IXYS IXTK62N25

Advance Technical Information
IXTK 62N25
High Current
MegaMOSTMFET
VDSS
ID25
= 250 V
= 62 A
Ω
= 35 mΩ
RDS(on)
N-Channel Enhancement Mode
Symbol
Test conditions
Maximum ratings
VDSS
TJ = 25°C to 150°C
250
V
VDGR
TJ = 25°C to 150°C; RGS = 1.0 MΩ
250
V
VGS
Continuous
±20
V
VGSM
Transient
±30
V
ID25
IDM
IAR
TC = 25°C
TC = 25°C, pulse width limited by TJM
TC = 25°C
62
248
62
A
A
A
EAR
EAS
TC = 25°C
TC = 25°C
45
1.5
mJ
J
dv/dt
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 2 Ω
5
V/ns
PD
TC
390
W
TJ
-55 ... +150
°C
TJM
Tstg
150
-55 ... +150
°C
°C
300
°C
= 25°C
TL
1.6 mm (0.063 in.) from case for 10 s
Md
Mounting torque
Weight
TO-264
0.7/6
Nm/lb.in.
10
g
TO-264 AA (IXTK)
D (TAB)
G
D
S
G = Gate
S = Source
D
= Drain
Tab = Drain
Features
• Low RDS (on) HDMOSTM process
• Rugged polysilicon gate cell structure
• International standard package
• Fast switching times
Applications
Symbol Test Conditions
(TJ = 25°C unless otherwise specified)
Characteristic Values
Min. Typ.
Max.
VDSS
V GS = 0 V, ID = 1 mA
VGS(th)
V DS = VGS, ID = 250 µA
IGSS
V GS = ±20 V DC, VDS = 0
IDSS
V DS = VDSS
V GS = 0 V
RDS(on)
V GS = 10 V, ID = 0.5 ID25
Pulse test, t ≤ 300 ms, duty cycle d ≤ 2%
© 2002 IXYS All rights reserved
250
2.0
TJ = 25°C
TJ = 125°C
V
•
•
•
Motor controls
DC choppers
Switched-mode power supplies
Advantages
4.0
V
±100
nA
•
50 µA
2 mA
•
•
Easy to mount with one screw
(isolated mounting screw hole)
Space savings
High power density
35 mΩ
98877A (02/02)
IXTK 62N25
Symbol
Test Conditions
(T J = 25°C unless otherwise specified)
gfs
Characteristic values
Min. Typ.
Max.
V DS = 10 V; ID = 0.5 ID25, pulse test
Ciss
50
S
6600
pF
1125
pF
Crss
270
pF
td(on)
30
ns
Coss
VGS = 0 V, VDS = 25 V, f = 1 MHz
35
tr
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25
td(off)
RG = 1.5 Ω (External)
25
ns
115
ns
15
ns
tf
Qg(on)
Qgs
240
nC
55
nC
85
nC
VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25
Qgd
0.30 K/W
RthJC
0.15
RthCK
Source-Drain Diode
K/W
TO-264 AA Outline
Dim.
A
A1
A2
b
b1
b2
c
D
E
e
J
K
L
L1
P
Q
Q1
R
R1
S
T
Millimeter
Min.
Max.
4.82
5.13
2.54
2.89
2.00
2.10
1.12
1.42
2.39
2.69
2.90
3.09
0.53
0.83
25.91
26.16
19.81
19.96
5.46 BSC
0.00
0.25
0.00
0.25
20.32
20.83
2.29
2.59
3.17
3.66
6.07
6.27
8.38
8.69
3.81
4.32
1.78
2.29
6.04
6.30
1.57
1.83
Min.
Inches
Max.
.190
.202
.100
.114
.079
.083
.044
.056
.094
.106
.114
.122
.021
.033
1.020
1.030
.780
.786
.215 BSC
.000
.010
.000
.010
.800
.820
.090
.102
.125
.144
.239
.247
.330
.342
.150
.170
.070
.090
.238
.248
.062
.072
Ratings and Characteristics
(TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
Symbol
Test Conditions
IS
VGS = 0V
ISM
Repetitive; pulse width limited by TJM
VSD
IF = IS, VGS = 0 V,
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
t rr
IF = 30A, -di/dt = 100 A/µs, VR = 100V
62
A
248
A
1.5
V
360
ns
6
µC
Qrr
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,486,715
5,381,025
6,306,728B1