ALPHA AA032P1-A4

Preliminary
29–32 GHz Surface Mount
Medium Power Amplifier
AA032P1-A4
Patent Pending
Features
■ Surface Mount Package
■ 11 dB Gain
■ 24 dBm P1 dB Output Power
■ 100% DC and RF Testing
Description
The AA032P1-A4 is a broadband millimeterwave medium
power amplifier in a rugged surface mount package that
is compatible with high-volume solder installation. The
amplifier is designed for use in millimeterwave
communication and sensor systems as an output stage
or driver in the transmit chain or LO chain when high gain
and high linearity is required. The robust ceramic
surface mount package provides excellent electrical
performance and a high degree of environmental
protection for long-term reliability. All amplifiers are
screened at the operating frequencies prior to shipment
for guaranteed performance. Amplifier is targeted for highvolume millimeterwave applications such as point-to-point
and point-to-multipoint wireless communications systems
and satellite communication systems.
Pin Out
VG N/C VD
RF In
RF Out
AA032P1-A4
YYWW
Orientation
N/C N/C N/C
Indicated by
Missing
Castellations
Electrical Specifications at 25°C (VD = 6 V, VG = -1 V)
Parameter
Symbol
Min.
BW
29
G
9
11
dB
P1 dB
23
24
dBm
9
dB
Bandwidth
Small Signal Gain1
Output Power at 1 dB Gain Compression2
Input Return Loss4
Output Return
RLI
Loss4
Temperature Coefficient of Gain4
Typ.
Max.
Unit
32
GHz
RLO
7
dB
dG/dT
-0.038
dB/C
ID
400
Drain Current3
450
mA
1. Small signal gain over entire bandwidth is measured on 100% of parts.
2. Output power P1 dB is measured at 31 GHz on 100% of parts.
3. Drain current is measured on 100% of parts.
4. Not measured on 100% of parts.
Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 1/02A
1
29–32 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
Typical Performance Data (VD = 6 V, VG = -1 V)
20
20
-55˚C
10
10
+25˚C
+85˚C
(dB)
(dB)
S21
0
S11
-10
0
-10
S22
-20
-20
25
30
35
27
40
29
31
33
Frequency (GHz)
Frequency (GHz)
S-Parameters
Gain vs. Temperature
27
35
26
25
24
P1 dB = 24.3 dBm
@ 31GHz
21
P1 dB (dBm)
Output Power (dBm)
P1 dB = 24.7 dBm @ 30 GHz
18
6.0 V
24
5.5 V
23
22
P1 dB = 23.0 dBm @ 28 GHz
15
21
P1 dB = 23.9 dBm @ 32 GHz
12
20
3
6
9
12
15
18
31
32
Frequency (GHz)
Output Power vs. Input Power
P1 dB vs. Frequency
Absolute Maximum Ratings
0.080
(0.20 mm)
0.291 (7.39 mm)
YYWW
0.026
(0.66 mm)
0.153
(3.87 mm)
0.275 (6.98 mm)
0.040 (1.02 mm)
Characteristic
0.065
(1.65 mm)
0.040
(1.02 mm)
CL
0.014
(0.36 mm)
0.054
(1.37 mm)
2
30
Input Power (dBm)
Outline Drawing
0.306
(7.77 mm)
29
0.037
(0.94 mm)
CL
Value
Operating Temperature (TC)
-55°C to +85°C
Storage Temperature (TST)
-65°C to +125°C
Bias Voltage (VD)
Power In (PIN)
7 VDC
22 dBm
0.145
(3.68 mm)
0.056 (1.42 mm)
0.285
(7.24 mm)
Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 1/02A
29–32 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
Typical S-Parameters at 25°C (VD = 6 V, VG = -1 V)
S11
S21
S12
S22
Frequency
(GHz)
Mag. (dB)
10
-0.5
-94
-35.3
12
-0.7
-158
-50.8
14
-1.0
111
-56.9
16
-1.3
39
-43.2
18
-0.8
-36
-40.3
31
-45.1
20
-0.6
-109
-29.3
17
-39.2
22
-1.0
-165
-15.8
-76
-52.1
24
-2.4
77
-3.6
171
-38.7
25
-2.8
-7
1.4
106
-46.4
-65
-3.3
-55
26
-3.1
-75
5.3
43
-39.8
-37
-2.7
-105
27
-3.5
-136
9.8
-24
-32.0
-75
-2.8
-152
28
-6.1
159
12.7
-104
-28.7
-156
-6.7
162
29
-8.7
121
13.1
179
-28.4
132
-17.0
145
30
-7.8
60
12.6
111
-28.0
77
-16.3
-177
31
-5.7
1
12.1
51
-28.6
22
-19.6
177
32
-5.0
-52
11.9
-13
-28.4
-23
-26.1
118
33
-6.6
-86
10.5
-71
-28.9
-66
-14.2
14
34
-7.5
-129
10.3
-124
-27.7
-114
-9.4
-10
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
Mag. (dB)
Ang. (Deg.)
4
-61.1
-154
-51.1
-114
-0.5
44
176
-0.3
100
0
-55.0
99
-0.4
-37
83
-43.0
84
-0.9
-96
8
-1.3
-147
62
-1.1
166
41
-2.1
104
-48
-3.3
-3
35
-9.8
167
11.0
178
-26.9
-177
-10.8
-39
36
-13.4
143
10.7
111
-26.1
123
-16.7
-114
37
-7.6
163
8.8
39
-26.1
65
-11.9
149
38
-5.8
129
6.3
-25
-23.7
25
-10.7
99
39
-8.7
77
2.2
-87
-21.4
-16
-11.5
47
40
-4.8
23
-0.4
-141
-19.8
-72
-9.2
9
Biasing
For biasing on, adjust VG from 0 to approximately -1 V.
Adjust VD from 0 to desired value (5 V–6 V recommended).
Adjust VG to achieve desired ID (400 mA recommended).
For biasing off, reverse the biasing on procedure.
Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 1/02A
3
29–32 GHz Surface Mount Medium Power Amplifier
AA032P1-A4
Alpha-2TM Surface Mount Package
Handling and Mounting
Millimeterwave components require careful mounting
design to maintain optimal performance. The Alpha-2TM
surface mount package (patent pending) provides a
rugged and repeatable electrical connection using
standard solder techniques.
The -A4 package is one of several parts in the Alpha-2TM
surface mount package family.
DC Connections
Via Holes
to Ground
RF In
RF Out
Handling
The -A4 surface mount package is very rugged. However,
due to ceramic’s brittle nature, one should exercise care
when handling with metal tools. Do not apply heavy
pressure to the lid. Vacuum tools may be used to pick and
place this part.
Only personnel trained in both ESD precautions and
handling precautions should be allowed to handle these
packages.
Package Construction
The -A4 surface mount package consists of a base and
a lid. The package base is ceramic with filled vias and
plated castellations. The package lid is unplated alumina.
The lid seal is epoxy.
Mounting Design
The -A4 surface mount package is installed on top of a printed
circuit board on a specially designed footprint.
DC Connections
Footprint Geometry for -A4 Surface Mount Package.
Mounting footprint geometry for the -A4 package will be
supplied by Alpha Industries in electronic format upon request.
Mounting the Package
The -A4 surface mount package is compatible with highvolume surface mount installation using solder. RF and DC
connections are accomplished with metallized edge
castellations that hold solder fillets. Ground connections are
accomplished by both metallized edge castellations and
filled vias to the bottom of the package. Care should be
taken to ensure that there are no voids or gaps in the solder
so that good RF, DC and ground contact is maintained.
DC Bias Lines
(Up to 3 per side)
Electrically & Thermally
Conductive Ground Plane
RF In
RF Out
DC Bias Lines
(Up to 3 per side)
Printed Circuit Board
Rogers 4003,
0.008" (0.20 mm) Thick
or Equivalent
-A4 Surface Mount Package Installation.
4
Alpha Industries, Inc. [978] 241-7000 • Fax [978] 241-7906 • Email sales@alphaind.com • www.alphaind.com
Specifications subject to change without notice. 1/02A