FUJITSU SEMICONDUCTOR DATA SHEET DS04-29117-1E Spread Spectrum Clock Generator MB88152 ■ DESCRIPTION MB88152 is a clock generator for EMI reduction. The peak of unnecessary radiation noise (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with the internal modulator. It corresponds to both of the center spread which modulates input frequency as Middle Centered and down spread which modulates so as not to exceed input frequency. ■ FEATURES • • • • • • • • • • Input frequency : 20 MHz to 134 MHz Output frequency : 20 MHz to 134 MHz Modulation rate : ± 0.5%, ± 1.5% (Center spread), − 1.0%, − 3.0% (Down spread) Equipped with crystal oscillation circuit: Range of oscillation 20 MHz to 48 MHz Modulation clock output Duty : 40% to 60% Modulation clock Cycle-Cycle Jitter : Less than 100 ps Low current consumption by CMOS process : 5 mA@24 MHz (Typ-sample, no load) Power supply voltage : 3.3 V ± 0.3 V Operating temperature : − 40 °C to +85 °C Package : SOP 8 pin ■ PACKAGE 8-pin plastic SOP (FPT-8P-M02) MB88152 ■ PRODUCT LINE-UP MB88152 has three kinds of input frequency, and two kinds of modulation type (center/down spread), total six lineups. Product Function MB88152-100 Frequency range from 20 MHz to 134 MHz, Down spread, No enable setting MB88152-101 Frequency range from 20 MHz to 67 MHz, Down spread, No modulation enable pin MB88152-102 Frequency range from 40 MHz to 133 MHz, Down spread, Enable setting MB88152-110 Frequency range from 20 MHz to 134 MHz, Center spread, No modulation enable pin MB88152-111 Frequency range from 20 MHz to 67 MHz, Center spread, Enable setting MB88152-112 Frequency range from 40 MHz to 133 MHz, Center spread, Enable setting ■ PIN ASSIGNMENT XIN 1 XOUT 2 8 XENS XIN 1 7 FREQ XOUT 2 8 FREQ1 7 FREQ0 MB88152 MB88152 VSS 3 6 VDD VSS 3 6 VDD SEL 4 5 CKOUT SEL 4 5 CKOUT MB88152-101, MB88152-102, MB88152-111, MB88152-112 MB88152-100, MB88152-110 ■ PIN DESCRIPTION 2 Pin name I/O Pin no. Description XIN I 1 Crystal resonator connection Pin/clock input pin XOUT O 2 Crystal resonator connection Pin VSS 3 GND Pin SEL I 4 Modulation rate setting pin CKOUT O 5 Modulated clock output pin VDD 6 Power supply voltage pin FREQ/FREQ0 I 7 Frequency setting pin XENS/FREQ1 I 8 Modulation enable setting pin/frequency setting pin MB88152 ■ I/O CIRCUIT TYPE Pin Circuit type Remarks • CMOS hysteresis input SEL FREQ FREQ0 FREQ1 XENS • CMOS output • IOL = 4 mA CKOUT Note : For XIN and XOUT pins, see “■CRYSTAL OSCILLATION CIRCUIT”. 3 MB88152 ■ HANDLING DEVICES Preventing Latchup A latchup can occur if, on a CMOS IC, a voltage higher than VDD or a voltage lower than VSS is applied to an input or output pin2 or a voltage higher than the rating is applied between VDD and VSS. A latchup, if it occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use a CMOS IC, be very careful not to exceed the maximum rating. Handling unused pins Do not leave an unused input pin open, since it may cause a malfunction. Handle by, for example, using a pullup or pull-down resistor. The attention when the external clock is used Input the clock to XIN, and don’t connect anything with XOUT you use the external clock. And please pay attention so that an overshoot and an undershoot do not occur to an input clock of XIN. Power supply pins Please connecting to the power supply terminal of this device by as lower impedance as possible from the current supply source. We recommend connecting electrolytic capacitor (about 10 µF) and the ceramic capacitor (about 0.01 µF) in parallel between VSS and VDD near the device, as a by - pass capacitor. Crystal Oscillator Circuit Noise near the XIN or XOUT pin may cause the device to malfunction. Design printed circuit boards so that electric wiring of XIN and XOUT and crystal resonator (or ceramic resonator) don’t intersect other wiring. It is strongly recommended that printed circuit board artwork that surrounds the XIN and XOUT pins with ground be used to increase the expectation of stable operation. 4 MB88152 ■ BLOCK DIAGRAM VDD SEL Modulation rate setting Frequency setting PLL block 20 MHz to 134 MHz down/center spread FREQ/FREQ0 XENS/FREQ1 XOUT Modulation enable / freaquency setting Clock output CKOUT Reference clock Rf = 1 MΩ XIN VSS 1 − M Phase compare Reference clock C.P. 1 − N 1 − L V/I convertion IDAC Modulation clock output Loop filter MB88152 PLL block ICO Modulation logic Modulation rate setting SEL XENS 5 MB88152 ■ PIN SETTING When changing the pin setting, the stabilization wait time for the modulation clock is required. The stabilization wait time for the modilation clock takes the maximum value of Lock-Up time in “■ ELECTRICAL CHARACTERISTICS”. Modulation enable setting XENS Modulation 0 Modulation enable 1 Modulation disable MB88152-101, 102, 111, 112 Note : MB88152-100 and 110 do not have XENS pin. SEL modulation rate setting SEL 0 1 Modulation rate Remarks ± 0.5% MB88152-110, 111, 112 Center spread − 1.0% MB88152-100, 101, 102 Down spread ± 1.5% MB88152-110, 111, 112 Center spread − 3.0% MB88152-100, 101, 102 Down spread Note : The modulation rate can be changed at the level of the terminal. Frequency setting FREQ Frequency 0 1 20 MHz to 40 MHz MB88152-101, 111 40 MHz to 80 MHz MB88152-102, 112 33 MHz to 67 MHz MB88152-101, 111 66 MHz to 134 MHz MB88152-102, 112 Note : MB88152-100 and 110 do not have FREQ pin. frequency setting FREQ1 FREQ0 Frequency 0 0 20 MHz to 40 MHz 0 1 33 MHz to 67 MHz 1 0 40 MHz to 80 MHz 1 1 66 MHz to 134 MHz Note : MB88152-101, 111, 102 and 112 have neither FREQ0 pin nor FREQ1 pin. 6 MB88152-100, 110 MB88152 • Center spread Spectrum is spreaded (modulated) by centering on the input frequency. 3.0% Radiation level −1.5% +1.5% Frequency Center spread example of ± 1.5% (3.0%) Input frequency • Down spread Spectrum is spreaded (modulated) below the input frequency. 3.0% Radiation level −3.0% Input frequency Frequency Down spread example of − 3.0% 7 MB88152 ■ ABSOLUTE MAXIMUM RATINGS (VSS = 0.0 V) Parameter Rating Symbol Unit Min Max VDD − 0.5 + 4.0 V Input voltage VI VSS − 0.5 VDD + 0.5 V Output voltage VO VSS − 0.5 VDD + 0.5 V Storage temperature TST − 55 + 125 °C Operation junction temperature TJ − 40 + 125 °C Output voltage IO − 14 + 14 mA Overshoot VDD + 1.0 (within 50 ns) V Undershoot VSS − 1.0 (within 50 ns) V Power supply voltage WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. ■ RECOMMENDED OPERATING CONDITIONS Parameter Symbol Pin Conditions Power supply voltage VDD VDD VIH SEL FREQ/FREQ0, XENS/FREQ1 “H” level input voltage XIN “L” level input voltage VIL SEL FREQ/FREQ0, XENS/FREQ1 XIN Input clock [Duty Cycle] TDCI XIN Operating temperature Ta Value Unit Min Typ Max 3.0 3.3 3.6 V VDD × 0.80 VDD + 0.3 V 20 MHz to 100 MHz VDD × 0.80 VDD + 0.3 V 100 MHz to 134 MHz VDD × 0.90 VDD + 0.3 V VSS VDD × 0.20 V 20 MHz to 100 MHz VSS VDD + 0.20 V 100 MHz to 134 MHz VSS VDD + 0.10 V 20 MHz to 100 MHz 40 50 60 100 MHz to 134 MHz 45 50 55 −40 + 85 % °C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand. 8 MB88152 ■ ELECTRICAL CHARACTERISTICS (Ta = + 25 °C, VDD = 3.3V) Symbol Pin Conditions Power supply current ICC VDD Crystal oscillation frequency fx XIN, XOUT Parameter Input frequency Output frequency fin fOUT XIN CKOUT VOH CKOUT Output voltage VOL Value Unit Min Typ Max 24 MHz output No load capacitance 5.0 7.0 Basic wave oscillation 20 40 3rd over tone 40 48 MB88152-100, 110 20 134 MB88152-101, 111 20 67 MB88152-102, 112 40 134 MB88152-100, 110 20 134 MB88152-101, 111 20 67 MB88152-102, 112 40 134 H level output IOH = − 4 mA VDD − 0.5 VDD V L level output IOL = 4 mA VSS 0.4 V mA MHz MHz MHz Output through rate SR CKOUT 0.4 V to 2.4 V 0.4 4.0 V/ns Output high impedance ZO CKOUT 20 MHz to 134 MHz 45 Ω Output clock Duty Cycle TDCC CKOUT 1.5 V 40 60 % CIN XIN SEL FREQ/ FREQ0 XENS/ FREQ1 Ta = + 25 °C VDD = VI = 0.0 V f = 1 MHz 16 pF 20 MHz to 67 MHz 15 67 MHz to 100 MHz 10 100 MHz to 134 MHz 7 Input capacitance Load capacitance CL CKOUT pF FMOD CKOUT 12.5 kHz Lock-Up time TLK CKOUT 2 5 ms Cycle-cycle jitter TJC CKOUT No load capacitance 100 ps Modulation cycle 9 MB88152 ■ CRYSTAL OSCILLATOR CIRCUIT The left side of figures below shows the connection example about general crystal resonator. The oscillation circuit has the built-in feedback resistanc (1 MΩ). The value of cpacity (C1 and C2) is required adjusting to the most suitable value of an individual crystal resonator. The right side of figures below shows the example of connecting crystal for the 3rd over-tone oscillation. The value of capacity (C1, C2 and C3) and inductance (L1) is needed adjusting to the most suitable value of an individual crystal oscillator. When an external clock is used (the crystal resonator is not used) , input the clock to XIN pin and do not connect anything with XOUT. Internal Rf (1 MΩ) Rf (1 MΩ) XIN Pin XOUT Pin XIN Pin XOUT Pin External L1 C2 C1 C2 C1 C3 Normal crystal oscillation 3rd over tone ■ DEFINITION OF JITTER • Cycle-cycle jitter Output clock TJC = |tn − tn + 1| tn tn + 1 Cycle - cycle jitter is defined the difference between a certain cycle and immediately after (or, immediately before). 10 MB88152 ■ INTERCONNECTION CIRCUIT EXAMPLE XENS/FREQ1 1 8 2 7 FREQ/FREQ0 MB88152 C1 C2 SEL C1, C2 C3 C4 R1 3 6 4 5 + C4 C3 R1 : oscillation stabilization capacitance (see "■ CRYSTAL OSCILLATOR CIRCUIT”) : Ta condenser or electrolytic capacitor of 10 µF or higher : laminated ceramic capacitor about 0.01 µF (connect to close to this device) : impedance matching resistor for board pattern 11 MB88152 ■ ORDERING INFORMATION Part number 12 Frequency Spread XENS MB88152PNF-G-100-JNE1 20 MHz to 134 MHz Down No MB88152PNF-G-101-JNE1 20 MHz to 67 MHz Down Yes MB88152PNF-G-102-JNE1 40 MHz to 134 MHz Down Yes MB88152PNF-G-110-JNE1 20 MHz to 134 MHz Center No MB88152PNF-G-111-JNE1 20 MHz to 67 MHz Center Yes MB88152PNF-G-112-JNE1 40 MHz to 134 MHz Center Yes MB88152PNF-G-100-JN-EFE1 20 MHz to 134 MHz Down No MB88152PNF-G-101-JN-EFE1 20 MHz to 67 MHz Down Yes MB88152PNF-G-102-JN-EFE1 40 MHz to 134 MHz Down Yes MB88152PNF-G-110-JN-EFE1 20 MHz to 134 MHz Center No MB88152PNF-G-111-JN-EFE1 20 MHz to 67 MHz Center Yes MB88152PNF-G-112-JN-EFE1 40 MHz to 134 MHz Center Yes MB88152PNF-G-100-JN-ERE1 20 MHz to 134 MHz Down No MB88152PNF-G-101-JN-ERE1 20 MHz to 67 MHz Down Yes MB88152PNF-G-102-JN-ERE1 40 MHz to 134 MHz Down Yes MB88152PNF-G-110-JN-ERE1 20 MHz to 134 MHz Center No MB88152PNF-G-111-JN-ERE1 20 MHz to 67 MHz Center Yes MB88152PNF-G-112-JN-ERE1 40 MHz to 134 MHz Center Yes Package Remarks 8-pin plastic SOP (FPT-8P-M02) 8-pin plastic SOP (FPT-8P-M02) Embos taping (EF type) 8-pin plastic SOP (FPT-8P-M02) Embos taping (ER type) MB88152 ■ PACKAGE DIMENSION Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. 8-pin plastic SOP (FPT-8P-M02) +0.25 +.010 +0.03 *1 5.05 –0.20 .199 –.008 0.22 –0.07 +.001 .009 –.003 8 5 *2 3.90±0.30 6.00±0.40 (.154±.012) (.236±.016) Details of "A" part 45˚ 1.55±0.20 (Mounting height) (.061±.008) 0.25(.010) 0.40(.016) 1 "A" 4 1.27(.050) 0.44±0.08 (.017±.003) 0.13(.005) 0~8˚ M 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.15±0.10 (.006±.004) (Stand off) 0.10(.004) C 2002 FUJITSU LIMITED F08004S-c-4-7 Dimensions in mm (inches). Note : The values in parentheses are reference values. 13 MB88152 FUJITSU LIMITED All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. 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