
NC
No connection
2
2
IN A
Input A
3
3
GND
Ground
4
4
IN B
Input B
5
5
OUT B
6
6
VDD
7
7
OUT A
8
8
NC
No connection
PAD
NC
Exposed Metal Pad
—
Note 1:
3.1
Symbol
Description
Output B
Supply input
Output A
Duplicate pins must be connected for proper operation.
Inputs A and B
MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching, even when
the rise and fall time of the input signal is very slow.
3.2
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 18V, with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven.
Ground (GND)
The ground pin is the return path for both the bias
current and the high peak current that discharges the
external load capacitance. The ground pin should be
tied into a ground plane or have a very short trace to the
bias supply source return.
3.3
3.4
3.5
Exposed Metal Pad
The exposed metal pad of the 6x5 DFN package is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.
Output A and B
MOSFET driver outputs A and B are low-impedance,
CMOS push-pull style outputs. The pull-down and pullup devices are of equal strength, making the rise and
fall times equivalent.
DS21423F-page 8
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
4.0
APPLICATIONS INFORMATION
+5V
90%
Input
VDD = 18V
0V
4.7 μF
0.1 μF
Input
tD1
7
VDD
tR
90%
90%
Output
5
10%
10%
0V
Inverting Driver
(TC4426A, 1/2 TC4428A)
CL = 1000 pF
4
tD2
tF
Output
6
2
10%
+5V
90%
Input
3
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 ns
0V
VDD
10%
tD190%
tR
Output
0V
10%
90%
tD2
tF
10%
Non-Inverting Driver
(TC4427A, 1/2 TC4428A)
FIGURE 4-1:
Switching Time Test Circuit.
© 2006 Microchip Technology Inc.
DS21423F-page 9
TC4426A/TC4427A/TC4428A
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead DFN
Example:
XXXXXXX
XXXXXXX
XXYYWW
NNN
TC4426A
EMF
0420
256
Example:
8-Lead MSOP
4426AE
420256
XXXXX
YWWNNN
8-Lead PDIP (300 mil)
Example:
XXXXXXXX
XXXXXNNN
YYWW
TC4427A
EPA256
0420
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
XXXXYYWW
NNN
Legend:
Note:
*
XX...X
YY
WW
NNN
TC4428A
COA0420
256
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code).
DS21423F-page 10
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated
© 2006 Microchip Technology Inc.
DS21423F-page 11
TC4426A/TC4427A/TC4428A
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
α
A2
A
c
φ
A1
(F)
L
β
Units
Dimension Limits
n
p
MIN
INCHES
NOM
8
.026 BSC
.033
.193 TYP.
.118 BSC
.118 BSC
.024
.037 REF
.006
.012
-
MAX
MILLIMETERS*
NOM
8
0.65 BSC
0.75
0.85
0.00
4.90 BSC
3.00 BSC
3.00 BSC
0.40
0.60
0.95 REF
0°
0.08
0.22
5°
5°
-
MIN
Number of Pins
Pitch
A
.043
Overall Height
A2
.030
.037
Molded Package Thickness
.000
.006
A1
Standoff
E
Overall Width
E1
Molded Package Width
D
Overall Length
L
.016
.031
Foot Length
Footprint (Reference)
F
φ
Foot Angle
0°
8°
c
Lead Thickness
.003
.009
.009
.016
Lead Width
B
α
Mold Draft Angle Top
5°
15°
β
5°
15°
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
MAX
1.10
0.95
0.15
0.80
8°
0.23
0.40
15°
15°
JEDEC Equivalent: MO-187
Drawing No. C04-111
DS21423F-page 12
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
INCHES*
NOM
8
.100
.155
.130
MAX
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MAX
Number of Pins
Pitch
Top to Seating Plane
A
.140
.170
4.32
Molded Package Thickness
A2
.115
.145
3.68
Base to Seating Plane
A1
.015
Shoulder to Shoulder Width
E
.300
.313
.325
8.26
Molded Package Width
E1
.240
.250
.260
6.60
Overall Length
D
.360
.373
.385
9.78
Tip to Seating Plane
L
.125
.130
.135
3.43
c
Lead Thickness
.008
.012
.015
0.38
Upper Lead Width
B1
.045
.058
.070
1.78
Lower Lead Width
B
.014
.018
.022
0.56
Overall Row Spacing
§
eB
.310
.370
.430
10.92
α
Mold Draft Angle Top
5
10
15
15
β
Mold Draft Angle Bottom
5
10
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
© 2006 Microchip Technology Inc.
MIN
MIN
DS21423F-page 13
TC4426A/TC4427A/TC4428A
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MAX
Number of Pins
Pitch
Overall Height
A
.053
.069
1.75
Molded Package Thickness
A2
.052
.061
1.55
Standoff
§
A1
.004
.010
0.25
Overall Width
E
.228
.244
6.20
Molded Package Width
E1
.146
.157
3.99
Overall Length
D
.189
.197
5.00
Chamfer Distance
h
.010
.020
0.51
Foot Length
L
.019
.030
0.76
φ
Foot Angle
0
8
8
c
Lead Thickness
.008
.010
0.25
Lead Width
B
.013
.020
0.51
α
Mold Draft Angle Top
0
15
15
β
Mold Draft Angle Bottom
0
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
DS21423F-page 14
MIN
A1
MIN
© 2006 Microchip Technology Inc.
TC4426A/TC4427A/TC4428A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
Temperature
Range
XX
XXX
X
Package
Tape & Reel
PB Free
Device:
TC4426A: 1.5A Dual MOSFET Driver, Inverting
TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428A: 1.5A Dual MOSFET Driver, Complementary
Temperature Range:
C
E
V
Package:
MF
= Dual, Flat, No-Lead (6X5 mm Body), 8-lead
MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)
= 0°C to +70°C (PDIP & SOIC Only)
= -40°C to +85°C
= -40ºC to +125°C
Examples:
a) TC4426ACOA:
1.5A Dual Inverting
MOSFET driver,
0°C to +70°C,
8LD SOIC package.
b) TC4426AEOA:
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD SOIC package.
c) TC4426AEMF:
1.5A Dual Inverting
MOSFET driver,
-40°C to +85°C,
8LD DFN package.
a) TC4427ACPA:
1.5A Dual Non-Inverting
MOSFET driver,
0°C to +70°C,
8LD PDIP package.
b) TC4427AEPA:
1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
c) TC4427AVMF713: 1.5A Dual Non-Inverting
MOSFET driver,
-40°C to +125°C,
8LD DFN package,
Tape and Reel.
a) TC4428AEPA:
1.5A Dual Complementary
MOSFET driver,
-40°C to +85°C,
8LD PDIP package.
b) TC4428ACOA713: 1.5A Dual Complementary
MOSFET driver,
0°C to +70°C
8LD SOIC package,
Tape and Reel.
c) TC4428AVMF:
1.5A Dual Complementary
MOSFET driver,
-40°C to +125°C,
8LD DFN package.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
© 2006 Microchip Technology Inc.
DS21423F-page 15
TC4426A/TC4427A/TC4428A
NOTES:
DS21423F-page 16
© 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, Real ICE, rfLAB, rfPICDEM, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and Zena are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2006, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2006 Microchip Technology Inc.
DS21423F-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Fax: 91-80-2229-0062
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Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
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Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
Austria - Wels
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
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Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
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Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
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Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
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Tel: 81-45-471- 6166
Fax: 81-45-471-6122
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
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Tel: 852-2401-1200
Fax: 852-2401-3431
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Fax: 82-54-473-4302
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Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
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Tel: 86-757-2839-5507
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Fax: 86-27-5980-5118
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Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
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Tel: 60-4-646-8870
Fax: 60-4-646-5086
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
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Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
10/31/05
DS21423F-page 18
© 2006 Microchip Technology Inc.