STGB8NC60K - STGD8NC60K STGP8NC60K N-channel 600V - 8A - D2PAK / DPAK / TO-220 Short circuit rated PowerMESH™ IGBT Features Type VCES VCE(sat)Typ @25°C IC @100°C STGB8NC60K 600V 2.2V 8A STGD8NC60K 600V 2.2V 8A STGP8NC60K 600V 2.2V 8A ■ Lower on voltage drop (Vcesat) ■ Lower CRES / CIES ratio (no cross-conduction susceptibility) ■ Very soft ultra fast recovery antiparallel diode ■ Short circuit withstand time 10µs Applications 3 1 3 1 High frequency motor controls ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers DPAK TO-220 3 1 D²PAK Figure 1. ■ 2 Internal schematic diagram Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “K” identifies a family optimized for high frequency motor control applications with short circuit withstand capability. Table 1. Device summary Order codes Marking Package Packaging STGB8NC60K GB8NC60K D²PAK Tape & reel STGD8NC60K GD8NC60K DPAK Tape & reel STGP8NC60K GP8NC60K TO-220 Tube October 2007 Rev 1 1/17 www.st.com 17 Contents STGB8NC60K - STGD8NC60K - STGP8NC60K Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/17 ................................................ 9 STGB8NC60K - STGD8NC60K - STGP8NC60K 1 Electrical ratings Electrical ratings Table 2. Absolute maximum ratings Value Symbol Parameter Unit D²PAK/TO-220 DPAK VCES Collector-emitter voltage (VGS = 0) 600 V IC(1) Collector current (continuous) at TC = 25°C 15 A IC(1) Collector current (continuous) at TC = 100°C 8 A ICP(2) Pulsed collector current 30 A VGE Gate-emitter voltage ±20 V PTOT Total dissipation at TC = 25°C Tj Tscw 65 Operating junction temperature 62 W – 55 to 150 °C 10 µs Short circuit withstand time 1. Calculated according to the iterative formula: T –T JMAX C I ( T ) = ----------------------------------------------------------------------------------------------------C C R × V (T , I ) THJ – C CESAT ( MAX ) C C 2. Pulse width limited by max junction temperature Table 3. Symbol Rthj-case Rthj-amb Thermal resistance Parameter Value Unit TO-220 / D²PAK 1.9 °C/W DPAK 2.0 °C/W 62.5 °C/W Thermal resistance junction-case max Thermal resistance junction-ambient Max 3/17 Electrical characteristics 2 STGB8NC60K - STGD8NC60K - STGP8NC60K Electrical characteristics (TCASE=25°C unless otherwise specified) Table 4. Symbol Parameter VBR(CES) Collector-emitter breakdown voltage VCE(sat) Collector-emitter saturation VGE= 15V, IC=3A voltage VGE= 15V, IC= 3A, Tc= 125°C VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA ICES Collector cut-off current (VGE = 0) VCE= Max rating,TC= 25°C IGES gfs Table 5. Symbol Cies Coes Cres Qg Qge Qgc 4/17 Static Test conditions IC= 1mA, VGE= 0 Min. Typ. Max. 600 Unit V 2.2 1.8 2.75 V V 6.5 V VCE=Max rating,TC= 125°C 150 1 µA mA Gate-emitter leakage current (VCE = 0) VGE= ±20V, VCE= 0 ±100 nA Forward transconductance VCE = 15V, IC= 3A 4.5 15 S Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Total gate charge Gate-emitter charge Gate-collector charge Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 3A, VGE = 15V, (see Figure 18) Min. Typ. Max. Unit 380 46 8.5 pF pF pF 19 5 9 nC nC nC STGB8NC60K - STGD8NC60K - STGP8NC60K Table 6. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Table 7. Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets Electrical characteristics Switching on/off (inductive load) Parameter Turn-on delay time Current rise time Turn-on current slope Turn-on delay time Current rise time Turn-on current slope Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions Min. VCC = 390V, IC = 3A RG= 10Ω, VGE= 15V, Tj= 25°C (see Figure 19) VCC = 390V, IC =3A RG= 10Ω, VGE= 15V, Tj=125°C (see Figure 19) Vcc = 390V, IC = 3A, RGE = 10Ω, VGE =15V, TJ=25°C (see Figure 19) Vcc = 390V, IC = 3A, RGE=10Ω, VGE =15V, Tj=125°C (see Figure 19) Typ. Max. Unit 17 6 655 ns ns A/µs 16.5 6.5 575 ns ns A/µs 33 72 82 ns ns ns 60 106 136 ns ns ns Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 390V, IC = 3A RG= 10Ω, VGE=15V, Tj=25°C (see Figure 19) VCC = 390V, IC = 3A RG= 10Ω, VGE= 15V, Tj= 125°C (see Figure 19) Min. Typ. Max. Unit 55 85 140 µJ µJ µJ 87 162 249 µJ µJ µJ 1. Eon is the turn-on losses when a typical diode is used in the test circuit in figure 2. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current 5/17 Electrical characteristics STGB8NC60K - STGD8NC60K - STGP8NC60K 2.1 Electrical characteristics (curves) Figure 2. Output characteristics Figure 3. Transfer characteristics Figure 4. Transconductance Figure 5. Collector-emitter on voltage vs temperature Figure 6. Gate charge vs gate-source voltage Figure 7. 6/17 Capacitance variations STGB8NC60K - STGD8NC60K - STGP8NC60K Figure 8. Normalized gate threshold voltage vs temperature Figure 10. Normalized breakdown voltage vs temperature Electrical characteristics Figure 9. Collector-emitter on voltage vs collector current Figure 11. Switching losses vs temperature Figure 12. Switching losses vs gate resistance Figure 13. Switching losses vs collector current 7/17 Electrical characteristics Figure 14. Thermal impedance for TO-220/ D²PAK Figure 16. Thermal impedance for DPAK 8/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Figure 15. Turn-off SOA STGB8NC60K - STGD8NC60K - STGP8NC60K 3 Test circuit Test circuit Figure 17. Test circuit for inductive load switching Figure 18. Gate charge test circuit Figure 19. Switching waveform Figure 20. Diode recovery time waveform 9/17 Package mechanical data 4 STGB8NC60K - STGD8NC60K - STGP8NC60K Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Package mechanical data TO-220 mechanical data mm inch Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 ∅P Q Typ 4.40 0.61 1.14 0.49 15.25 Max Min 4.60 0.88 1.70 0.70 15.75 0.173 0.024 0.044 0.019 0.6 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 Max 0.181 0.034 0.066 0.027 0.62 0.050 16.40 28.90 3.75 2.65 Typ 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 3.85 2.95 0.147 0.104 0.151 0.116 11/17 Package mechanical data STGB8NC60K - STGD8NC60K - STGP8NC60K DPAK MECHANICAL DATA mm. inch DIM. MAX. MIN. A A1 A2 B b4 MIN. 2.2 0.9 0.03 0.64 5.2 2.4 1.1 0.23 0.9 5.4 0.086 0.035 0.001 0.025 0.204 0.094 0.043 0.009 0.035 0.212 C C2 D D1 E E1 0.45 0.48 6 0.6 0.6 6.2 0.017 0.019 0.236 0.023 0.023 0.244 6.6 0.252 e e1 H L (L1) L2 L4 R V2 TYP 5.1 6.4 0.090 4.6 10.1 0.173 0.368 0.039 2.8 0.8 0.181 0.397 0.110 0.031 1 0.023 0.2 0° 0.260 0.185 2.28 0.6 MAX. 0.200 4.7 4.4 9.35 1 TYP. 0.039 0.008 8° 0° 8° 0068772-F 12/17 STGB8NC60K - STGD8NC60K - STGP8NC60K Package mechanical data D²PAK mechanical data mm inch Dim Min A A1 A2 B B2 C C2 D D1 E E1 G L L2 L3 M R V2 Typ 4.4 2.49 0.03 0.7 1.14 0.45 1.23 8.95 Max Min 4.6 2.69 0.23 0.93 1.7 0.6 1.36 9.35 0.173 0.098 0.001 0.027 0.044 0.017 0.048 0.352 10.4 0.393 8 10 0.181 0.106 0.009 0.036 0.067 0.023 0.053 0.368 0.409 0.334 5.28 15.85 1.4 1.75 3.2 0.4 0° Max 0.315 8.5 4.88 15 1.27 1.4 2.4 Typ 0.192 0.590 0.50 0.055 0.094 0.208 0.625 0.55 0.68 0.126 0.015 4° 13/17 Packaging mechanical data 5 STGB8NC60K - STGD8NC60K - STGP8NC60K Packaging mechanical data D2PAK FOOTPRINT TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 24.4 N 100 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. MIN. A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626 D 1.5 1.6 0.059 0.063 D1 1.59 1.61 0.062 0.063 E 1.65 1.85 0.065 0.073 F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082 MAX. R 50 1.574 T 0.25 0.35 0.0098 0.0137 W 23.7 24.3 * on sales type 14/17 inch 0.933 0.956 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 26.4 0.960 1.039 0.059 0795 3.937 30.4 1.197 BASE QTY BULK QTY 1000 1000 STGB8NC60K - STGD8NC60K - STGP8NC60K Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 16.4 N 50 T TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 D 1.5 D1 1.5 E 1.65 MIN. 12.1 0.476 1.6 0.059 0.063 1.85 0.065 0.073 7.4 7.6 0.291 0.299 2.55 2.75 0.100 0.108 0.153 0.161 P0 3.9 4.1 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 40 15.7 MAX. 330 12.992 13.2 0.504 0.520 18.4 0.645 0.724 0.059 0.795 1.968 22.4 0.881 BASE QTY BULK QTY 2500 2500 0.059 F R MIN. MAX. K0 W inch MAX. 1.574 16.3 0.618 0.641 15/17 Revision history 6 STGB8NC60K - STGD8NC60K - STGP8NC60K Revision history Table 8. 16/17 Document revision history Date Revision 02-Oct-2007 1 Changes First release STGB8NC60K - STGD8NC60K - STGP8NC60K Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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