FUJITSU MBF200

MBF200
Solid State Fingerprint Sensor
Overview
Packages
The Fujitsu MBF200 Solid-State Fingerprint Sensor is a direct
contact, fingerprint acquisition device. It is a high performance,
low power, low cost, capacitive sensor composed of a twodimensional array of metal electrodes in the sensing array.
Each metal electrode acts as one plate of a capacitor and the
contacting finger acts as the second plate. A passivation layer on the
device surface forms the dielectric between these two plates. Ridges
and valleys on the finger yield varying capacitor values across the
array, and the resulting varying discharge voltages are read to form
an image of the fingerprint.
The MBF200 is manufactured in standard CMOS technology.
The 256 X 300 sensor array has a 50 µm pitch and yields a 500-dpi
image. The sensor surface is protected by a patented, ultra-hard,
abrasion and chemical resistant coating.
Features
Applications
• Capacitive solid-state device
• Secure access for databases, networks, local storage
• 500-dpi resolution (50 µm pitch)
• Portable fingerprint acquisition
• 1.28 cm x 1.50 cm (0.5”x 0.6”) sensor area
• Smart Cards
• 256 x 300 sensor array
• Smart Cards
• 3.3V to 5V operating range
• Exceptionally hard protective coating
• Integrated 8-bit analog to digital converter
• One of three bus interfaces:
8-bit microprocessor bus interface
Integrated USB Full-Speed Interface
Integrated Serial Peripheral Interface
• Standard CMOS technology
• Low power, less than 70 mW operating at 5V
• Automatic finger detection
• Identity verification for ATM transactions
• Cellular phone-based security access
• Access control and monitoring (home, auto, office, etc.)
MBF200
Table of Contents
Chip Operation .....................................................................................................................................................................1
Block Diagram......................................................................................................................................................................1
Connection Diagram..............................................................................................................................................................2
Pin List................................................................................................................................................................................3
Pin Descriptions....................................................................................................................................................................4
Device Bus Operation.............................................................................................................................................................7
Microprocessor Bus Interface ............................................................................................................................................7
Serial Peripheral Bus Interface (SPI) Slave ................................................................................................................................8
SPI Bus Mode.................................................................................................................................................................8
SPI Slave Mode...............................................................................................................................................................8
Register Read Command in SPI Slave Mode ........................................................................................................................8
Register Write Command for SPI Slave Mode ......................................................................................................................8
USB Interface Mode, Using Internal ROM ................................................................................................................................8
Endpoint 0 ....................................................................................................................................................................8
Endpoint 1 ....................................................................................................................................................................8
Endpoint 2 ....................................................................................................................................................................8
USB Interface Mode, Using External ROM ...............................................................................................................................8
SPI Master Mode ............................................................................................................................................................9
Function Register Descriptions ...............................................................................................................................................9
Function Register Map...........................................................................................................................................................9
RAH 0x00 .....................................................................................................................................................................9
RAL 0x01....................................................................................................................................................................10
CAL 0x02 ....................................................................................................................................................................10
REH 0x03....................................................................................................................................................................10
REL 0x04 ....................................................................................................................................................................10
CEL 0x05 ....................................................................................................................................................................10
DTR 0x06....................................................................................................................................................................11
DCR 0x07....................................................................................................................................................................11
CTRLA 0x08 ...............................................................................................................................................................11
CRTLB 0x09................................................................................................................................................................13
CTRLC 0x0A ...............................................................................................................................................................14
SRA 0x0B....................................................................................................................................................................14
PGC 0x0C ...................................................................................................................................................................15
ICR 0x0D ....................................................................................................................................................................15
ISR 0x0E .....................................................................................................................................................................16
THR 0x0F ...................................................................................................................................................................16
Fujitsu Microelectronics America, Inc.
-1
Solid State Fingerprint Sensor
CIDH 0x10 ................................................................................................................................................................. 17
CIDL 0x11 .................................................................................................................................................................. 17
TST 0x12.................................................................................................................................................................... 17
Sensor Initialization............................................................................................................................................................ 18
Image Retrieval .................................................................................................................................................................. 18
Microprocessor Interface ............................................................................................................................................... 18
Get Row ............................................................................................................................................................... 18
Get Whole Image ................................................................................................................................................... 19
Get Sub-Image ...................................................................................................................................................... 20
Serial Peripheral Interface ...................................................................................................................................... 21
Get Image............................................................................................................................................................. 21
USB Interface........................................................................................................................................................ 22
Get Image............................................................................................................................................................. 22
Absolute Maximum Ratings ................................................................................................................................................. 23
Operating Range ................................................................................................................................................................ 23
DC Characteristics .............................................................................................................................................................. 23
Power Supply Consumption ................................................................................................................................................. 24
AC Characteristics .............................................................................................................................................................. 25
Microprocessor Bus Mode.............................................................................................................................................. 25
Read Cycle ............................................................................................................................................................ 25
Write Cycle ........................................................................................................................................................... 25
SPI Slave Mode...................................................................................................................................................... 26
SPI Master............................................................................................................................................................ 26
Timing Diagrams................................................................................................................................................................ 27
Physical Dimensions............................................................................................................................................................ 31
Recommended Land Pattern................................................................................................................................................. 32
Array Orientation............................................................................................................................................................... 33
Appendix A ........................................................................................................................................................................ 34
Recommended Power and Ground Connections ................................................................................................................ 34
Appendix B........................................................................................................................................................................ 35
Recommended MBF200 Sensor Orientation ..................................................................................................................... 35
0
a, Inc.
MBF200
Chip Operation
The sensor array includes 256 columns and 300 rows of sensor plates.
Associated with each column are two sample-and-hold circuits.
A fingerprint image is sensed or captured one row at a time. This
“row capture”occurs in two phases. In the first phase, the sensor
plates of the selected row are pre-charged to the VDD voltage.
During this pre-charge period, an internal signal enables the first
set of sample-and-hold circuits to store the pre-charged plate
voltages of the row.
In the second phase, the row of sensor plates is discharged with a
current source. The rate at which a cell is discharged is proportional
to the“discharge current.”After a period of time (referred to as
the“discharge time”), an internal signal enables the second set
of sample-and-hold circuits to store the final plate voltages.
The difference between the precharged and discharged plate voltages
is a measure of the capacitance of a sensor cell. After the row capture,
the cells within the row are ready to be digitized.
The sensitivity of the chip is adjusted by changing the discharge
current and discharge time. The nominal value of the current source
is controlled by an external resistor connected between the ISET pin
and ground. The current source is controlled from the Discharge
Current Register (DCR). The discharge time is controlled by the
Discharge Time Register (DTR).
Block Diagram
P0
D[7:0]
DATA
REGISTER
P1
INDEX
REGISTER
256 X 300
SENSOR
ARRAY
FUNCTION
REGISTERS
A0
RD
WR
SAMPLE AND HOLD
WAIT
CS0
CONTROL
CS1
A/D CONVERTER
AIN
MOSI
MISO
SPI
ANALOG
ISET
DP
DM
USB
EXTINT
INTR
MULTIVIBRATOR
FSET
TEST
MODE1
MODE0
XTAL
OSC
XTAL1
XTAL2
1
Solid State Fingerprint Sensor
Connection Diagram
2
VDDA1
1
80
N/C
VSSA1
2
79
N/C
ISET
3
78
N/C
AIN
4
77
N/C
FSET
5
76
N/C
VSSA2
6
75
N/C
VDDA2
7
74
N/C
TEST
8
73
N/C
P0
9
72
N/C
P1
10
71
N/C
D7
11
70
N/C
D6
12
69
N/C
D5
13
68
N/C
D4
14
67
N/C
VSS1
15
66
N/C
VDD1
16
65
N/C
D3
17
64
N/C
D2
18
63
N/C
D1
19
62
N/C
D0
20
61
N/C
A0
21
60
N/C
RD
22
59
N/C
WR
23
58
N/C
VSS2
24
57
N/C
VDD2
25
56
N/C
XTAL2
26
55
N/C
XTAL1
27
54
N/C
INTR
28
53
N/C
WAIT
29
52
N/C
EXTINT
30
51
N/C
CS1/SCLK
31
50
N/C
CS0/SCS
32
49
N/C
MOSI
33
48
N/C
MISO
34
47
N/C
MODE1
35
46
N/C
MODE0
36
45
N/C
DM
37
44
N/C
DP
38
43
N/C
VDD3
39
42
N/C
VSS3
40
41
N/C
MBF200
MBF200
Pin List
Pin
Number
Name
Type
1
VDDA1
PWR
Analog Power Supply
2
VSSA1
GND
Analog Ground
3
ISET
O
Sets Reference Current
IOL (5.0 V)
IOH (5.0 V)
Description
4
AIN
I
Analog Input
5
FSET
O
Sets Internal Multi-vibrator Frequency
6
VSSA2
GND
Analog Ground
7
VDDA2
PWR
Analog Power Supply
8
TEST
I
9
P0
O
8mA
4mA
Output Port 0
Test Mode Enable
10
P1
O
8mA
4mA
Output Port 1
11
D7
I/O
8mA
4mA
Data Bit 7
12
D6
I/O
8mA
4mA
Data Bit 6
13
D5
I/O
8mA
4mA
Data Bit 5
8mA
14
D4
I/O
15
VSS1
GND
Data Bit 4
16
VDD1
PWR
17
D3
I/O
8mA
4mA
Data Bit 3
18
D2
I/O
8mA
4mA
Data Bit 2
19
D1
I/O
8mA
4mA
Data Bit 1
20
D0
I/O
8mA
4mA
Data Bit 0
21
A0
I
22
RD
I
8mA
4mA
Read Enable, Active Low
23
WR
I
8mA
4mA
Write Enable, Active Low
Digital Ground
Digital Power Supply
Address Input
24
VSS2
GND
Digital Ground
25
VDD2
PWR
Digital Power Supply
26
XTAL2
O
Internal Oscillator Output
27
XTAL1
I
Internal Oscillator Input
28
INTR
O
8mA
Interrupt Output, Active Low
29
WAIT
O
8mA
Wait, Active Low
30
EXTINT
I
External Interrupt Input
31
CS1/SCLK
I/O
Chip Select, Active High
32
CS0/SCS
I/O
33
MOSI
I/O
8mA
4mA
SPI Master Output / Slave Input
34
MISO
I/O
8mA
4mA
SPI Master Input / Slave Output
35
MODE1
I
36
MODE0
I
37
DM
I/O
Chip Select, Active Low
Mode Select 1
Mode Select 0
USB D-
38
DP
I/O
39
VDD3
PWR
Digital Power Supply
USB D+
40
VSS3
GND
Digital Ground
[41:80]
N/C
No Connect
3
Solid State Fingerprint Sensor
Pin Descriptions
VDDA1, VDDA2 (Pins 1 and 7)
Power Supply to the analog section of the sensor. VDDA1 powers the array, row drivers, column receivers, A/D converter, and sample/hold
amplifier. VDDA2 powers the multi-vibrator and bias circuits.
VSSA1, VSSA2 (Pins 2 and 6)
Ground for the analog section of the sensor. VSSA1 is the ground return for the array, row drivers, column receivers, A/D converter, and
sample hold amplifier. VSSA2 is the ground return for the multi-vibrator and bias circuits.
VDD1, VDD2, VDD3 ( Pins 25, 16, and 39)
Power supply to the digital logic and I/O drivers. VDD2 powers the core digital logic, oscillators, phase-locked loops, and digital inputs.
VDD1 and VDD3 supply power to the digital output circuits and USB transceivers.
VSS1, VSS2, VSS3 (Pins 24, 15, and 40)
Ground for the digital logic and I/O drivers.
VSS2 is the ground connection for the core digital logic, oscillators, phase-locked loops, and digital inputs. VSS1 and VSS3 are the ground
connections for the digital outputs and USB transceivers.
ISET (Pin 3)
Connect a 200k ohm resistor between ISET and analog ground VSSA1 to set the internal reference current. The discharge current is a scalar
function of the internal reference current.
AIN (Pin 4)
Alternate analog input to the A/D converter. Set the AINSEL bit in register CTRLA to select AIN as the input to the A/D converter. Pull this
pin to ground, preferably with a resistor.
FSET (Pin 5)
Connect a resistor between FSET and ground to set the internal multi-vibrator and automatic finger detection frequency. Use a 56k ohm
resistor for standard 12 MHz (±20%) multi-vibrator operation and 120KHz (±20%) automatic finger detection sampling rate.
XTAL1 (Pin 27)
Input to the internal oscillator. To use the internal oscillator, connect a crystal circuit to this pin. If an external oscillator is used, connect its
output to this pin.
XTAL2 (Pin 26)
Output from the internal oscillator. To use the internal oscillator, connect a crystal circuit to this pin. If an external oscillator is used, leave this
pin unconnected.
D[7:0] (Pins 11-14, 17-20)
Bi-directional data bus. D[7:0] have weak latches that hold the bus’s state when not being driven. These pins may be left unconnected in SPI or
USB mode.
A0 (Pin 21)
Address input. Drive A0 low to select the address index register. Drive A0 high to select the data buffer. A0 has a weak latch that holds the pin
state when not being driven. This pin may be left unconnected in SPI or USB mode.
4
.
MBF200
RD (Pin 22)
Read enable, active low. To read from the chip, drive RD low while WR is high and the chip is selected. RD has an internal, weak pull-up
resistor and may be left unconnected in SPI or USB mode.
WR (Pin 23)
Write enable, active low. To write to the chip, drive WR low while RD is high and the chip is selected. WR has an internal, weak pull-up resistor
and may be left unconnected in SPI or USB mode.
CS0 / SCS (Pin 32)
Chip select, active low. The CS0/SCS pin has a weak latch that holds the pin’s state when not being driven. CS0/SCS may be left unconnected in
USB mode if not using an external serial ROM. The function of the CS0/SCS pin depends on the MODE1 and MODE0 pins.
MODE[1:0] = 00b (Microprocessor Bus Interface Mode)
CS0/SCS functions as an active-low chip select input. Drive CS0/SCS low while CS1 is high to select the chip.
MODE[1:0] = 01b (SPI Slave Mode)
CS0/SCS functions as an active-low slave chip select input. Connect a pull-up resistor between CS0/SCS and VDD.
MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)
CS0/SCS has no function.
MODE[1:0] = 11b (USB Interface Mode, Using External ROM)
CS0/SCS functions as the master chip select output, active low to the slave serial ROM chip select. Connect a pullup resistor between
CS0/SCS and VDD.
CS1 / SCLK (Pin 31)
Chip select, active high. The CS1/SCLK pin has a weak latch that holds the pin’s state when not being driven. CS1/SCLK may be left
unconnected in USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0 pins.
MODE[1:0] = 00b (Microprocessor Bus Interface Mode)
CS1/SCLK functions as an active-high chip select input. Drive CS1/SCLK high while CS0-/CSC- is low to select the chip.
MODE[1:0] = 01b (SPI Slave Mode)
CS1/SCLK functions as the slave serial clock input.
MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)
CS1/SCLK has no function.
MODE[1:0] = 11b (USB Interface Mode, Using External ROM)
CS1/SCLK functions as the master serial clock output to the slave serial ROM clock input. Connect a pull-up resistor between
CS1/SCLK and VDD.
EXTINT (Pin 30)
External Interrupt input. This pin can be programmed to be edge or level sensitive, active-high or active-low. EXTINT has a weak pull-up and
may be left unconnected in MCU, SPI, or USB mode.
INTR (Pin 28)
Interrupt output, active low. INTR is high impedance when it is not active and is driven low when an enabled interrupt event occurs. INTR can
be enabled if the sensor is in MCU or SPI mode. In USB mode leave this pin unconnected.
5
Solid State Fingerprint Sensor
WAIT (Pin 29)
Wait output, active low. WAIT is driven low when active and high-impedance when not active. WAIT goes low if the A/D converter is read while
an A/D conversion is in progress. WAIT will remain low until the A/D conversion is completed.
MOSI (Pin 33)
SPI Master Output/Slave input. The MOSI pin has a weak latch that holds the pin’s state when not being driven. MOSI may be left
unconnected in MCU mode or USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0
pins.
MODE[1:0] = 00b (Microprocessor Bus Interface Mode)
MOSI has no function.
MODE[1:0] = 01b (SPI Slave Mode)
MOSI functions as the slave serial input.
MODE[1:0] = 10b (USB Interface Mode, Using Internal ROM)
MOSI has no function.
MODE[1:0] = 11b (USB Interface Mode, Using External ROM)
MOSI functions as the master serial data output to the slave serial ROM data input. Unlike standard SPI, MOSI is actively driven high
and low when transmitting data and is high impedance when idle. Connect a pull-up resistor between MOSI and VDD to pull MOSI
high when idle.
MISO (Pin 34)
SPI Master Input/Slave Output. The MISO pin has a weak latch that holds the pin’s state when not being driven. MISO may be left
unconnected in MCU mode or USB mode if not using an external serial ROM. The function of this pin depends on the MODE1 and MODE0
pins.
MODE[1:0] = 00b (Microprocessor Bus Interface Mode)
MISO has no function.
MODE[1:0] = 01b (SPI Slave Mode)
MISO functions as the slave serial data output. Unlike standard SPI, the MISO connection is actively driven high and low when
transmitting data and is high impedance when idle. Connect a pull-up resistor between MISO and VDD to pull MISO high when idle.
MODE1/MODE0 = 10b (USB Interface Mode, Using Internal ROM)
MISO has no function.
MODE1/MODE0 = 11b (USB Interface Mode, Using External ROM)
MISO functions as the master serial data input from the slave serial ROM data output.
P0 (Pin 9)
Port Output 0. This output is controlled by bit 0 of the CTRLC register.
P1 (Pin 10)
Port Output 1. This output is controlled by bit 1 of the CTRLC register.
DP (Pin 38)
USB D+ data line. In USB mode, connect a 1.5k ohm resistor between DP and VDD3, which must be between 3.3V and 3.6V in this mode.
Use a 43 ohm series resistor. In MCU or SPI mode, either pull-up this pin with a resistor or tie it to ground.
6
.
MBF200
DM (Pin 37)
USB D- data line. Use 43 ohm series resistor. In MCU or SPI mode, either pull-up this pin with a resistor or tie it to ground.
MODE[1:0] (Pins 35 and 36)
Mode Select pins. MODE[1:0] select one of four operating modes.
MODE[1:0]
Description
00b
Microprocessor Bus Mode
01b
SPI Bus Mode
10b
USB Mode, Using Internal ROM
11b
USB Mode, Using External ROM
TEST (Pin 8)
Test Mode Enable. It is intended for factory use only. Connect this pin to VSS.
No Connect (Pins 41-80)
Unconnected pins.
The chip has four control inputs: CS0, CS1, RD, and WR. Drive CS0
low and CS1 high to select the chip. Data is latched on the rising edge
of WR-.
Device Bus Operation
Microprocessor Bus Interface
The microprocessor bus interface mode uses the following pins:
D[7:0], A0, RD, WR, CS0, CS1, EXTINT, INTR, and WAIT. Either
the internal multi-vibrator or the XTAL1/XTAL2 oscillator can be
selected to provide the clock to the chip. The SPI and USB interfaces
are disabled.
The fingerprint sensor chip uses an indexed addressing scheme to
access its function registers. The chip has eight data lines (D[7:0]) and
one address line (A0). The address line selects between the index
register and the data register. Drive A0 low to select the index
register. Drive A0 high to access the function register selected by the
index register. The index register retains its value until it is rewritten
or the chip is reset.
The chip has two status lines: INTR and WAIT. The INTR signal is
asserted when an interrupt event occurs. The WAIT signal goes low
when the A/D converter is read while an A/D conversion is in
progress. The WAIT signal will be high impedance when the A/D
conversion is completed. Both the WAIT and INTR outputs are high
impedance when they are not active. As a result, they can be activelow WIRE-ORed in conjunction with other interrupts or wait
signals.
The SPI and USB interfaces are disabled when the microprocessor
bus interface is selected. A truth table for the microprocessor bus
interface is shown below:
Truth Table for the Microprocessor Bus Interface
CS0
CS1
A0
RD
WR
Mode
Data Lines
H
X
X
X
X
De-selected
High Impedance
X
L
X
X
X
De-selected
High Impedance
L
H
X
H
H
Standby
High Impedance
L
H
L
L
H
Read Index Register
Output
L
H
L
H
L
Write Index Register
Input
L
H
H
L
H
Read Data Register
Output
L
H
H
H
L
Write Data Register
Input
7
Solid State Fingerprint Sensor
Serial Peripheral Bus Interface (SPI)
Slave
USB Interface Mode, Using Internal
ROM
SPI Bus Mode
This USB mode uses the following pins: DP, DM, EXTINT, XTAL1,
and XTAL2. XTAL1 must be driven from a 12 MHz source or XTAL1
and XTAL2 must be connected to a 12 MHz crystal circuit. The
internal 12 MHz multivibrator, the microprocessor bus, and SPI
interface are disabled. The internal USB descriptor ROM will be
accessed in response to a USB GET_DESCRIPTOR command.
SPI (Slave) bus mode uses the following pins: SCLK, SCS, MOSI,
MISO, and EXTINT. Either the internal multivibrator or the
XTAL1/XTAL2 oscillator can be selected to provide the clock to the
chip. The microprocessor bus and USB interface are disabled.
SPI Slave Mode
In SPI Slave Mode, the sensor can operate in either SPI mode (0, 0)
where CPOL = 0 and CPHA = 0 or SPI mode (1, 1) where CPOL = 1
and CPHA = 1. The SPI Master may clock in commands and clock out
data up to 12 Mbits per second. The SPI Master can write and read the
registers of the sensor even when the internal 12 MHz multivibrator or
XTAL1/XTAL2 oscillator is halted.
• MOSI bits are sampled on the rising edge of SCK
• MISO bits change on the falling edge of SCK
• SCK can be idle in either a high or low state
• The most significant bits are shifted out first
The sensor’s USB interface uses three endpoints:
Endpoint 0
Endpoint 0 is a control endpoint used for device enumeration and
configuration. The sensor function registers are written and read
using control transfers of vendor specific commands to endpoint 0.
Endpoint 1
Endpoint 1 is a bulk-in endpoint specifically for reading the CTRLA
register, which is the output buffer of the A/D converter. Data is
transmitted in 64-byte packets except for the last packet of a
GETROW operation which may be 64-bytes or less, depending on
the row length.
Register Read Command in SPI Slave Mode
Endpoint 2
The Register Read command includes a command byte and address
byte. The command sequence begins when the SPI master drives SCS
low and sends the Read Command byte (encoded as 0x03) on the
MOSI pin. Following the command byte, the master sends the
address byte, which is the index to the register to be read. After
receiving the least significant bit (LSB) of the address byte, the SPI
slave sensor sends the contents of the selected register on the MISO
pin. Finally, the master drives SCS high after it has sampled the LSB
of the data byte. When reading the A/D converter, the Master may
keep SCS low to read consecutive pixels up to the end of the current
row. A new Register Read command must be issued to read the next
row. The SPI Master must drive SCS high before beginning another
command.
Endpoint 2 is an interrupt endpoint. In the event of an interrupt,
the contents of the ISR (Interrupt Status Register) are transfered to
endpoint 2.
Register Write Command for SPI Slave Mode
The Register Write command includes a command byte and address
byte followed by the data to be written. The command sequence
begins when the SPI Master drives SCS low and sends the Write
Command byte (encoded as 0x02) on the MOSI pin. Then the master
sends the address byte, which is the index to the register to be
written. Finally, the master sends the data byte and thereafter drives
SCS high.
8
USB Interface Mode, Using External
ROM
This USB mode the uses following pins: DP, DM, SCLK, SCS,
MOSI, MISO, EXTINT, XTAL1, and XTAL2. XTAL1 must be
driven from a 12 MHz source or a 12 MHz crystal circuit must be
connected to XTAL1 and XTAL2. The internal 12 MHz multivibrator and the microprocessor bus are disabled.
The SPI interface is enabled as an SPI Master. The external SPI serial
ROM will be accessed in response to a USB GET_DESCRIPTOR
command. The internal USB descriptor ROM is disabled. This mode
allows an external serial ROM to override the internal descriptor ROM.
Note: When the MBF200 is directly connected to USB in either of
the modes above, the VDD and VDDA pins must be powered
between 3.3V and 3.6V so that the MBF200 DP and DM pins do
not drive the USB beyond 3.6V.
MBF200
SPI Master Mode
In SPI Master Mode the sensor operates in SPI mode (1,1) where
CPOL = 1, and CPHA = 1. SCK is limited to 1 MHz.
• MOSI bits change on the falling edge of SCK
• MISO bits are sampled on the rising edge of SCK
• SCK is idle in the high state
Function Register Descriptions
The function registers are accessed by indexed addressing. Write the
index register to select a function register. Read or write the data
register to access the contents of the function register. All registers
can be read and written except as noted in the following
descriptions.
• The most significant bits are shifted out first
Function Register Map
Index
Name
0x00
RAH
Row Address, High
R/W
0x01
RAL
Row Address, Low
R/W
0x02
CAL
Column Address, Low
R/W
0x03
REH
Row Address End, High
R/W
0x04
REL
Row Address End, Low
R/W
0x05
CEL
Column Address End, Low
R/W
0x06
DTR
Discharge Time Register
R/W
0x07
DCR
Discharge Current Register
R/W
0x08
CTRLA
Control Register A
R/W
0x09
CTRLB
Control Register B
R/W
0x0A
CTRLC
Control Register C
R/W
0x0B
SRA
Status Register A
R
0x0C
PGC
Programmable Gain Control Register
R/W
0x0D
ICR
Interrupt Control Register
R/W
0x0E
ISR
Interrupt Status Register
R/W
0x0F
THR
Threshold Register
R/W
0x10
CIDH
Chip Identification, High
R
0x11
CIDL
Chip Identification, Low
R
0x12
TST
Test Mode Register
Description
Read/Write Access
R/W
Note: In the following descriptions,“sub-image”means a rectangular region of the sensor array, up to and including the entire array.
RAH
0x00
Row Address Register High.
Reset State: 0x00
This register holds the high order bit of the address of the first row of a sub-image.
Bit Number
Bit Name
[7:1]
-
0
RA[8]
Function
Reserved. Write 0 to these bits.
Most Significant Bit of Row Address Register
9
Solid State Fingerprint Sensor
RAL
0x01
Row Address Register Low.
Reset State: 0x00
This register holds the low order byte of the address of the first row of a sub-image.
CAL
Bit Number
Bit Name
[7:0]
RA[7:0]
Function
Low eight bits of Row Address Register
0x02
Column Address Register.
Reset State: 0x00
This register holds the address of the first column of a sub-image.
REH
Bit Number
Bit Name
[7:0]
CA[7:0]
Function
Column Address Register
0x03
Row Address End Register High.
Reset State: 0x00
This register holds the most significant bit of the address of the last row of a sub-image.
Bit Number
REL
Bit Name
[7:1]
-
0
REND[8]
Function
Reserved. Write 0 to these bits.
Most Significant Bit of Row Address Register
0x04
Row Address End Register Low.
Reset State: 0x00
This register holds the least significant byte of the address of the last row of a sub-image.
CEL
Bit Number
Bit Name
[7:0]
REND[7:0]
Function
Low eight bits of Row Address Register
0x05
Column Address End Register.
Reset State: 0x00
This register holds the address of the last column of a sub-image.
10
Bit Number
Bit Name
[7:0]
CEND[7:0]
Function
Column Address Register
MBF200
DTR
0x06
Discharge Time Register
Reset State: 0x00
Bit Number
DCR
Bit Name
[7]
-
[6:0]
DT[6:0]
Function
Reserved. Write 0 to these bits.
Sets the discharge time in oscillator clock periods.
0x07
Discharge Current Register
Reset State: 0x00
Bit Number
Bit Name
Function
[7:5]
-
Reserved. Write 0 to these bits.
[4:0]
DC[4:0]
Sets the discharge current rate.
CTRLA 0x08
Control Register A.
Reset State: 0x00
Write this register to initiate image conversion. Read this register to read the A/D converter.
Bit Number
Bit Name
7
-
Reserved. Write 0 to this bit.
6
-
Reserved. Write 0 to this bit.
5
-
Reserved. Write 0 to this bit.
4
-
Reserved. Write 0 to this bit.
3
AINSEL
0=Select Array for Conversion
1=Select External Analog Input Pin and Start Conversion
2
GETSUB
Initiates Auto-increment for sub-image
1
GETIMG
Initiates Auto-increment for whole image
0
GETROW
Initiates Auto-increment for selected row
Function
The GETSUB, GETIMG, and GETROW bits select an image access mode and initiate an A/D conversion sequence. The AINSEL bit selects
the input source to the A/D converter.
Set the GETSUB bit to initiate the capture of a rectangular sub-image defined by the RAH, RAL, CAL, REH, REL, and CEL registers.
In CPU or SPI mode, the sub-image can be an arbitrary rectangle ranging from a single pixel to the entire array. In USB mode, the number of
columns in the sub-image must be an integral multiple of 64.
Set the GETIMG bit to initiate the capture of a whole image starting from row zero and column zero through row 299 and column 255,
regardless of the RAH, RAL, CAL, REH, REL, and CEL registers.
Set the GETROW bit to initiate the capture of a row specified by the RAH and RAL registers.
Writing a 1 to any of GETSUB, GETIMG, or GETROW abandons the current image access operation and restarts at the beginning of the
sub-image, image, or row. Set at most one of these three bits. If more than one these three bits are set, image conversion will not start.
11
Solid State Fingerprint Sensor
Setting the GETROW bit causes the following events to happen:
• Row address loaded with contents of RAH and RAL register.
• Column address resets to zero
• Row capture automatically starts
• Analog to digital conversion of first pixel automatically starts
Setting the GETIMG bit causes the following events to happen:
• Row address resets to zero
• Column address resets to zero
• Row capture automatically starts
• Analog to digital conversion of first pixel automatically starts
Setting the GETSUB bit causes the following events to happen:
• Row address loaded with contents of RAH and RAL register
• Column address loaded with contents of CAL
• Row capture automatically starts
• Analog to digital conversion of first pixel automatically starts
Set the AINSEL bit along with one of the other three bits to begin the analog to digital conversion of the voltage on the AIN pin instead of the
sensor array.
Writing 0 to the CTRLA register has no effect other than clearing AINSEL; the current image access operation is not abandoned.
Read CTRLA for the result of the A/D conversion. The rising edge of RD causes the next A/D conversion to start.
Parameter Description
Max
Units
Rising Edge of WR to First Data Valid
28 + DT[6:0]
Clock Cycles
Rising Edge of RD to Next Data Valid
6
Clock Cycles
Note: DT[6:0] refers to the contents of the Discharge Time Register.
12
.
MBF200
CRTLB 0x09
Control Register B.
Reset State: CTRLB[7:6] = state of MODE[1:0].
CTRLB[5] = 1.
CTRLB [4:0] = 0, Chip is disabled, oscillator is stopped.
Bit Number
Bit Name
[7:6]
MODE[1:0]
5
RDY
4
-
Function
Reflects the state of the MODE[1:0] pins. These bits are read-only. Writing to these bits has no effect. Write 0 to these bits.
This is a read-only bit that indicates the status of the A/D Converter.
0 = A/D Conversion is in progress.
1 = A/D Converter is idle.
Writing this bit has no effect. Write 0 to this bit.
Reserved. Write 0 to this bit.
Set this bit to enable the automatic finger detection circuit.
3
AFDEN
In USB mode, automatic finger detection will generate an interrupt on endpoint 2.
In CPU or SPI mode, automatic finger detection will generate a finger detect interrupt on the INTR pin as controlled by the Interrupt
Control Register (ICR). In any mode, the automatic finger detection can be combined with ENABLE=0 to save power.
0 = Column and row addresses do not automatically increment after the A/D converter is read.
1 = Column addresses increment and another A/D conversion is initiated after the A/D converter is read. The row address
increments at the end of each column.
2
AUTOINCEN
1
XTALSEL
In USB mode this bit has no function. In CPU and SPI mode this bit selects the clock source for the digital logic.
0 = Selects the internal 12 MHz multi-vibrator.
1 = Selects the XTAL1 pin.
0
ENABLE
0 = Place the sensor array, digital, and analog block into low-power state (12 MHz clock is halted, A/D Converter is shut down).
1= Enable the sensor array, digital, and analog blocks (12 MHz clock and A/D Converter are enabled).
13
Solid State Fingerprint Sensor
CTRLC 0x0A
Control Register C. This register controls the behavior of general output port pins P0 and P1.
Reset State: 0x00
Bit Number
Bit Name
Function
Programs the toggle rate of the P1 pin.
If PT1[2:0] = 000, then the P1 pin follows the state of the P1 bit. Otherwise PT1[2:0] selects the clock divisor to generate a square
wave on the P1 pin.
[7:5]
PT1[2:0]
000 = P1 pin follows state of bit P1.
001 = clock divided by 224.
010 = clock divided by 223.
011 = clock divided by 222.
100 = clock divided by 221.
101 = Reserved.
110 = Reserved.
111 = Reserved.
Programs the toggle rate of the P0 pin.
If PT0[2:0] = 000, then the P0 pin follows the state of the P0 bit. Otherwise PT0[2:0] selects the clock divisor to generate a square
wave on the P0 pin.
000 = P0 pin follows state of bit P0.
001 = clock divided by 224.
010 = clock divided by 223.
011 = clock divided by 222.
100 = clock divided by 221.
101 = Reserved.
110 = Reserved.
111 = Reserved.
[4:2]
PT0[2:0]
1
P1
General Purpose Output Port. When PT1[2:0] bits are 000, this bit controls the P1 pin.
0 = P1 pin low.
1 = P1 pin high.
0
P0
General Purpose Output Port. When PT0[2:0] bits are 000, this bit controls the P0 pin.
0 = P0 pin low.
1 = P0 pin high.
SRA
0x0B
Status Register A. Read Only. This register shadows the state of CTRLA.
Reset State: 0x00
14
Bit Number
Bit Name
Function
7
-
Reserved. Returns 0.
6
-
Reserved. Returns 0.
5
-
Reserved. Returns 0.
4
-
3
AINSEL
This bit is set or cleared when the AINSEL bit (CTRLA bit 3) is set or cleared by software.
Reserved. Returns 0.
2
GETSUB
This bit is set when the GETSUB bit (CTRLA bit 2) is set by software. This bit is cleared after the last byte is read.
1
GETIMG
This bit is set when the GETIMG bit (CTRLA bit 1) is set by software. This bit is cleared after the last byte is read.
0
GETROW
This bit is set when the GETROW bit (CTRLA bit 0) is set by software. This bit is cleared after the last byte is read.
MBF200
PGC
0x0C
Programmable Gain Control Register.
Reset State: 0x00
Bit Number
Bit Name
[7:4]
-
[3:0]
ICR
PG[3:0]
Function
Reserved. Write 0 to these bits. Returns 0 when read.
Sets the gain of the amplifier.
0000 = 1.0 (default)
0001 = 0.25
0010 = 0.50
0011 = 0.75
0100 = 1.0
0101 = 1.25
0110 = 1.50
0111 = 1.75
1000 = 4.0
1001 = 1.0
1010 = 2.0
1011 = 3.0
1100 = 4.0
1101 = 5.0
1110 = 6.0
1111 = 7.0
0x0D
Interrupt Control Register.
Reset State 0x00.
This register controls the behavior of the two interrupt sources of the fingerprint sensor. Interrupt request 0 corresponds to the finger detect
interrupt. Interrupt request 1 corresponds to the external interrupt pin EXTINT.
Set bits IE[1:0] to enable the corresponding interrupt. Disabling an interrupt prevents the interrupt event from causing the chip to assert
INTR or to send a packet on USB endpoint 2. However, the interrupt event is not prevented from setting its corresponding bit in the ISR
register.
Set bits IM[1:0] to prevent an interrupt event from setting the corresponding bit in the ISR. Setting or clearing IM[1:0] will not clear ISR bits
IR[1:0].
Set bits IT[1:0] to program the interrupts as edge or level sensitive. If IT1 is programmed as edge triggered, then IR1 (interrupt request 1) will
be set by the falling edge of EXTINT.
IP[1:0] select the polarity of the interrupt source. To detect finger down and finger up states with the internal finger detect circuit, set the IP0
bit to detect finger down (rising or high signal). After the finger down interrupt occurs, clear the IP0 bit to detect finger up (falling or low
signal). Similarly, IP1 can be programmed to select the polarity of the EXTINT signal.
15
Solid State Fingerprint Sensor
Bit Number
Bit Name
7
IP1
0=EXTINT Interrupt Polarity is Falling Edge or Active Low
1=EXTINT Interrupt Polarity is Rising Edge or Active High
6
IP0
0=Finger Detect Interrupt Polarity is Falling Edge or Active Low
1=Finger Detect Interrupt Polarity is Rising Edge or Active High
5
IT1
0=EXTINT Interrupt is Edge Triggered
1=EXTINT Interrupt is Level Triggered
4
IT0
0=Finger Detect Interrupt is Edge Triggered
1=Finger Detect Interrupt is Level Triggered
3
IM1
0=EXTINT Interrupt Not Masked
1=EXTINT Interrupt Masked
2
IM0
0=Finger Detect Interrupt Not Masked
1=Finger Detect Interrupt Masked
1
IE1
0=EXTINT Interrupt Disabled
1=EXTINT Interrupt Enabled
0
IE0
0=Finger Detect Interrupt Disabled
1=Finger Detect Interrupt Enabled
ISR
Function
0x0E
Interrupt Status Register.
Reset State ISR[7:2] = 0.
ISR[1:0] = X. State is indeterminate after reset.
Read this register to determine source(s) of interrupt(s).
Write a 1 to IR[1:0] to acknowledge and clear the corresponding interrupt bit.
Bits IS[1:0] reflect the state of the finger detect sensor and the EXTINT pin, regardless of the bit settings in the ICR register. When the finger
detect sensor is not triggered, the IS0 bit will be constantly low. However the IS0 bit may not be constantly high when a finger is present; the
bit may be repeatedly changing from a low to high state.
Bit Number
Bit Name
Function
[7:4]
-
Reserved. Write 0 to these bits. Returns 0 when read.
3
IS1
Reflects the state of the EXTINT Pin. Write 0 to this bit.
2
IS0
Reflects the state of the Finger Detect Sensor. Write 0 to this bit.
1
IR1
EXTINT Interrupt Request Pending.
0
IR0
Finger Detect Interrupt Request Pending.
THR
0x0F
Threshold Register.
Reset State 0x00.
This register controls the threshold at which a finger is detected by the automatic finger detection circuit.
Bit Number
16
Bit Name
Function
7
-
[6:4]
THV[2:0]
Threshold voltage level.
Reserved. Write 0 to this bit.
[3:0]
THC[3:0]
Sharing capacitor size.
MBF200
CIDH
0x10
Chip Identification Register High. This register holds the high order byte of the chip identification word.
Bit Number
Bit Name
[7:0]
CIDH[7:0]
CIDL
Function
Returns 0x20 when read.
0x11
Chip Identification Register Low. This register holds the low order byte of the chip identification word.
Bit Number
Bit Name
[7:0]
CIDL[7:0]
TST
Function
The return value depends on the Revision of the chip.
0x12
Test Mode Register. Reserved for factory use only.
Reset State 0x00.
Bit Number
Bit Name
[7:0]
TST[7:0]
Function
Reserved. Write only 0 to these bits.
17
Solid State Fingerprint Sensor
Sensor Initialization
Image Retrieval
The sensor should be enabled and its image parameters adjusted
before beginning a GETIMG, GETROW, or GETSUB operation.
Microprocessor Interface
Get Row
First load the RAH and RAL registers with the address of the row to
be fetched. Then write the CTRLA register to initiate a GETROW
operation. Finally, read the CTRLA register 256 times to retrieve
the row data.
Enable ADC
Write CTRLB with bits
2 and 0 set.
If using an external clock,
then set bit 1 also.
Wait 30 µS.
Other registers (DTR and
DCR for example) can be
initialized during this time.
Setup Row Address
(MCU Mode)
Sensor Enabled.
Write RAH.
Set Row Address
High Order bit.
Write RAL.
Set Row Address
Low Order byte.
Row Selected.
GetRow
(MCU Mode)
Adjust Parameters
Write CTRLA with
0x01.
Write DTR.
Wait Row Capture
Time.
Write DCR.
Read CTRLA.
Write PGC.
No
Wait A/D
Conversion Time.
Parameters Adjusted.
Last Cell
of Row was
Read?
Yes
Row Captured.
18.
MBF200
Get Whole Image
No row or column registers need to be loaded prior to starting a GETIMG operation. The sensor will automatically begin A/D conversion at
row zero, column zero.
Image Capture
(MCU Mode)
Write CTRLA with
0x02.
Wait Row Capture
Time.
Read CTRLA.
No
Wait A/D
Conversion Time.
No
Last Cell
of Row was
Read?
Yes
Last Cell
of Image
was Read?
Yes
Image Captured.
19
Solid State Fingerprint Sensor
Get Sub-Image
First, load the RAH, RAL, and CAL registers with the starting row and column address of the sensor sub-region. Then load registers REH,
REL, and CEL with the ending row and column address of the sensor sub-region. Write the CTRLA register to initiate a GETSUB operation.
Finally, read CTRLA register until the sub-image has been retrieved. The RAH, RAL, CAL, REH, REL, and CEL registers do not have to be
loaded before each GETIMG operation unless a different sensor sub0region is to be captured.
Setup Sub Region
(MCU Mode)
Get Sub Image
(MCU Mode)
Write RAH.
Set Starting Row Address,
High Order bit.
Write CTRLA with
0x04.
Write RAL.
Set Starting Row Address,
Low Order byte.
Wait Row Capture
Time.
Write CAL.
Set Starting Column Address.
Write REH.
Set Ending Row Address,
High Order bit.
Write REL.
Set Ending Row Address,
Low Order byte.
Write CEL.
Set Ending Column Address.
Read CTRLA.
No
Wait A/D
Conversion Time.
No
Last Cell
of Row was
Read?
Yes
Sub Region Selected.
Last Cell
of Image
was Read?
Yes
Image Captured.
20.
MBF200
Serial Peripheral Interface
The“Get Image,”“Get Sub-Image,”and“Get Row”operations are initiated by writing the same registers as described in the microprocessor
interface, except that the commands are written to the MOSI pin and the data is read back on the MISO pin. However, in SPI mode, an image
or sub-image cannot be retrieved by issuing a single Register Read Command and shifting in the entire image; a separate Register Read
Command must be issued prior to reading each row.
Get Image
Image Capture
(SPI Mode)
Drive SCS- Low.
Send Write Opcode.
Send CTRLA Address.
Send Data 0x02.
Drive SCS- High.
Wait Row Capture
Time.
Drive SCS- Low.
Send Read Opcode.
Send CTRLA Address.
Read Data.
No
No
Converted
Last Cell of
Row?
Yes
Drive SCS- High.
Converted
Last Cell of
Image?
Yes
Image Captured.
21
Solid State Fingerprint Sensor
USB Interface
The“Get Image,”“Get Sub-Image,”and“Get Row”operations are initiated by writing the same registers as described in the microprocessor
interface, except that the registers are written and read on endpoint 0 and the image data is read from endpoint 1.
Get Image
Image Capture
(USB Mode)
At Endpoint 0,
Write CTRLA with
0x02.
From Endpoint 1,
Read 64-byte packet.
No
Final
packet of Image
was Read?
Yes
Image Captured.
22
MBF200
Absolute Maximum Ratings
Symbol
Rating
VDD
Power Supply Voltage
VIN, VOUT
Voltage on Any Pin Relative to VSS
IOUT
Output Current per I/O
TSTG
Storage Temperature
Value
Unit
+7.0
V
-0.5V to +7.0V
V
8.0
mA
-65°C to +150°C
°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent device failure. Functionality at or above these limits is not
implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.
Operating Range
Symbol
Description
VDD
Supply Voltage
TA
Ambient Temperature
Min
USB Mode
Max
Unit
3.3
5.5
V
3.3
3.6
V
0°C
60°C
°C
DC Characteristics
(VDD=5.0V)
Symbol
Description
Test Conditions
Min
Max
Units
VDO = 4.5V
-0.5
0.8
V
2.0
VDD
V
-
0.4
V
VIL
Input LOW Voltage
VIH
Input HIGH Voltage
–
VOL
Output LOW Voltage
VDD = MIN, IOL = 8 mA
VOH
Output HIGH Voltage
VDD = MIN, IOH = -4 mA
2.4
-
V
ILI
Input Leakage Current
VDD = MAX, VIN = VSS to VDD
-5.0
5.0
µA
ILO
Output Leakage Current
VDD = MAX, VOUT = VSS to VDD, CE0- = VIH or CE1 = VIL
-5.0
5.0
µA
Min
Max
Units
-0.5
0.6
V
2.0
VDD
V
-
0.4
V
(VDD=3.3V)
Symbol
Description
Test Conditions
VIL
Input LOW Voltage
VDD = 3.0V
VIH
Input HIGH Voltage
VOL
Output LOW Voltage
VDD = 3.6V, IOL = 4 mA
VOH
Output HIGH Voltage
VDD = 3.0V, IOH = -2 mA
2.4
-
V
ILI
Input Leakage Current
VDD = 3.6V VIN = VSS to VDD
-5.0
5.0
µA
ILO
Output Leakage Current
VDD = 3.6V, VOUT = VSS to VDD, CE0- = VIH or CE1 = VIL
-5.0
5.0
µA
23
Solid State Fingerprint Sensor
Power Supply Consumption
Symbol
Description
Test Conditions
Max
Units
5
mA
(Microprocessor Mode, VDD=5.0V fOSC = 20MHz)
IDD
Digital Current, Dynamic
IDDSB
Digital Current, Standby
1
mA
IDDPDF
Digital Current, Power Down with Auto Finger Detection Enabled
10
µA
IDDPD
Digital Current, Power Down
10
µA
IDDA
Analog Current, Dynamic
20
mA
IDDASB
Analog Current, Standby
12
mA
IDDAPDF
Analog Current, Power Down with Auto Finger Detection Enabled
200
µA
IDDAPD
Analog Current, Power Down
10
µA
(SPI Slave Mode, VDD=5.0V)
IDD
Digital Current, Dynamic
5
mA
IDDSB
Digital Current, Standby
1
mA
IDDPDF
Digital Current, Power Down with Auto Finger Detection Enabled
10
µA
IDDPD
Digital Current, Power Down
10
µA
IDDA
Analog Current, Dynamic
20
mA
IDDASB
Analog Current, Standby
12
mA
IDDAPDF
Analog Current, Power Down with Auto Finger Detection Enabled
200
µA
IDDAPD
Analog Current, Power Down
10
µA
(Microprocessor Mode, VDD=3.3V)
IDD
Digital Current, Dynamic
5
mA
IDDSB
Digital Current, Standby
1
mA
IDDPDF
Digital Current, Power Down with Auto Finger Detection Enabled
10
µA
IDDPD
Digital Current, Power Down
10
µA
IDDA
Analog Current, Dynamic
15
mA
IDDASB
Analog Current, Standby
8
mA
IDDAPDF
Analog Current, Power Down with Auto Finger Detection Enabled
200
µA
IDDAPD
Analog Current, Power Down
10
µA
5
mA
(SPI Slave Mode, VDD=3.3V)
IDD
Digital Current, Dynamic
IDDSB
Digital Current, Standby
1
mA
IDDPDF
Digital Current, Power Down with Auto Finger Detection Enabled
10
µA
IDDPD
Digital Current, Power Down
10
µA
IDDA
Analog Current, Dynamic
15
mA
IDDASB
Analog Current, Standby
8
mA
IDDAPDF
Analog Current, Power Down with Auto Finger Detection Enabled
200
µA
IDDAPD
Analog Current, Power Down
10
µA
24.
MBF200
Power Supply Consumption (continued)
Symbol
Description
Test Conditions
Max
Units
5
mA
(USB Mode, VDD=3.3V)
IDD
Digital Current, Dynamic
IDDSB
Digital Current, Standby
1
mA
IDDPDF
Digital Current, Power Down with Auto Finger Detection Enabled
10
µA
IDDPD
Digital Current, Power Down
10
µA
IDDSPF
Digital Current, USB Suspend with Auto Finger Detection Enabled
10
µA
IDDSP
Digital Current, USB Suspend
10
µA
IDDA
Analog Current, Dynamic
30
mA
IDDASB
Analog Current, Standby
20
mA
IDDAPDF
Analog Current, Power Down with Auto Finger Detection Enabled
200
µA
IDDAPD
Analog Current, Power Down
10
µA
AC Characteristics
Microprocessor Bus Mode
Read Cycle
Symbol
Description
Min
Max
Units
5
35
ns
tACC
Address to Output Delay
tCE
Chip Select to Output Delay
5
35
ns
tOE
Read Enable to Output Delay
5
35
ns
tOH
Output Hold Time from Address, CS0, CS1, or RD, which ever occurs first
5
-
ns
tDF
RD high to Output High Z
-
10
ns
tDF
CS0 high or CS1 low to Output High Z
-
10
ns
Min
Max
Units
Write Cycle
Symbol
Description
tAS
Address Setup to WR low
0
-
ns
tCS
CS0 Setup to WR low
0
-
ns
tCS
CS1 Setup to WR low
0
-
ns
tAH
Address Hold Time from WR high
5
-
ns
tCH
CS0 Hold Time from WR high
0
-
ns
tCH
CS1 Hold Time from WR high
0
-
ns
tWP
WR Pulse Width Low
10
-
ns
tWPH
WR Pulse Width High
10
-
ns
tDS
Data Setup Time to WR low
8
-
ns
tDH
Data Hold Time to WR high
0
-
ns
25
Solid State Fingerprint Sensor
SPI Slave Mode
Symbol
Description
Min
Max
Units
fSCK
SCLK Clock Frequency
-
12
MHz
tCSS
SCS Setup Time
40
-
ns
tCSH
SCS Hold Time
40
-
ns
tWL
SCLK Low
40
-
ns
tWH
SCLK High
40
-
ns
tCS
SCS High Time
40
-
ns
tSU
Data-In Setup Time
20
-
ns
tH
Data-In Hold Time
20
-
ns
tV
Data-Out Valid Time
20
30
ns
tHD
Data-Out Hold Time
0
-
ns
tDIS
Data-Out Disable Time
-
100
ns
Min
Max
Units
-
2
MHz
250
-
ns
SPI Master
Symbol
Description
fSCKM
SCLK Clock Frequency
tCSSM
SCS Setup Time
tCSHM
SCS Hold Time
-
250
ns
tWLM
SCLK Low
-
250
ns
tWHM
SCLK High
-
250
ns
tCSM
SCS High Time
-
250
ns
tSUM
Data-In Setup Time
-
100
ns
tHM
Data-In Hold Time
-
250
ns
tVM
Data-Out Valid Time
-
200
ns
tHDM
Data-Out Hold Time
-
200
ns
tDISM
Data-Out Disable Time
-
300
ns
26.
MBF200
Timing Diagrams
tA C C
A0
CS1
tC E
CS0
tO E
RD
WR
tD F
tO H
D[7:0]
Figure 1.
Microprocessor Mode Read Cycle
2. 7
Solid State Fingerprint Sensor
tA S
tA H
A0
CS1
tC S
tC H
CS0
RD
tW P
tW P H
WR
tD S
tD H
D[7:0]
Figure 2.
Microprocessor Mode Write Cycle
tC S
SCS
tC S S
tW L
tW H
tC S H
SCK
tS U
MOSI
tH
data in
tV
tH D
t DIS
data out
MISO
For read operations only.
Figure 3.
28.
SPI Slave Mode Timing
MBF200
SCS
Command Stage
Address Stage
Data Stage
SCK
Op Code
MOSI
0
0
0
Register Address
Op Code
0
x
1
0
1
a3
a4
a2
a1
Don't Care
a0
0
0
0
x
Data Out
MISO
d7
Figure 4.
d6
d5
d4
d3
d2
d1
d0
SPI Slave Mode Read Operation
SCS
Command Stage
Address Stage
Data Stage
SCK
Op Code
MOSI
0
0
0
Register Address
Op Code
0
x
0
1
0
a3
a4
a2
a1
Data In
a0
0
0
0
d7
d6
d5
d4
d3
d2
d1
d0
High Impedance
MISO
Figure 5.
SPI Slave Mode Write Operation
tC S M
SCS
tC S S M
tW L M
tW H M
tC S H M
SCK
tS U M
MOSI
tH M
data out
tV M
MISO
tH D M
tD I S M
data in
Figure 6.
SPI Master Timing
29
Solid State Fingerprint Sensor
SCS
Command Stage
Address Stage
Data Stage
SCK
Op Code
MOSI
0
0
0
ROM Address
Op Code
0
0
0
1
1
a7
a6
a5
a4
a3
a2
a1
a0
Data In
MISO
d7
Figure 7.
30
SPI Master Read Operation
d6
d0
d7
d6
d0
MBF200
Physical Dimensions
31
Solid State Fingerprint Sensor
Recommended Land Pattern
SEE DETAIL
Z
P
FULL RADIUS
TYPICAL
L
A
W
DETAIL Z
1
Symbol
Description
Dimension
N
Pin Count
80
A
Tip to Tip Dimension
1.074 (27.30)
P
Pitch
.0197 (.50)
L
Pad Length
.065 (1.65)
W
Pad Width
.012 (.30)
Note: Dimensions are in inches (mm)
32.
40
MBF200
Array Orientation
PIN 40
PIN 1
(0, 0)
(255, 0)
MBF200
(0, 299)
PIN 41
(255, 299)
PIN 80
33
Solid State Fingerprint Sensor
VDD1 (Pin 16), VDD2 (Pin 25), and VDD3 (Pin 39) are the digital
power supply pins. VSS1 (Pin 15), VSS2 (Pin 24), and VSS3 (Pin
40) are the ground returns. Place 0.1µF capacitors between digital
power and ground, as close to the pins as possible.
Appendix A
Recommended Power and Ground Connections
The following describes the recommended method for reducing
image noise to get the best image from the sensor.
Input signals that are to be tied high should not be shorted directly
to VDD, but connected through a 1K to 10K ohm resistor in order
to maximize ESD immunity of the sensor. A single resistor may be
used for all inputs that are tied high.
VDDA1 (Pin 1) and VDDA2 (Pin 7) are the analog power supply
pins. VSSA1 (Pin 2) and VSSA2 (Pin 6) are the ground returns.
Connect one bulk capacitor (4.7µF to 10µF) and two 0.1µF
capacitors in parallel between analog power and ground to provide
filtering of low and high frequency noise. Place the bulk capacitor
near VDDA1. Separate VDDA1 and VDDA2 from the digital power
pins through a 10 ohm resistor.
VDD
10Ω
0.1 µF
0.1 µF
0.1 µF
0.1 µF
0.1 µF
4.7 to 10 µF
40
VSS3
34.
39
25
24
16
15
7
VDD3 VDD2 VSS2 VDD1 VSS1 VDDA2
6
VSSA2
2
VSSA1
1
VDDA1
MBF200
APPENDIX B
Recommended MBF200 Sensor Orientation
Mount the MBF200 such that pins 1 through 40 point away the user
and pins 41 through 80 point toward from the user. When a finger is
placed on the sensor, the tip of the finger should be near pins 1
through 40, the cuticle should be centered over the sensor, and the
knuckle should be near pins 41 through 80. This orientation ensures
that fingerprint images will be captured right-side up, not sideways
nor upside down, using Fujitsu’s standard software.
The sensor should be mounted flush with the surrounding surface to
allow the finger to rest flat on the sensor surface and increase the
contact area between the finger and the sensor. If the sensor is
recessed too deeply, only the tip of the finger will be imaged.
It is also recommended that there be a groove or channel to guide the
finger into the proper position so that images are captured with a
uniform orientation.
PIN 40
PIN 1
PIN 41
PIN 80
35