FUJITSU MICROELECTRONICS DATA SHEET DS04-29128-1Ea Spread Spectrum Clock Generator MB88153A MB88153A-100/101/110/111 ■ DESCRIPTION MB88153A is a clock generator for EMI (Electro Magnetic Interference) reduction. The peak of unnecessary (EMI) can be attenuated by making the oscillation frequency slightly modulate periodically with the internal modulator. It corresponds to both of the center spread which modulates input frequency as Middle Centered and down spread which modulates so as not to exceed input frequency. ■ FEATURE • • • • • • • • • • Power down pin : 10 µA (Typ-sample) consumption current at power down Input frequency : 16.6 MHz to 134 MHz Output frequency : 16.6 MHz to 134 MHz (One-fold input frequency) Modulation rate can select from ± 0.5%, ± 1.5% − 1.0% or − 3.0%. (For center spread / down spread.) Modulation clock output Duty : 40% to 60% Modulation clock Cycle-Cycle Jitter : Less than 100 ps Low current consumption by CMOS process : 4.0 mA (24 MHz : Typ-sample, no load) Power supply voltage : 3.3 V ± 0.3 V Operating temperature : − 40 °C to +85 °C Package : 8-pin SOP Copyright©2007-2008 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2007.6 MB88153A ■ PRODUCT LINEUP MB88153A has four kinds of modulation rate and modulation type (center spread/down spread). Product Modulation rate Modulation type MB88153A-100 −1.0% MB88153A-101 −3.0% MB88153A-110 ±0.5% MB88153A-111 ±1.5% Down spread Center spread ■ PIN ASSIGNMENT TOP VIEW CKIN 1 VDD 2 8 XPD MB88153A VSS 3 7 FREQ0 6 FREQ1 CKOUT 4 5 ENS FPT-8P-M02 ■ PIN DESCRIPTION 2 Pin name I/O Pin no. Description CKIN I 1 Clock input pin VDD 2 Power supply voltage pin VSS 3 GND pin CKOUT O 4 Modulated clock output pin “L” output at power down ENS I 5 Modulation enable setting pin FREQ1 I 6 Frequency setting pin FREQ0 I 7 Frequency setting pin (with pull-up resistor) XPD I 8 Power down pin (with pull-up resistor) Power down at “L” input MB88153A ■ I/O CIRCUIT TYPE Pin Circuit type Remarks CMOS hysteresis input CKIN, ENS, FREQ1 CMOS hysteresis input with pull-up resistor 50 kΩ (Typ) 50 kΩ FREQ0 CMOS hysteresis input with 50 kΩ + 800 kΩ (Typ) pull-up resistors 50 kΩ 800 kΩ Note : If “L” is input to XPD when the XPD function is selected, 50 kΩ pull-up resistor is disconnected. XPD (Continued) 3 MB88153A (Continued) Pin Circuit type Remarks • CMOS output • “L” output at power down CKOUT 4 MB88153A ■ HANDLING DEVICES Preventing Latch-up A latch-up can occur if, on this device, (a) a voltage higher than VDD or a voltage lower than VSS is applied to an input or output pin or (b) a voltage higher than the rating is applied between VDD pin and VSS pin. The latch-up, if it occurs, significantly increases the power supply current and may cause thermal destruction of an element. When you use this device, be very careful not to exceed the maximum rating. Handling unused pins Do not leave an unused input pin open, since it may cause a malfunction. Handle by, using a pull-up or pull-down resistor. Unused output pin should be opened. Power supply pins Please design connecting the power supply pin of this device by as low impedance as possible from the current supply source. We recommend connecting electrolytic capacitor (about 10 µF) and the ceramic capacitor (about 0.01 µF) in parallel between VSS pin and VDD pin near the device, as a bypass capacitor. Clock I/O circuit Noise near the CKIN pin may cause the device to malfunction. Design the printed circuit board so that the wiring for the clock input does not intersect any other wiring. Please pay attention so that an overshoot and an undershoot do not occur to an input clock of CKIN pin. Design the printed circuit board that surrounds the CKIN and CKOUT pins with ground. 5 MB88153A ■ BLOCK DIAGRAM VDD 2 Power down XPD 8 FREQ0 7 Frequency setting Frequency setting FREQ1 PLL block 6 Modulation clock output 4 CKOUT Modulation enable setting ENS 5 CKIN 1 Clock input 3 VSS Frequency setting 1 − M Phase compare Reference clock Charge pump V/I conversion IDAC 1 − N ICO Modulation clock output Loop filter 1 − L Modulation logic Modulation rate setting/ Modulation enable setting MB88153A PLL block A glitchless IDAC (current output D/A converter) provides precise modulation, thereby dramatically reducing EMI. 6 MB88153A ■ PIN SETTING When changing the pin setting, the stabilization wait time for the modulation clock required. The stabilization wait time for the modulation clock takes the maximum value of Lock-Up time in “■ ELECTRICAL CHARACTERISTICS • AC Characteristics”. ENS modulation enable setting ENS Modulation L No modulation H Modulation Note : Spectrum does not spread when “L” is set to ENS. The clock with low jitter can be obtained. FREQ0, FREQ1 frequency setting FREQ0 FREQ1 Input frequency range L L 16.6 MHz to 40 MHz L H 66 MHz to 134 MHz H L 33 MHz to 67 MHz H H 40 MHz to 80 MHz Note : It is set according to the frequency of the clock input to the device. Set FREQ0 pin to “H” for the pin opened because FREQ0 pin has pull-up resistor. XPD power down setting XPD Power down L Power down H Normal operation Note : When “L” is set to XPD pin, the power down operation is implemented and “L” is output to CKOUT pin. When “H” is input to XPD pin or XPD pin is opened, normal operation is implemented because the XPD pin has pull-up resistor. 7 MB88153A • Center spread Spectrum is spread (modulated) by centering on the input frequency. 3.0% modulation width Radiation level −1.5% +1.5% Frequency Input frequency Center spread example of ± 1.5% modulation rate • Down spread Spectrum is spread (modulated) below the input frequency. 3.0% modulation width Radiation level −3.0% Frequency Input frequency Down spread example of − 3.0% modulation rate 8 MB88153A ■ ABSOLUTE MAXIMUM RATINGS Parameter Rating Symbol Unit Min Max VDD − 0.5 + 4.0 V Input voltage* VI VSS − 0.5 VDD + 0.5 V Output voltage* VO VSS − 0.5 VDD + 0.5 V Storage temperature TST − 55 + 125 °C Operation junction temperature TJ − 40 + 125 °C Output current IO − 14 + 14 mA Overshoot VIOVER VDD + 1.0 (tOVER ≤ 50 ns) V Undershoot VIUNDER VSS − 1.0 (tUNDER ≤ 50 ns) V Power supply voltage* * : The parameter is based on VSS = 0.0 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Overshoot/Undershoot tUNDER ≤ 50 ns VIOVER ≤ VDD + 1.0 V VDD Input pin VSS tOVER ≤ 50 ns VIUNDER ≤ VSS − 1.0 V 9 MB88153A ■ RECOMMENDED OPERATING CONDITIONS (VSS = 0.0 V) Symbol Pin Conditions Power supply voltage VDD VDD “H” level input voltage VIH “L” level input voltage Parameter Value Unit Min Typ Max 3.0 3.3 3.6 V CKIN, ENS, FREQ0, FREQ1, XPD VDD × 0.8 VDD + 0.3 V VIL CKIN, ENS, FREQ0, FREQ1, XPD VSS VDD × 0.2 V Input clock duty cycle tDCI CKIN 16.6 MHz to 134 MHz 40 50 60 % Operating temperature Ta − 40 + 85 °C WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. Input clock duty cycle (tDCI = tb/ta) ta tb CKIN 10 1.5 V MB88153A ■ ELECTRICAL CHARACTERISTICS • DC Characteristics (Ta = − 40 °C to + 85 °C, VDD = 3.3 V ± 0.3 V, VSS = 0.0 V) Parameter Symbol Pin VOH CKOUT VOL CKOUT ZO Input capacitance CIN Load capacitance CL Value Unit Min Typ Max “H” level output IOH = − 4 mA VDD − 0.5 VDD V “L” level output IOL = 4 mA VSS 0.4 V CKOUT 16.6 MHz to 134 MHz 45 Ω CKIN, ENS, Ta = + 25 °C, FREQ0, VDD = VI = 0.0 V, FREQ1, f = 1 MHz XPD 16 pF 16.6 MHz to 67 MHz 15 CKOUT 67 MHz to 100 MHz 10 7 25 50 200 500 800 1200 Output voltage Output impedance Conditions 100 MHz to 134 MHz pF RPUE FREQ0 RPUP XPD Power supply current ICC VDD No load capacitance at 24 MHz output 4.0 6.0 mA Power down current Ipd VDD Input clock stopping 10 µA Input Pull-up resistance VIL = 0.0 V kΩ • AC Characteristics (Ta = − 40 °C to + 85 °C, VDD = 3.3 V ± 0.3 V, VSS = 0.0 V) Parameter Symbol Pin Conditions fin CKIN Output frequency fOUT CKOUT Output slew rate SR CKOUT Output clock duty cycle tDCC CKOUT 1.5 V Input frequency Modulation frequency (Number of input clocks per modulation) fMOD (nMOD) Value Unit Min Typ Max 16.6 134 MHz 16.6 134 MHz 0.4 4.0 V/ns 40 60 % Load capacitance 15 pF 0.4 V to 2.4 V FREQ[1 : 0] = (00) fin/2640 fin/2280 fin/1920 (2640) (2280) (1920) FREQ[1 : 0] = (10) fin/4400 fin/3800 fin/3200 (4400) (3800) (3200) FREQ[1 : 0] = (11) fin/5280 fin/4560 fin/3840 (5280) (4560) (3840) FREQ[1 : 0] = (01) fin/8800 fin/7600 fin/6400 (8800) (7600) (6400) CKOUT kHz (clks) (Continued) 11 MB88153A (Continued) Parameter (Ta = − 40 °C to + 85 °C, VDD = 3.3 V ± 0.3 V, VSS = 0.0 V) Value Symbol Pin Conditions Lock-up time tLK CKOUT Cycle-cycle jitter tJC No load capacitance, CKOUT Ta = + 25 °C, VDD = 3.3 V Min Typ Max 16.6 MHz to 80 MHz 2 5 80 MHz to 134 MHz 3 8 100 Unit ms ps-rms Note : The modulation clock stabilization wait time is required after the power is turned on, the IC recovers from power saving, or after FREQ (frequency range) or ENS (modulation ON/OFF) setting is changed. For the modulation clock stabilization wait time, assign the maximum value for lock-up time. <Definition of modulation frequency and number of input clocks per modulation> f (Output frequency) Modulation wave form t fMOD (Min) Clock count nMOD (Max) fMOD (Max) Clock count nMOD (Min) t MB88153A contains the modulation period to realize the efficient EMI reduction. The modulation period fMOD depends on the input frequency and changes between fMOD (Min) and fMOD (Max) . Furthermore, the average value of fMOD equals the typical value of the electrical characteristics. 12 MB88153A ■ OUTPUT CLOCK DUTY CYCLE (tDCC = tb/ta) ta tb 1.5 V CKOUT ■ INPUT FREQUENCY (fin = 1/tin) tin 0.8 VDD CKIN ■ OUTPUT SLEW RATE (SR) 2.4 V 0.4 V CKOUT tr tf Note : SR = (2.4−0.4) /tr, SR = (2.4−0.4) /tf ■ CYCLE-CYCLE JITTER CKOUT tn tn+1 Note : Cycle-cycle jitter is defined the difference between a certain cycle and immediately after (or, immediately before) . 13 MB88153A ■ MODULATION WAVE FORM • ±1.5% modulation rate, Example of center spread CKOUT output frequency + 1.5 % Frequency at modulation OFF Time − 1.5 % fMOD • −1.0% modulation rate, Example of down spread CKOUT output frequency Frequency at modulation OFF Time − 0.5 % − 1.0 % fMOD 14 MB88153A ■ LOCK-UP TIME VDD 3.0 V External clock stabilization wait time CKIN XPD Setting pin FREQ0, FREQ1, ENS VIH VIH tLK (lock-up time ) CKOUT If the XPD pin is fixed at the “H” level, the maximum time after the power is turned on until the set clock signal is output from CKOUT pin is (the stabilization wait time of input clock to CKIN pin) + (the lock-up time “tLK”). For the input clock stabilization time, check the characteristics of the resonator or oscillator used. VDD 3.0 V External clock stabilization wait time CKIN VIH XPD Setting pin FREQ0, FREQ1, ENS VIH tLK (lock-up time ) CKOUT When XPD pin controls the power-down, stable clock is output from CKOUT pin after becoming XPD pin = “H” level (in the maximum after lock-Up time (tLK) ). (Continued) 15 MB88153A (Continued) CKIN VIH XPD ENS VIH VIL tLK (lock-up time ) tLK (lock-up time ) CKOUT When ENS pin is controlled for enable modulation, it is necessary for the stably clock output from CKOUT pin to wait lock-up time (tLK) . Note : In the following cases, it is necessary for the stably clock output from CKOUT pin, to wait lock-up time (tLK) . - After releasing power-down - When you change other terminal settings Output frequency, output clock duty cycle, modulation frequency, and cycle-cycle jitter are not guaranteed until the output clock is stable. It is recommended to take procedure to release of reset after. lock-up time (tLK) on the device using the modulation clock or etc. 16 MB88153A ■ INTERCONNECTION CIRCUIT EXAMPLE CKIN VDD + C1 R1 VSS 1 8 2 7 MB88153A 3 6 4 CKOUT 5 C2 XPD FREQ0 FREQ1 ENS C1 : Capacitor of 10 µF or higher C2 : Capacitor of approximately 0.01 µF (connect a capacitor of good high frequency property (ex. laminated ceramic capacitor) to close to this device) R1 : Impedance matching resistor for a circuit on a board 17 MB88153A ■ SPECTRUM EXAMPLE CHARACTERISTICS The condition of the examples of the characteristic is shown as follows: Input frequency = 20 MHz (Output frequency = 20 MHz), use for MB88153A-111. Power-supply voltage = 3.3 V, None load capacity. Modulation rate = ± 1.5% (center spread). Spectrum analyzer HP4396B is connected with CKOUT. The result of the measurement with RBW = 1 kHz (ATT use for −6 dB) . CH B Spectrum 10 dB /REF 0 dBm No modulation −8.86 dBm Avg 4 ±1.5% modulation −26.54 dBm RBW# 1 kHZ VBW 1 kHZ CENTER 20 MHZ 18 ATT 6 dB SWP 2.505 s SPAN 4 MHZ MB88153A ■ ORDERING INFORMATION Part number Modulation rate Modulation type MB88153APNF-G-100-JNE1 −1.0% Down spread MB88153APNF-G-101-JNE1 −3.0% Down spread MB88153APNF-G-110-JNE1 ±0.5% Center spread MB88153APNF-G-111-JNE1 ±1.5% Center spread MB88153APNF-G-100-JNEFE1 −1.0% Down spread MB88153APNF-G-101-JNEFE1 −3.0% Down spread MB88153APNF-G-110-JNEFE1 ±0.5% Center spread MB88153APNF-G-111-JNEFE1 ±1.5% Center spread MB88153APNF-G-100-JNERE1 −1.0% Down spread MB88153APNF-G-101-JNERE1 −3.0% Down spread MB88153APNF-G-110-JNERE1 ±0.5% Center spread MB88153APNF-G-111-JNERE1 ±1.5% Center spread Package Remarks 8-pin plastic SOP (FPT-8P-M02) 8-pin plastic SOP Emboss taping (FPT-8P-M02) (EF type) 8-pin plastic SOP Emboss taping (FPT-8P-M02) (ER type) 19 MB88153A ■ PACKAGE DIMENSION 8-pin plastic SOP Lead pitch 1.27 mm Package width × package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight 0.06 g (FPT-8P-M02) 8-pin plastic SOP (FPT-8P-M02) +0.25 Note 1) *1 : These dimensions include resin protrusion. Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder. +.010 +0.03 *1 5.05 –0.20 .199 –.008 0.22 –0.07 +.001 .009 –.003 8 5 *2 3.90±0.30 6.00±0.40 (.154±.012) (.236±.016) Details of "A" part 45˚ 1.55±0.20 (Mounting height) (.061±.008) 0.25(.010) 0.40(.016) 1 "A" 4 1.27(.050) 0.44±0.08 (.017±.003) 0.13(.005) 0~8˚ M 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.15±0.10 (.006±.004) (Stand off) 0.10(.004) C 2002 FUJITSU LIMITED F08004S-c-4-7 Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/ 20 Dimensions in mm (inches). Note: The values in parentheses are reference values. MB88153A MEMO 21 MB88153A MEMO 22 MB88153A MEMO 23 FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE LTD. 151 Lorong Chuan, #05-08 New Tech Park, Singapore 556741 Tel: +65-6281-0770 Fax: +65-6281-0220 http://www.fujitsu.com/sg/services/micro/semiconductor/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm.3102, Bund Center, No.222 Yan An Road(E), Shanghai 200002, China Tel: +86-21-6335-1560 Fax: +86-21-6335-1605 http://cn.fujitsu.com/fmc/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 KOSMO TOWER, 1002 Daechi-Dong, Kangnam-Gu,Seoul 135-280 Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://www.fmk.fujitsu.com/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road Tsimshatsui, Kowloon Hong Kong Tel: +852-2377-0226 Fax: +852-2376-3269 http://cn.fujitsu.com/fmc/tw All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. 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