STGD6NC60H N-channel 600V - 7A - DPAK Very fast PowerMESH™ IGBT General features ■ ■ ■ Type VCES VCE(sat)Max @25°C IC @100°C STGD6NC60H 600V <2.5V 7A Low on voltage drop (Vcesat) 3 1 Low CRES / CIES ratio (no cross-conduction susceptibility) DPAK High frequency operation Description Using the latest high voltage technology based on a patented strip layout, STMicroelectronics has designed an advanced family of IGBTs, the PowerMESH™ IGBTs, with outstanding performances. The suffix “H” identifies a family optimized for high frequency application in order to achieve very high switching performances (reduced tfall) manta in ing a low voltage drop. Internal schematic diagram Applications ■ High frequency inverters ■ SMPS and PFC in both hard switch and resonant topologies ■ Motor drivers Order code Part number Marking Package Packaging STGD6NC60HT4 GD6NC60H DPAK Tape & reel February 2007 Rev 3 1/14 www.st.com 14 Contents STGD6NC60H Contents 1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................. 6 3 Test circuit 4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2/14 ................................................ 9 STGD6NC60H 1 Electrical ratings Electrical ratings Table 1. Symbol Absolute maximum ratings Parameter Value Unit VCES Collector-emitter voltage (VGS = 0) 600 V IC(1) Collector current (continuous) at TC = 25°C 15 A IC(1) Collector current (continuous) at TC = 100°C 7 A Collector current (pulsed) 21 A VGE Gate-emitter voltage ±20 V PTOT Total dissipation at TC = 25°C 56 W Tstg Storage temperature – 55 to 150 °C 300 °C Value Unit 2 °C/W 62.5 °C/W ICM(2) Tj Operating junction temperature Tl Maximum lead temperature for soldering purpose (for 10sec. 1.6 mm from case) 1. Calculated according to the iterative formula:: T –T JMAX C I ( T ) = -----------------------------------------------------------------------------------------------------C C R × V (T , I ) THJ – C CESAT ( MAX ) C C 2. Pulse width limited by max junction temperature Table 2. Symbol Thermal resistance Parameter Rthj-case Thermal resistance junction-case max Rthj-amb Thermal resistance junction-ambient max 3/14 Electrical characteristics 2 STGD6NC60H Electrical characteristics (TCASE=25°C unless otherwise specified) Table 3. Symbol Parameter VBR(CES) Collector-emitter breakdown voltage VCE(sat) Collector-emitter saturation VGE= 15V, IC= 3A voltage VGE= 15V, IC= 3A, Tc= 125°C VGE(th) Gate threshold voltage VCE= VGE, IC= 250 µA ICES Collector cut-off current (VGE = 0) VCE= Max rating,TC= 25°C IGES Gate-emitter leakage current (VCE = 0) VGE= ±20V, VCE= 0 Forward transconductance VCE = 15V, IC= 3A gfs Table 4. Symbol Cies Coes Cres Qg Test conditions IC= 1mA, VGE= 0 Min. Typ. Max. 600 Unit V 1.9 1.7 3.75 VCE=Max rating,TC= 125°C 2.5 V V 5.75 V 10 1 µA mA ±100 nA 3 S Dynamic Parameter Input capacitance Output capacitance Reverse transfer capacitance Test conditions VCE = 25V, f = 1MHz, VGE = 0 VCE = 390V, IC = 3A, Qgc Total gate charge Gate-emitter charge Gate-collector charge ICL Turn-off SOA minimum current Vclamp=390V, Tj=150°C, RG=10Ω, VGE=15V Qge 4/14 Static VGE = 15V, (see Figure 16) Min. Typ. Max. Unit 205 32 5.5 pF pF pF 13.6 3.4 5.1 nC nC nC 19 A STGD6NC60H Electrical characteristics Table 5. Symbol td(on) tr (di/dt)on td(on) tr (di/dt)on tr(Voff) td(off) tf tr(Voff) td(off) tf Table 6. Symbol Eon(1) Eoff(2) Ets Eon(1) Eoff(2) Ets Switching on/off (inductive load) Parameter Turn-on delay time Current rise time Turn-on current slope Turn-on delay time Current rise time Turn-on current slope Off voltage rise time Turn-off delay time Current fall time Off voltage rise time Turn-off delay time Current fall time Test conditions Min. VCC = 390V, IC = 3A RG= 10Ω, VGE= 15V, Tj= 25°C (see Figure 17) VCC = 390V, IC = 3A RG= 10Ω, VGE= 15V, Tj=125°C (see Figure 17) VCC = 390V, IC = 3A, RGE = 10Ω, VGE = 15V,TJ=25°C (see Figure 17) VCC = 390V, IC = 3A, RGE=10Ω, VGE =15V, Tj=125°C (see Figure 17) Typ. Max. Unit 12 5 612 ns ns A/µs 13 4.3 560 ns ns A/µs 40 76 100 ns ns ns 60 98 124 ns ns ns Switching energy (inductive load) Parameter Turn-on switching losses Turn-off switching losses Total switching losses Turn-on switching losses Turn-off switching losses Total switching losses Test conditions VCC = 390V, IC = 3A RG= 10Ω, VGE=15V, Tj=25°C (see Figure 17) VCC = 390V, IC = 3A RG= 10Ω, VGE= 15V, Tj= 125°C (see Figure 17) Min. Typ. Max. Unit 20 68 88 µJ µJ µJ 37 93 130 µJ µJ µJ 1. Eon is the tun-on losses when a typical diode is used in the test circuit in Figure 17. If the IGBT is offered in a package with a co-pak diode, the co-pack diode is used as external diode. IGBTs & Diode are at the same temperature (25°C and 125°C) 2. Turn-off losses include also the tail of the collector current 5/14 Electrical characteristics STGD6NC60H 2.1 Electrical characteristics (curves) Figure 1. Output characteristics Figure 2. Transfer characteristics Figure 3. Transconductance Figure 4. Collector-emitter on voltage vs temperature Figure 5. Gate charge vs gate-source voltage Figure 6. 6/14 Capacitance variations STGD6NC60H Electrical characteristics Figure 7. Normalized gate threshold voltage vs temperature Figure 8. Collector-emitter on voltage vs collector current Figure 9. Normalized breakdown voltage vs temperature Figure 10. Switching losses vs temperature Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector current 7/14 Electrical characteristics Figure 13. Thermal impedance 8/14 STGD6NC60H Figure 14. Turn-off SOA STGD6NC60H 3 Test circuit Test circuit Figure 15. Test circuit for inductive load switching Figure 16. Gate charge test circuit Figure 17. Switching waveform Figure 18. Diode recovery time waveform 9/14 Package mechanical data 4 STGD6NC60H Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 10/14 STGD6NC60H Package mechanical data TO-252 (DPAK) MECHANICAL DATA mm DIM. MIN. TYP. inch MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 0.260 E 6.40 6.60 0.252 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 1.00 0.024 L2 L4 V2 0.8 0.60 0 o 0.031 8 o 0 o 0.039 0o P032P_B 11/14 Packaging mechanical data 5 STGD6NC60H Packaging mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. mm MIN. A B 1.5 C 12.8 D 20.2 G 16.4 N 50 T TAPE MECHANICAL DATA DIM. mm MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 D 12/14 inch 1.5 D1 1.5 E 1.65 MIN. MAX. 12.1 0.476 1.6 0.059 0.063 1.85 0.065 0.073 0.059 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 0.153 0.161 P0 3.9 4.1 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 W 15.7 1.574 16.3 0.618 0.641 inch MAX. MIN. MAX. 330 12.992 13.2 0.504 0.520 18.4 0.645 0.724 0.059 0.795 1.968 22.4 0.881 BASE QTY BULK QTY 2500 2500 STGD6NC60H 6 Revision history Revision history Table 7. Revision history Date Revision Changes 14-Jun-2005 1 First Release 07-Mar-2006 2 Complete version 08-Feb-2007 3 The document has been reformatted 13/14 STGD6NC60H Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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