STMICROELECTRONICS STTH2R02-Y

STTH2R02-Y
Automotive ultrafast recovery diode
Features
■
very low conduction losses
■
negligible switching losses
■
low forward and reverse recovery times
■
high junction temperature
■
AEC-Q101 qualified
A
K
A
Description
K
The STTH2R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
SMB
STTH2R02UY
Packaged in SMB, this device is intended for use
in low voltage, high frequency inverters, free
wheeling and polarity protection for automotive
applications.
October 2010
Table 1.
Doc ID 17934 Rev 1
Device summary
Symbol
Value
IF(AV)
2A
VRRM
200 V
Tj (max)
175 °C
VF (typ)
0.7 V
trr (typ)
15 ns
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8
Characteristics
1
STTH2R02-Y
Characteristics
Table 2.
Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IFRM
Repetitive peak forward current
IF(RMS)
Unit
200
V
60
A
60
A
tp = 5 µs, F = 5 kHz
Forward rms current
IF(AV)
Average forward current, δ = 0.5
Tc = 90 °C
2
A
IFSM
Surge non repetitive forward current
tp = 10 ms Sinusoidal
75
A
Tstg
Storage temperature range
-65 to +175
°C
Operating junction temperature range
-40 to +175
°C
Tj
Table 3.
Thermal parameters
Symbol
Rth(j-c)
Table 4.
Symbol
IR(1)
Parameter
VF(2)
Value
Unit
30
°C/W
Junction to case
Static electrical characteristics
Parameter
Test conditions
Reverse leakage current
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
Forward voltage drop
VR = VRRM
IF = 6 A
Tj = 25 °C
Tj = 100 °C
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
To evaluate the conduction losses use the following equation:
P = 0.68 x IF(AV) + 0.06 IF2(RMS)
Doc ID 17934 Rev 1
Min.
Typ.
Max.
-
-
3
-
2
20
-
-
1.20
-
0.89
1.0
-
0.76
0.85
-
0.70
0.80
Unit
µA
V
IF = 2 A
Tj = 150 °C
2/8
Value
STTH2R02-Y
Characteristics
Table 5.
Dynamic characteristics
Symbol
Parameter
trr
Test conditions
Min.
Typ
Max.
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25 °C
-
23
30
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25 °C
-
15
20
Reverse recovery current
IF = 2 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125 °C
-
3
4
A
Forward recovery time
IF = 2 A, dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25 °C
-
40
-
ns
Forward recovery voltage
IF = 2 A, dIF/dt = 100 A/µs,
Tj = 25 °C
-
2.0
-
V
Reverse recovery time
IRM
tfr
VFP
Figure 1.
Peak current versus duty cycle
Figure 2.
IM(A)
Unit
ns
Forward voltage drop versus
forward current (typical values)
IFM(A)
100
50
T
IM
δd=tp/T
80
tp
40
60
30
20
40
P=5W
Tj=150°C
P=2W
P=1W
Tj=25°C
10
20
δ
VFM(V)
0
0
0.0
0.0
Figure 3.
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0.5
1.0
1.5
2.0
2.5
1.0
Forward voltage drop versus
forward current (maximum values)
Figure 4.
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-a) /Rth(j-a)
IFM(A)
50
1.0
SMA
Scu=1cm²
0.9
40
0.8
0.7
30
0.6
0.5
Tj=150°C
20
0.4
Tj=25°C
0.3
10
0.2
0.1
VFM(V)
0
Single pulse
tP(ms)
0.0
0.0
0.5
1.0
1.5
2.0
2.5
1.E-02
Doc ID 17934 Rev 1
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
3/8
Characteristics
Figure 5.
STTH2R02-Y
Junction capacitance versus
reverse applied voltage
(typical values)
Figure 6.
C(pF)
Reverse recovery charges versus
dIF/dt (typical values)
QRR(nC)
100
60
F=1MHz
Vosc=30mVRMS
Tj=25°C
IF=2A
VR=160V
50
40
Tj=125°C
10
30
20
Tj=25°C
10
VR(V)
dIF/dt(A/µs)
1
0
1
10
Figure 7.
100
1000
10
100
Reverse recovery time versus dIF/dt Figure 8.
(typical values)
tRR(ns)
1000
Peak reverse recovery current
versus dIF/dt (typical values)
IRM(A)
60
6
IF=2A
VR=160V
IF=2A
VR=160V
50
5
40
4
30
3
Tj=125°C
Tj=125°C
20
2
1
Tj=25°C
10
Tj=25°C
dIF/dt(A/µs)
dIF/dt(A/µs)
0
0
10
100
Figure 9.
1000
Dynamic parameters versus
junction temperature
10
100
1000
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under each lead
Rth(j-a) (°C/W)
QRR; IRM [T j] / Q RR; IRM [T j=125°C]
120
1.4
IF=2A
VR=160V
1.2
Epoxy printed circuit board,
copper thickness = 35 µm
100
1.0
80
IRM
0.8
60
0.6
QRR
40
0.4
20
0.2
Tj(°C)
SCU(cm²)
0.0
0
25
4/8
50
75
100
125
150
0.0
Doc ID 17934 Rev 1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
STTH2R02-Y
2
Ordering information scheme
Ordering information scheme
Figure 11. Ordering information scheme
STTH
2 R
02 XX
Ultrafast switching diode
Average forward current
2=2A
Model R
Repetitive peak reverse voltage
02 = 200 V
Package
U = SMB in tape and reel
Y = Automotive grade
Doc ID 17934 Rev 1
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Package information
3
STTH2R02-Y
Package information
●
Epoxy meets UL94, V0
●
Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6.
SMB dimensions
Dimensions
E1
Ref.
D
E
c
A1
A2
b
L
Millimeters
Min.
Typ.
Max.
A1
1.90
2.15
2.45 0.075 0.085 0.096
A2
0.05
0.15
0.20 0.002 0.006 0.008
b
1.95
2.20 0.077
0.087
c
0.15
0.41 0.006
0.016
E
5.10
5.40
5.60 0.201 0.213 0.220
E1
4.05
4.30
4.60 0.159 0.169 0.181
D
3.30
3.60
3.95 0.130 0.142 0.156
L
0.75
1.15
1.60 0.030 0.045 0.063
Figure 12. SMB footprint (dimensions in mm)
5.25
2.22
1.75
6/8
1.75
Inches
1.75
Doc ID 17934 Rev 1
Min.
Typ.
Max.
STTH2R02-Y
4
Ordering information
Ordering information
Table 7.
5
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STTH2R02UY
R2UY
SMB
0.12 g
2500
Tape and reel
Revision history
Table 8.
Document revision history
Date
Revision
20-Oct-2010
1
Changes
Initial release.
Doc ID 17934 Rev 1
7/8
STTH2R02-Y
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