MP04TT600 MP04TT600 Dual Thyristor Water Cooled Module Preliminary Information DS5466-1.1 June 2001 FEATURES ■ Dual Device Module ■ Electrically Isolated Package ■ Pressure Contact Construction ■ International Standard Footprint ■ Alumina (Non Toxic) Isolation Medium ■ Integral Water Cooled Heatsink KEY PARAMETERS VDRM IT(AV) ITSM(per arm) IT(RMS) Visol 5 (G1) 1800V 580A 14000A 912A 3000V 4 (K1) 3 (A) 6 (G2) APPLICATIONS ■ Motor Control ■ Controlled Rectifier Bridges ■ Heater Control ■ AC Phase Control 7 (K2) 1 (AK) 2 (A) Fig. 1 TT Circuit diagram VOLTAGE RATINGS Type Number MP04TT600-18 MP04TT600-17 MP04TT600-16 MP04TT600-15 Repetitive Peak Voltages VDRM VRRM V 1800 1700 1600 1500 Conditions Tvj = 0˚ to 125˚C, IDRM = IRRM = 50mA VDSM = VRSM = Module outline type code: MP04-W3 Module outline type code: MP04-W3A VDRM = VRRM + 100V respectively Lower voltage grades available ORDERING INFORMATION Order As: MP04TT600-XX-W2 MP04TT600-XX-W3 MP04TT600-XX-W3A 1/4 - 18 NPT connection 1/4 - 18 NPT connection 1/4 - 18 NPT water connection thread XX shown in the part number about represents VDRM/100 selection required, eg. MP04TT600-27-W2 Note: When ordering, please use the complete part number. Module outline type code: MP04-W2 (See Package Details for further information) Fig. 2 Module package variants - (not to scale) 1/8 www.dynexsemi.com MP04TT600 ABSOLUTE MAXIMUM RATINGS - PER ARM Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability. Symbol IT(AV) IT(RMS ITSM I2t ITSM I2t Visol Parameter Mean on-state current RMS value Test Conditions Units Half wave resistive load, Twater (in) = 25˚C 650 A 4.5 Ltr/min Twater (in) = 40˚C 580 A Twater (in) = 25˚C @ 4.5 Ltr/min 1020 A Twater (in) = 40˚C @ 4.5 Ltr/min 912 A 10ms half sine, Tj = 125˚C 14 kA VR = 0 0.975x106 A2s 10ms half sine, Tj = 125˚C 11.2 kA VR = 50% VDRM 0.625x106 A2s 3000 V Surge (non-repetitive) on-current I2t for fusing Surge (non-repetitive) on-current I2t for fusing Commoned terminals to base plate. AC RMS, 1 min, 50Hz Isolation voltage Max. THERMAL AND MECHANICAL RATINGS Parameter Symbol Rth(j-w) Max. Units dc, 4.5 Ltr/min - 0.102 ˚C/kW (per thyristor) Half wave, 4.5 Ltr/min - 0.106 ˚C/kW 3 Phase, 4.5 Ltr/min - 0.112 ˚C/kW Reverse (blocking) - 125 ˚C –40 125 ˚C 6(53) - Nm (lb.ins) Virtual junction temperature Tstg Storage temperature range Screw torque Mounting - M6 Electrical connections - M10 - Min. Thermal resistance - junction to water Tvj - Test Conditions Weight (nominal) - - 12(106) Nm (lb.ins) - Refer to drawings g 2/10 www.dynexsemi.com MP04TT600 DYNAMIC CHARACTERISTICS Parameter Symbol Test Conditions Min. Max. Units Peak reverse and off-state current At VRRM/VDRM, Tj = 125˚C - 50 mA dV/dt Linear rate of rise of off-state voltage To 67% VDRM, Tj = 125˚C - 1000 V/µs dI/dt Rate of rise of on-state current From 67% VDRM to 500A, gate source 10V, 5Ω - 500 A/µs IRRM/IDRM tr = 0.5µs, Tj = 125˚C VT(TO) rT Threshold voltage At Tvj = 125˚C - 0.85 V On-state slope resistance At Tvj = 125˚C - 0.38 mΩ Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these figures due to the impedance of the busbar from the terminal to the semiconductor. GATE TRIGGER CHARACTERISTICS AND RATINGS Symbol Parameter Test Conditions Max. Units VGT Gate trigger voltage VDRM = 5V, Tcase = 25oC 3.5 V IGT Gate trigger current VDRM = 5V, Tcase = 25oC 200 mA VGD Gate non-trigger voltage At VDRM Tcase = 125oC 0.25 V VFGM Peak forward gate voltage Anode positive with respect to cathode 30 V VFGN Peak forward gate voltage Anode negative with respect to cathode 0.25 V VRGM Peak reverse gate voltage 5 V IFGM Peak forward gate current Anode positive with respect to cathode 10 A PGM Peak gate power See table fig. 5 150 W PG(AV) Mean gate power 10 W - - 3/8 www.dynexsemi.com MP04TT600 1 2 1: Tj = 125˚C Min 2: Tj = 125˚C Max 2000 1500 500 0 0.5 1.0 1.5 2.0 Instantaneous on-state voltage VT - (V) 2.5 I2t = Î2 x t 2 20 700 15 I2t 5 10 1 ms 2 3 45 10 400 20 30 50 Cycles at 50Hz Duration Fig. 4 Surge (non-repetitive) on-state current vs time (with 50% VRSM at Tcase = 125˚C) Up lim per it 9 0W 10 W 50 W 20 W 10 5W Pulse width Frequency Hz Table gives pulse power PGM in Watts µs 50 100 400 100 150 150 150 200 150 150 125 500 150 150 100 1ms 150 100 25 10ms 20 - - 9% 0.1 0.001 0.1 0.08 0.06 0.04 Lo 0.01 Tj = 25˚C Tj = -40˚C % it 99 lim wer Tj = 125˚C 1 VGD Thermal resistance, Junction to water, Rth(j-w) - (°C/W) 0.12 100 Gate trigger voltage, VGT - (V) 500 0 1 Fig. 3 Maximum (limit) on-state characteristics 10 600 10 I2t value - (A2s x 103) 1000 Peak half sine wave on-state current - (kA) 25 Measured under pulse conditions Instantaneous on-state current IT - (A) 2500 Region of certain 0.1 Gate trigger current, IGT - (A) Fig. 5 Gate characteristics triggering 1 0.02 10 IFGM 0 0.001 0.01 0.1 1 10 Time (Seconds) 100 1000 Fig. 6 Transient thermal impedance - dc 4/10 www.dynexsemi.com MP04TT600 2200 Conduction Angle 30° 2000 60° 90° 120° 1800 180° Conduction Angle 30° 60° 90° 120° 1800 180° DC 1600 2000 Power dissipation - (Watts, per arm) Power dissipation - (Watts, per arm) 2200 1600 1400 1200 1000 800 600 1400 1200 1000 800 600 400 400 200 200 0 0 200 400 600 800 1000 0 0 1200 Sine wave current (Average, per arm) Fig. 7 On-state power loss per arm vs on-state current at specified conduction angles, sine wave 50/60Hz 1600 Fig. 8 On-state power loss per arm vs on-state current at specified conduction angles, square wave 50/60Hz Maximum permissible water inlet temperature - (°C) Maximum permissble inlet water temperature - (°C) 400 600 800 1000 1200 1400 Square wave current - (Average, per arm) 100 100 90 80 70 60 50 40 30 20 Conduction Angle 30° 60° 10 90° 120° 180° 0 0 100 200 300 400 500 600 Sine wave current (Average, per arm) 200 700 Fig. 9 Maximum permissible water inlet temperature vs on-state current at specified conduction angles, sine wave 50/60Hz 90 80 70 60 50 40 30 Conductin Angle 30° 60° 90° 10 120° 180° DC 0 0 100 200 300 20 400 500 600 700 800 900 Square wave current (Average, per arm) Fig. 10 Maximum permissible water inlet temperature vs on-state current at specified conduction angles, square wave 50/60Hz 5/8 www.dynexsemi.com MP04TT600 6000 4000 90 90 3000 80 2500 70 2000 60 1500 50 1000 40 5000 500 0 500 Power resistive load Power inductive load Temp resistive load Temp inductive load 600 Total device power loss - (W) Max permissible case temp. - (˚C) Total device power loss - (W) 80 4000 70 60 3000 50 2000 40 1000 30 30 20 700 800 900 1000 1100 1200 1300 1400 1500 DC bridge output current - (A dc) Fig. 11 50/60Hz single phase bridge DC output current vs power loss and maximum permissible water inlet Max permissible case temp. - (˚C) 3500 Power resistive or inductive load Temp resistive or inductive load 0 20 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 DC bridge output current - (A dc) Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current vs power loss and maximum permissible water inlet 6/10 www.dynexsemi.com MP04TT600 PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws Nominal weight: 2060g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP04-W2 7/8 www.dynexsemi.com MP04TT600 PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws Nominal weight: 2060g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP04-W3 8/10 www.dynexsemi.com MP04TT600 PACKAGE DETAILS For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE. Recommended fixings for mounting: M6 socket head cap screws Nominal weight: 2530g Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately. Module outline type code: MP04-W3A 9/8 www.dynexsemi.com MP04TT600 POWER ASSEMBLY CAPABILITY The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and current capability of Dynex semiconductors. An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today. HEATSINKS The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office. http://www.dynexsemi.com e-mail: [email protected] HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2001 Publication No. DS5466-1 Issue No. 1.1 June 2001 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification. This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. 10/10 www.dynexsemi.com