SS26 Surface Mount Schottky Power Rectifier SMB Power Surface Mount Package . . . employing the Schottky Barrier principle in a metal−to−silicon power rectifier. Features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. http://onsemi.com SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES 60 VOLTS Features • • • • • Compact Package with J−Bend Leads Ideal for Automated Handling Highly Stable Oxide Passivated Junction Guardring for Overvoltage Protection Low Forward Voltage Drop Pb−Free Package is Available Mechanical Characteristics: • • • • • • • • • Case: Molded Epoxy Epoxy Meets UL 94, V−O at 0.125 in Weight: 95 mg (approximately) Cathode Polarity Band Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds Available in 12 mm Tape, 2500 Units per 13″ Reel, Add “T3” Suffix to Part Number Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable ESD Ratings: Human Body Model = 3B Machine Model = C Marking: SS26 SMB CASE 403A PLASTIC MARKING DIAGRAM SS26 SS26 = Device Code MAXIMUM RATINGS Rating ORDERING INFORMATION Symbol Value Unit VRRM VRWM VR 60 V IO 2.0 A SS26T3G Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 40 A Storage/Operating Case Temperature Tstg, TC −55 to +150 °C †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. TJ −55 to +150 °C dv/dt 10,000 V/ms Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (At Rated VR, TL = 95°C) Operating Junction Temperature Voltage Rate of Change (Rated VR, TJ = 25°C) Device SS26T3 Package Shipping † SMB 2500 / Tape & Reel SMB (Pb−Free) 2500 / Tape & Reel Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Semiconductor Components Industries, LLC, 2005 February, 2005 − Rev. 2 1 Publication Order Number: SS26/D SS26 THERMAL CHARACTERISTICS Characteristic Symbol Value Unit RqJL RqJA 24 80 °C/W Thermal Resistance − Junction−to−Lead (Note 1) Thermal Resistance − Junction−to−Ambient (Note 2) 1. Mounted with minimum recommended pad size, PC Board FR4. 2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. ELECTRICAL CHARACTERISTICS Value Characteristic Maximum Instantaneous Forward Voltage (Note 3) Symbol TJ = 25°C TJ = 125°C Unit vF 0.51 0.63 0.475 0.55 V IR 0.2 10 mA (iF = 1.0 A) (iF = 2.0 A) Maximum Instantaneous Reverse Current (Note 3) (VR = 60 V) 3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%. 10 IF, INSTANTANEOUS FORWARD CURRENT (A) IF, INSTANTANEOUS FORWARD CURRENT (A) 10 75°C 125°C 25°C 1 0.1 0.1 0.2 0.3 0.4 0.5 0.6 0.7 25°C 1 0.1 0.8 75°C 125°C 0.1 0.2 0.3 0.4 0.5 0.6 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 1.0E−02 0.8 100 IR, REVERSE CURRENT (A) 125°C 25°C f = 1 MHz C, CAPACITANCE (pF) 1.0E−03 75°C 1.0E−04 1.0E−05 25°C 1.0E−06 1.0E−07 0.7 VF, INSTANTANEOUS FORWARD VOLTAGE (V) 0 10 20 30 40 50 60 10 0 10 20 30 40 VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current Figure 4. Typical Capacitance http://onsemi.com 2 50 60 RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED) RT, TRANSIENT THERMAL RESISTANCE (NORMALIZED) 3.5 PFO, AVERAGE POWER DISSIPATION (W) IF, AVERAGE FORWARD CURRENT (A) SS26 dc 3 2.5 2 SQUARE WAVE 1.5 1 0.5 0 60 70 80 90 100 110 120 130 2 1.8 1.6 dc 1.4 1.2 1 SQUARE WAVE 0.8 0.6 0.4 0.2 0 0 0.5 1 1.5 2.5 2 TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (A) Figure 5. Current Derating − Junction to Lead Figure 6. Forward Power Dissipation 3 1.0E+00 50% 20% 1.0E−01 10% 5.0% 1.0E−02 2.0% 1.0% 1.0E−03 Rtjl(t) = Rtjl*r(t) 1.0E−04 1.0E+00 1.0E−01 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10 100 1000 t, TIME (s) Figure 7. Thermal Response − Junction to Case 50% 20% 10% 5.0% 1.0E−02 2.0% 1.0E−03 1.0% 1.0E−04 0.00001 Rtjl(t) = Rtjl*r(t) 0.0001 0.001 0.01 0.1 1.0 t, TIME (s) Figure 8. Thermal Response − Junction to Ambient http://onsemi.com 3 SS26 PACKAGE DIMENSIONS SMB PLASTIC PACKAGE CASE 403A−03 ISSUE D S A D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. B INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 C K P MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 H J SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Phone: 81−3−5773−3850 Email: [email protected] http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. SS26/D