PRODUCT SPECIFICATION 0.8mm PITCH MINI PCI EXPRESS CONNECTOR REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 1 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 1.0 SCOPE……………………………………………………………………………………………………3 2.0 APPLICABLE DOCUMET…………………………………………………………………………...3 3.0 REQUIREMETS……………………………………………………………………………………….3 4.0 RATIGS…………………………………………………………………………………………………3 5.0 EVIROMETAL PERFORMACE……………………………………………………………….4 MECHAICAL PERFORMACE…………………………………………………………….………5 6.0 PRODUCT QUALIFICATIO AD REQUALIFICATIO TEST SEQUECE…………………8 REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 2 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 1.0 SCOPE This product specification covers the performance requirements for the 0.8mm PITCH MINI PCI EXPRESS CONNECTOR. 1.1 PRODUCT AME AD PART UMBER Product Name Series Number 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 48338 0.8mm PITCH MINI-PCI EXPRESS CONNECTOR,SINK TYPE 48344 2.0 APPLICABLE DOCUMET The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence. In the event of conflict between the requirements of this specification and the referenced documents, this specification shall take precedence. EIA-364 3.0 REQUIREMETS See The Appropriate Sales Drawings. For Information On Dimensions, Materials, Plantings and Markings. “SD-48338-002, SD-48338-004, SD-48344-001, RSD-48344-001” 4.0 RATIGS 4.1 VOLTAGE Voltage Rating : 50 VAC 4.2 CURRET Current Rating : 0.5 A 4.3 TEMPERATURE Operating: -40°C to +85°C Non-Operating: -40°C to +85°C ※ Including terminal temperature rise. REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 3 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 5.0 PERFORMACE 5.1 TEST REQUIREMETS AD PROCEDURES SUMMARY ITEM DESCRIPTIO TEST CODITIO REQUIREMET 1 Examination of Product Visual inspection Meets requirements of product drawing. No physical damage. TEST CODITIO REQUIREMET 5.2 ELECTRICAL REQUIREMETS ITEM DESCRIPTIO 2 Contact Resistance (Low Level) 3 4 5 6 7 8 Mate connectors, measure by dry circuit, 55 milliohms Max. (initial) 20mV Max., 100mA Max. After test : ∆R:20 milliohm Max. EIA-364-23 Mate connectors, apply 500 V DC Insulation Resistance between adjacent terminal or ground. EIA-364-21 Dielectric Withstanding Voltage Temperature Rise Insertion Loss Return Loss Next Cross-talk 500 Megohm min. Mate connectors; apply 300V AC for 1 minute between adjacent terminal or ground. EIA-364-20 No breakdown; Current leakage:1 mA MAX. Mate connectors and measure the temperature rise of contact when the Maximum AC rated current 0.5A is passed. EIA-364-70 Temperature Rise: 30°C Max. 1dB Max. Up to 1.25 GHz; A common test fixture for connector ≦[1.6*(F-1.25)+1] dB for characterization shall be used. This is 1.25 GHz<F≦3.75 GHz differential insertion loss requirement. (For example, ≦5 dB at EIA-364-101 F=3.75 GHz) ≦12dB up to 1.3 GHz; A common test fixture for connector characterization shall be used. This is ≦-7dB up to 2 GHz; differential insertion loss requirement. ≦-4dB up to 3.75 GHz; EIA-364-108 -32dB up to 1.25 GHz; A common test fixture for connector ≦-[32-2.4*(F-1.25)] dB for characterization shall be used. This is 1.25 GHz<F≦3.75 GHz differential cross-talk requirement. (For example, ≦-26 dB at EIA-364-90 3.75 GHz) 5.3 MECHAICAL REQUIREMETS ITEM DESCRIPTIO TEST CODITIO REQUIREMET REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 4 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 9 Mating / Unmating Force Card mating/Unmating sequence: a.) Insert the card at the angle specified by the manufacturer b.) Rotate the card into position. c.) Reverse the installation sequence to unmated Force: 2.3Kgf Max Operation Speed：25.4 ± 3 mm/minute. Measure the force required to mate/Unmate connector. EIA-364-13 Durability The sample should be mounted in the tester and fully mated and unmated 50 cycles specified at the rate of 25.4 ± 3 mm/min. EIA-364-09 20 milliohms MAX. (change from initial) Vibration The electrical load condition shall be 100 mA maximum for all contacts. Subject to a simple harmonic motion having amplitude of 0.76mm (1.52mm maximum total excursion) in frequency between the limits of 10 and 55 Hz. The entire frequency range, from 10 to 55 Hz and return to 10 Hz, shall be traversed in approximately 1 minute. This motion shall be applied for 2 hours in each of three mutually perpendicular directions. EIA-364-28 20 milliohms MAX. (change from initial) & Discontinuity< 1 microsecond 12 Subject mated connectors to 50 G’s (peak value) half-sine shock pulses of 11 milliseconds duration. Three shocks in each direction shall be applied along Shock (Mechanical) the three mutually perpendicular axes of the test specimen (18 shocks). The electrical load condition shall be 100mA maximum for all contacts. EIA-364-27 20 milliohms MAX. (change from initial) & Discontinuity< 1 microsecond 13 Apply axial pull out force at the speed Terminal / Housing rate of 25 ＋/－3 mm/minute on the Retention Force terminal assembly in the housing 2.5 N Min. Apply axial pull out force at the speed rate of 25 ＋/－3 mm/minute on the terminal assembly in the housing 2.5 N Min. 10 11 14 Nail / Housing Retention Force REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 5 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION Mate module and subject to follow condition for 10 cycles. 1 cycles: -55 +0/-3 , 30 minutes +85 +3/-0 , 30 minutes EIA-364-32 20 milliohms MAX. (change from initial) & Visual: No Damage Mate module and subject to 5 cycle. Between 25℃ +/- 3℃ at 80% +/- 3% RH. and 65℃ +/- 3℃ at 50% +/- 3% RH. dwell time of 1 hour; ramp time of 0.5 hours. 24 cycles. (EIA-364-31, Test condition A) 20 milliohms MAX. (change from initial) & Visual: No Damage Subject mated connectors to temperature life at 85℃±3℃ for 96 hours. Measure Signal. (EIA-364-17, Test condition A) 20 milliohms MAX. (change from initial) & Visual: No Damage Salt Spray Subject mated/unmated connectors to 5% salt-solution concentration,35℃± 2℃for 48 hours. (EIA-364-26,Test condition B) 20 milliohms MAX. (change from initial) & Visual: No Damage 19 Solderability Subject the test area of contacts into the flux for 5-10 sec. And then into solder bath, Temperature at 245 ±5℃, for 4-5 sec. (EIA-364-52) Solder able area shall have minimum of 95% solder coverage. 20 Hand soldering 15 16 17 18 Thermal Shock Cyclic Temperature and Humidity Temperature life Hand Soldering: Temperature:360±5 , 3 sec. Visual: No Damage REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 6 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION INFRARED REFLOW CONDITIONS 260℃ Maximum (PEAK TEMPERATURE) 8 MINUTES MAXIMUM 250℃ Max. 20-40sec. 21 Resistance To Soldering Heat 3℃ MAXIMUM/SECOND Appearance : No damage after 1 time of reflow AVERAGE RANGE UP 180 sec. 30 sec. (preheat temperature:150~200℃ MAXIMUM) TEMPERATURE CONDITION GRAPH ( TEMPERATURE ON BOARD PATTERN SIDE ) REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 7 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC PRODUCT SPECIFICATION 6.0 PRODUCT QUALIFICATIO AD REQUALIFICATIO TEST SEQUECE Test Item Test Group A B C E F 1,10 1,5 Examination of Product Contact Resistance (Low Level) D 1,5 1,4 2,7 2,4 G H 1,9 1,3 1,7 2,8 Insulation Resistance 3,8 2,5 3,6 Dielectric Withstanding Voltage 4,9 3,6 4,7 I J K 1,3 4 Temperature Rise Insertion Loss 1 Return Loss 2 Next Cross-talk 3 Mating / Unmating Force 2,4 Durability 3 Vibration 2 Shock (Mechanical) 3 Terminal / Housing Retention Force Nail / Housing Retention Force 1 2 Thermal Shock 5 Cyclic Temperature and Humidity 6 5 Temperature life 3 Salt Spray 1 Solderability 2 Hand soldering 2 Resistance To Soldering Heat Sample Size* 5 5 5 5 5 5 5 5 5 5 5 All Test samples need to be PCB mounted. REVISION: ECR/ECN INFORMATION: TITLE: B1 EC No: S2011-0490 DATE: 2010 /11/30 DOCUMENT NUMBER: PS-48338-002 SHEET No. 0.8mm PITCH MINI PCI EXPRESS CONNECTOR 8 of 8 CREATED / REVISED BY: CHECKED BY: APPROVED BY: JESSIECHUA 2010/11/30 KSSHANTHA 2010/11/30 NAGESHKN 2010/12/03 TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.1).DOC