CDI-DIODE CD6761

•
1N5819 AND 1N6761 AVAILABLE IN JANHC AND JANKC PER MIL
PRF-19500/586
• 1 AMP SCHOTTKY BARRIER RECTIFIER CHIPS
• SILICON DIOXIDE PASSIVATED
CD5817 thru CD5819
and
CD6759 thru CD6761
and
CD1A20 thru CD1A100
• COMPATIBLE WITH ALL WIRE BONDING AND DIE ATTACH TECHNIQUES,
WITH THE EXCEPTION OF SOLDER REFLOW
MAXIMUM RATINGS
Operating Temperature: -55°C to +125°C
Storage Temperature: -55°C to +150°C
Average Rectified Forward Current: 1.0 AMP @ +55°C
Derating: 14.3 mA / °C above +55°C
BACKSIDE IS CATHODE
FIGURE 1
CDI
TYPE
NUMBER
WORKING PEAK
REVERSE
VOLTAGE
MAXIMUM FORWARD VOLTAGE
MAXIMUM REVERSE
LEAKAGE CURRENT
AT RATED VOLTAGE
VRWM
[email protected]
[email protected]
I [email protected]°C
I [email protected]°C
VOLTS
VOLTS
VOLTS
mA
mA
CD5817
20
0.36
0.60
0.10
5.0
CD5818
30
0.36
0.60
0.10
5.0
CD5819
40
0.36
0.60
0.10
5.0
JHC, JKC
45
0.34
0.49
0.05
5.0
DESIGN DATA
METALLIZATION:
Top: (Anode).........................Al
Back: (Cathode) ....................Au
AL THICKNESS................25,000 Å Min
GOLD THICKNESS... .........4,000 Å Min
5819
CD6759
60
0.38
0.75
0.10
6.0
CD6760
80
0.38
0.75
0.10
6.0
CD6761
100
0.38
0.75
0.10
6.0
JHC, JKC
100
0.38
0.69
0.10
12.0
CD1A20
20
0.36
0.60
0.10
5.0
CD1A30
30
0.36
0.60
0.10
5.0
CD1A40
40
0.36
0.60
0.10
5.0
CD1A50
50
0.36
0.60
0.10
5.0
CD1A60
60
0.38
0.75
0.10
12.0
CHIP THICKNESS.............. ........10 Mils
TOLERANCES: ALL
Dimensions + 2 mils
6761
CD1A80
80
0.38
0.75
0.10
12.0
CD1A100
100
0.38
0.75
0.10
12.0
22 COREY STREET, MELROSE, MASSACHUSETTS 02176
PHONE (781) 665-1071
FAX (781) 665-7379
WEBSITE: http://www.cdi-diodes.com
E-mail: [email protected]
CD5817
thru CD5819
and
CD6759 thru CD6761
and
CD1A20 thru CD1A100
TYPICAL REVERSE LEAKAGE CURRENT AT RATED PIV (PULSED)
10.0
IR, REVERSE CURRENT (mA)
1.0
0.1
CD5819
CD5818
CD5817
0.01
0.001
+25
+50
+75
+100
+125
TJ, JUNCTION TEMPERATURE (°C)
FIGURE 1
TYPICAL FORWARD VOLTAGE
IF, FORWARD CURRENT, INSTANTANEOUS (AMPS)
100.0
10.0
1.0
0.1
0.01
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VF, FORWARD VOLTAGE, INSTANTANEOUS (VOLTS)
FIGURE 2
1.1