INTEGRATED CIRCUITS DATA SHEET UBA2007 Charge switch Product specification 2003 Oct 01 Philips Semiconductors Product specification Charge switch UBA2007 CONTENTS 10 CHARACTERISTICS 11 APPLICATION INFORMATION Application diagram Soft switching Current measurement possibility Drop voltage dependence 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 11.1 11.2 11.3 11.4 5 BLOCK DIAGRAM 12 PACKAGE OUTLINE 6 PINNING 13 SOLDERING 7 FUNCTIONAL DESCRIPTION 13.1 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 Control OFF mode SHUTDOWN mode SLOW CHARGE mode FAST CHARGE mode REVERSE mode REVERSE and SLOW CHARGE mode REVERSE and FAST CHARGE mode Introduction to soldering surface mount packages Reflow soldering Wave soldering Manual soldering Suitability of surface mount IC packages for wave and reflow soldering methods 8 LIMITING VALUES 9 THERMAL CHARACTERISTICS 2003 Oct 01 13.2 13.3 13.4 13.5 2 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS Philips Semiconductors Product specification Charge switch 1 UBA2007 FEATURES 2 • Very low ohmic charge switch (0.25 Ω) with soft switching and adjustable current limitation APPLICATIONS • Charging circuits. • Very low ohmic reverse switch (0.25 Ω) with built-in current limitation 3 GENERAL DESCRIPTION The UBA2007 is an intelligent charge switch IC for pulse mode charging applications. With its integrated low ohmic power switch it is designed for charging of 1-cell Li-Ion or 3-cell NiMH batteries in either a pre-charge or fast charge mode. The reverse mode of the UBA2007 allows the supply of accessories connected to the charger pin. Several integrated safety mechanisms such as current limitation, overvoltage protection, thermal protection and ESD guarantee fail-safe operation. • 130 mA pre-charge current • Battery overvoltage and undervoltage protection • Charger overvoltage protection of up to +20 V and reverse polarity protection down to −20 V • On-chip thermal protection • Charger detection • Built-in current sensing • Small 3 × 3 mm HVSON10 package with excellent thermal properties • The UBA2007 is qualified according to the IEC 61000-4-2 standard for ESD performance. 4 ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UBA2007TK/N2 2003 Oct 01 HVSON10 DESCRIPTION plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 × 3 × 0.85 mm 3 VERSION SOT650-1 Philips Semiconductors Product specification Charge switch 5 UBA2007 BLOCK DIAGRAM handbook, full pagewidth CHG CHG fast charge mode 6 7 4 5 reverse mode BAT BAT slow charge mode fast charge mode current limit CHGOK_N MUX CHG 6V BAT Tmax SWMOD REVMOD REVMOD BAT temp CURMOD 1 8 CHG DIGITAL CONTROL 2.5 V 10 UBA2007 9 2 3 MRC312 VSS Fig.1 Block diagram. 2003 Oct 01 4 RLIMF Philips Semiconductors Product specification Charge switch 6 UBA2007 PINNING SYMBOL PIN DESCRIPTION RLIMF 1 FAST CHARGE mode current limiting resistor; output current source REVMOD 2 REVERSE mode control; see Table 1 for operating modes; digital input VSS 3 ground BAT 4 battery pin; power input/output BAT 5 battery pin; power input/output CHG 6 charger input/REVERSE mode output; power input/output CHG 7 charger input/REVERSE mode output; power input/output CHGOK_N 8 charger detection output; if REVMOD is LOW, the output is in high-impedance state when VCHG < 2.5 V; if REVMOD is HIGH the output is in high-impedance state when VCHG < VBAT; open drain output SWMOD 9 PWM mode input; see Table 1 for operating modes; digital input 160 kΩ pull-down CURMOD 10 charge mode input; see Table 1 for operating modes; digital input 160 kΩ pull-down handbook, halfpage BAT 5 6 CHG 7 CHG 8 CHGOK_N SWMOD BAT 4 VSS 3 REVMOD 2 9 RLIMF 1 10 CURMOD UBA2007TK terminal 1 index area MRC313 This diagram is a bottom view For mechanical specification of HVSON10 package, see Chapter 12. Fig.2 Pin configuration. 2003 Oct 01 5 Philips Semiconductors Product specification Charge switch 7 UBA2007 FUNCTIONAL DESCRIPTION 7.1 Control The functionality of the UBA2007 is determined by the state of the three digital control signals and the status of the protection circuits as shown in Table 1. The digital control signals CURMOD and SWMOD have an internal pull-down resistor to define the state of the input pins when the controlling circuit is not operational. Table 1 UBA2007 operation state as function of the digital control signals; note 1 CURRENT DIRECTION(2) CUR MOD SW MOD REV MOD HIGH TEMP HIGH BAT CHGOK_N VBAT > 3.1 V X X X yes X X X SHUTDOWN switch high ohmic none X X X X yes X X SHUTDOWN switch high ohmic none X X L no no H X OFF switch high ohmic none L L L no no X X OFF switch high ohmic none H L L no no L X SLOW CHARGE current source charger to battery L H L no no L X FAST CHARGE switch low ohmic charger to battery H H L no no L X SLOW and FAST CHARGE switch low ohmic charger to battery L L H no no X yes REVERSE switch low ohmic battery to charger L L H no no X no SHUTDOWN switch high ohmic none H L H no no L X REVERSE and SLOW CHARGE current source charger to battery H L H no no H yes REVERSE and SLOW CHARGE switch low ohmic battery to charger H L H no no H no REVERSE and SLOW CHARGE switch high ohmic none L H H no no L X REVERSE and FAST CHARGE switch low ohmic charger to battery L H H no no H yes REVERSE and FAST CHARGE switch low ohmic battery to charger L H H no no H no REVERSE and FAST CHARGE switch high ohmic none 2003 Oct 01 6 MODE FUNCTION Philips Semiconductors Product specification Charge switch UBA2007 CUR MOD SW MOD REV MOD HIGH TEMP HIGH BAT CHGOK_N VBAT > 3.1 V H H H no no L X REVERSE and SLOW and FAST CHARGE switch low ohmic charger to battery H H H no no H yes REVERSE and SLOW and FAST CHARGE switch low ohmic battery to charger H H H no no H no REVERSE and SLOW and FAST CHARGE switch high ohmic none MODE FUNCTION CURRENT DIRECTION(2) Notes 1. X = don’t care; L = LOW voltage level; H = HIGH voltage level. 2. Currents in the other direction are blocked. 7.2 OFF mode The SLOW CHARGE mode is stopped when the voltage on the BAT pin increases above the maximum battery voltage or when a too high die temperature occurs. In the OFF mode the current path between charger and battery is fully switched off. In addition all internal circuitry is switched off. The battery is not loaded by the UBA2007 in this situation. 7.5 In the FAST CHARGE mode the switch (see Fig.1) is turned on slowly by the internal circuitry. The FAST CHARGE mode is entered when the SWMOD input signal is HIGH. The OFF mode is entered if: • SWMOD, CURMOD and REVMOD are LOW. • REVMOD is LOW and CHGOK_N is HIGH. 7.3 The current through the switch is monitored by the current limiting circuit. When this current exceeds the predefined current limit, it is kept constant by reducing the drive voltage of the switch. SHUTDOWN mode The SHUTDOWN mode corresponds to switching off the charging path between the pins BAT and CHG. The circuit will enter the SHUTDOWN mode in the following cases: The current limit is adjustable, from 50 mA to 2 A, through an external resistor connected to the RLIMF pin. The voltage on RLIMF is proportional to the current flowing through the switch (see Section 11.3). • Overvoltage detected on pin BAT • Undervoltage detected on pin BAT while in REVERSE mode • Overheat detected on the die. The FAST CHARGE mode is stopped when the voltage on the BAT pin increases above the maximum battery voltage or when a too high die temperature occurs. In the case of overvoltage shutdown, the state is latched internally and can be reset only by disconnecting the charger wall plug. 7.4 Attention: RLIMF cannot trim the current limit while in SLOW CHARGE or REVERSE modes. SLOW CHARGE mode Remark: The dissipation inside the UBA2007 will increase strongly when the current limitation is activated, this might lead to activation of the thermal protection. In the SLOW CHARGE mode a constant current is applied to the battery. SLOW CHARGE mode is entered when the SWMOD and REVMOD input pins are made LOW, pin CURMOD is HIGH, the charger input voltage is at least 2.5 V and VCHG > VBAT. 2003 Oct 01 FAST CHARGE mode 7 Philips Semiconductors Product specification Charge switch 7.6 UBA2007 REVERSE mode 7.7 The REVERSE mode switch is activated when the REVMOD input is pulled HIGH. REVERSE and SLOW CHARGE mode The REVERSE and SLOW CHARGE mode corresponds to the SLOW CHARGE mode if a charger is connected to pin CHG. When no charger is present, this mode is equivalent to the REVERSE mode. The current through the REVERSE mode switch is monitored by the current limiting circuit. This current limiting circuit reduces the drive voltage for the REVERSE mode switch when the current exceeds the set current limit resulting in a constant current behaviour of the REVERSE mode switch. 7.8 REVERSE and FAST CHARGE mode The REVERSE and FAST CHARGE mode corresponds to the FAST CHARGE mode if a charger is connected to pin CHG. When no charger is present, this mode is equivalent to the REVERSE mode. When the current flows from the charger to the battery, the current limit can be adjusted from 50 mA to 2 A, using the external resistor RRLIMF. When VBAT < 2.7 V the REVERSE mode is automatically disabled and the UBA2007 returns to SHUTDOWN mode (see Fig.3). Remark: The dissipation inside the UBA2007 will increase strongly when the current limitation is activated, this might lead to activation of the thermal protection. handbook, full pagewidth VBAT (V) hysteresis (VBAT(rev)(hys)) <3.1 V >2.7 V REVERSE mode SHUTDOWN mode REVERSE mode t MRC314 Fig.3 Reverse mode behaviour as a function of VBAT. 2003 Oct 01 8 Philips Semiconductors Product specification Charge switch UBA2007 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT VCHG charger input voltage −20 +20 V VBAT, VRLIMF battery input voltage and voltage on pin RLIMF −0.5 +6 V IBAT(max), ICHG(max) maximum current through pins BAT and CHG − 2.5 A VCURMOD, VSWMOD, VREVMOD, VCHGOK_N voltage on pins CURMOD, SWMOD, REVMOD and CHGOK_N −0.5 +5 V II input current at any input −10 +10 mA IO output current at any output −10 +10 mA Tamb ambient temperature −40 +85 °C Tstg storage temperature −55 +150 °C Vesd electrostatic discharge voltage JEDEC standard class 2; all pins HBM; note 1 − ±2500 V MM; note 2 − ±200 V CD (LVL2); note 3 − ±4000 V AD (LVL3); note 4 − ±8000 V IEC 61000-4-2 standard; pins BAT and CHG Notes 1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor. 2. Machine model: equivalent to discharging a 200 pF capacitor via a 0 Ω resistor. 3. Contact Discharge (Level 2): equivalent to discharging, through contact, a 150 pF capacitor via a 330 Ω resistor. 4. Air Discharge (Level 3): equivalent to discharging, through the air, a 150 pF capacitor via a 330 Ω resistor. 9 THERMAL CHARACTERISTICS SYMBOL Rth(j-c) PARAMETER thermal resistance from junction to case CONDITIONS note 1 VALUE UNIT 22(2) K/W Notes 1. HVSON10 is mounted to a water-cooled heatsink with the topside of the package. Package is mounted to a 4-layer printed-circuit board and exposed to still air. 2. For a typical printed-circuit board of a handset the total thermal resistance will be higher. For correct operation up to 85 °C ambient temperature the total thermal resistance must not exceed 100 K/W. 2003 Oct 01 9 Philips Semiconductors Product specification Charge switch UBA2007 10 CHARACTERISTICS VSS = 0 V; Tamb = −40 to +85 °C; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP.(1) MAX. UNIT Charge switch VCHG charger input voltage note 2 −20 − +20 V VBAT battery input voltage note 3 0 − 6.0 V IBAT current through pin BAT OFF mode; VBAT = 5 V; VCHG = 0 V − 5 10 µA SHUTDOWN after overheat − 15 30 µA SHUTDOWN after overvoltage − − 1 mA SHUTDOWN after undervoltage − − 20 µA SLOW CHARGE mode; VBAT = 5 V; VCHG = floating − 5 10 µA REVERSE mode; ICHG = 0 A; VBAT > 3.1 V − 90 150 µA OFF mode and SHUTDOWN − mode; VCHG = 2.5 V to 10.5 V; VBAT = 0 V to 5.7 V − 400 µA OFF mode and SHUTDOWN mode; VCHG = 12 V to 20 V; VBAT = 0 V to 5.7 V − − 5 mA FAST CHARGE mode; IBAT = 0 A; VCHG = 3.6 V − − 140 µA ICHG current through pin CHG ICHG(det) minimum charge current detection REVMOD = HIGH; ICHG → BAT; note 4 − 0.1 4 mA VCHG(det) minimum charge voltage detection REVMOD = LOW; note 3 1.1 2 2.5 V ICHG(slow) slow charge current VCHG > VBAT + 1 V VCHG = 2.5 V to 7 V 120 145 180 mA VCHG = 7 V to 20 V 90 140 190 mA CURMOD = HIGH; SWMOD = LOW; ICHG(fast) = 50 mA to 2 A −30 − +10 % SWMOD = HIGH; VCHG-BAT > 400 mV; RRLIMF = 680 Ω; note 5 0.58 0.73 0.88 A ICHG(fast)(lim) current limit of the fast charge current VRLIMF(acc) absolute accuracy of voltage sensed on pin RLIMF ICHG(fast) = 1.25 A; notes 6 and 7 −10 − +30 % VRLIMF(lin) linearity of voltage sensed on pin RLIMF ICHG(fast) = 1.25 A; notes 6 and 7 −10 − +10 % Ilim(rev) current limit REVERSE mode note 8 450 700 950 mA VBAT(rev) minimum battery voltage for REVERSE mode activation including hysteresis 2.7 − 3.1 V VBAT(rev)(hys) VBAT(rev) hysteresis − 200 − mV 2003 Oct 01 10 Philips Semiconductors Product specification Charge switch SYMBOL UBA2007 PARAMETER CONDITIONS MIN. TYP.(1) MAX. UNIT − 0.22 0.36 V voltage between pins BAT and IBAT = 0.4 A; VBAT = 3.6 V CHG in REVERSE mode 0.1 0.2 0.25 V Irev(slow) reverse current in SLOW CHARGE mode CURMOD = HIGH; SWMOD = LOW; VCHG = 0 V − − 5 µA Irev(fast) reverse current in FAST CHARGE mode SWMOD = HIGH; VCHG = 0 V − − 5 µA Irev(rev) reverse current in REVERSE mode CURMOD = LOW; − SWMOD = LOW; REVMOD = HIGH; VBAT = 0 V − 5 µA ∆I/∆ton(fast) soft switching on in FAST CHARGE mode ICHG ramps up from 0 A to 2 A; 0.2 note 9 − 3 A/ms ∆I/∆toff(fast) switching off in FAST CHARGE mode ICHG ramps down from 2 A to 0 A; note 9 20 − 80 A/ms ∆I/∆ton(rev) soft switching speed in REVERSE mode VBAT > 3.2 V, ICHG ramps up from 0 A to 0.4 A; note 9 0.5 − 5 A/ms ∆I/∆toff(rev) switching off in REVERSE mode VBAT > 3.2 V, ICHG ramps 10 down from 0.4 A to 0 A; note 9 40 80 A/ms Emax maximum energy dissipation capability of the CHG pin note 10 VCHG-BAT(fast) voltage between pins CHG and BAT in FAST CHARGE mode VBAT-CHG(rev) ICHG = 0.9 A during fast switch off; note 11 − − 1 mJ during smooth switch off − − 2 mJ Ptot total power dissipation note 12 − − 600 mW VBAT(max) detection threshold to disable charging notes 8 and 13 5.3 5.5 5.7 V CHGOK_N output IOL maximum output current − − 500 µA VOL maximum output voltage with output current = IOL − − 200 mV ILOZ leakage current in high-impedance state VO = 5 V − − 1 µA Control inputs: pins CURMOD, SWMOD and REVMOD VIH HIGH-level input voltage 1.4 − 5 V VIL LOW-level input voltage 0 − 0.4 V 100 200 300 kΩ − − 1 µA CONTROL INPUTS: PINS CURMOD AND SWMOD Rpd pull-down resistor CONTROL INPUT: PIN REVMOD IIL 2003 Oct 01 LOW-level input current VIN = 0 V 11 Philips Semiconductors Product specification Charge switch SYMBOL UBA2007 PARAMETER CONDITIONS MIN. TYP.(1) MAX. UNIT Temperature high sensor Tmax maximum die temperature 135 150 165 °C Thys hysteresis temperature 15 20 25 °C Notes 1. Values are specified at Tamb = 25 °C, VCHG = 6 V, VBAT = 3.6 V, unless specified differently. They are validated by product characterization based on measurements on sample basis. 2. If VCHG < 0 V (OFF mode) it is guaranteed that the battery stays completely protected and the discharge current is maximum 10 µA. 3. For proper operation VCHG > 2.5 V or VBAT > 2.5 V. 4. When ICHG = 0 A and REVMOD = HIGH then CHGOK_N = HIGH. 500 5. RRLIMF can be approximated with this equation: R RLIMF = ------------------------------ . I CHG(fast)(lim) I CHG × R RLIMF 6. VRLIMF can be approximated with this equation: V RLIMF = -----------------------------------. 1000 7. Test is done for 3 currents: 50 mA, 450 mA and 900 mA. 8. Contact Philips Semiconductors if a different value is required. 9. Values are measured between 10 % and 90 %. 10. The voltage peak due to inductive flyback is clamped internally at 30 V. This will not damage the IC when the dissipated energy does not exceed the specified value. 11. Fast switch off occurs for overvoltage condition on pin BAT. 12. For a typical printed-circuit board of a handset with a total (printed-circuit board + package) thermal resistance of 100 K/W and 85 °C ambient temperature. 13. To reset the overvoltage protection state it is required to unplug the charger wall plug (VCHG < 2.5 V). 2003 Oct 01 12 Philips Semiconductors Product specification Charge switch UBA2007 11 APPLICATION INFORMATION 11.1 Application diagram handbook, full pagewidth (1) ACCESSORIES CHARGER WALL PLUG CHG 6 CHG 7 10 9 8 CURMOD MBCSLOW SWMOD MBCFAST AUXON CHGOK_N VBAT (or BATVOLT) RLIMF 1 PCF50604 xxVIN UBA2007 yyVIN I2C-bus 4 2 5 BAT REVMOD GPIOx GPIOx BAT HOST CONTROLLER MRC315 An external capacitor can be added on VCHG (typically 10 nF) to prevent any oscillation of the pre-charge current. This applies only when using a linear charger. Fig.4 UBA2007 in combination with the PCF50604 PMU. 11.2 Soft switching MGX394 handbook, full pagewidth T SWMOD Ch1 2.00 V Limit set to 1 A (1) I CHG Ch4 500 mA/Ω 200 µs/div. (1) Limit is set by selecting RRLIMF Fig.5 Soft switching sequence (CURMOD = LOW). 2003 Oct 01 13 Philips Semiconductors Product specification Charge switch 11.3 UBA2007 Current measurement possibility handbook, full pagewidth VRLIMF (mV) MRC316 500 10 450 8 400 6 Nonlinearity (%) 4 350 (1) 2 300 0 250 −2 200 −4 (2) 150 −6 100 −8 50 −10 0 0 200 400 600 800 1200 1000 1400 1600 ICHG (mA) 1800 −12 (1) Non linearity in %. (2) VRLIMF as function of ICHG; RRLIMF = 250 Ω. Fig.6 Linear behaviour. 11.4 Drop voltage dependence handbook, full pagewidth VDROP IDS current limitation current limitation MRC317 Fig.7 Dependence of drop voltage between pins CHG and BAT on charging current. 2003 Oct 01 14 Philips Semiconductors Product specification Charge switch UBA2007 12 PACKAGE OUTLINE HVSON10: plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 x 3 x 0.85 mm SOT650-1 0 1 2 mm scale X A B D A A1 E c detail X terminal 1 index area C e1 terminal 1 index area e 5 y y1 C v M C A B w M C b 1 L Eh 6 10 Dh DIMENSIONS (mm are the original dimensions) UNIT A(1) max. A1 b c D(1) Dh E(1) Eh e e1 L v w y y1 mm 1 0.05 0.00 0.30 0.18 0.2 3.1 2.9 2.55 2.15 3.1 2.9 1.75 1.45 0.5 2 0.55 0.30 0.1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT650-1 --- MO-229 --- 2003 Oct 01 15 EUROPEAN PROJECTION ISSUE DATE 01-01-22 02-02-08 Philips Semiconductors Product specification Charge switch UBA2007 To overcome these problems the double-wave soldering method was specifically developed. 13 SOLDERING 13.1 Introduction to soldering surface mount packages If wave soldering is used the following conditions must be observed for optimal results: This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 – larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. Reflow soldering The footprint must incorporate solder thieves at the downstream end. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. • For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical reflow peak temperatures range from 215 to 270 °C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. • below 220 °C (SnPb process) or below 245 °C (Pb-free process) A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. – for all BGA and SSOP-T packages 13.4 – for packages with a thickness ≥ 2.5 mm Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. – for packages with a thickness < 2.5 mm and a volume ≥ 350 mm3 so called thick/large packages. • below 235 °C (SnPb process) or below 260 °C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. 13.3 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. 2003 Oct 01 Manual soldering 16 Philips Semiconductors Product specification Charge switch 13.5 UBA2007 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE(1) WAVE BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA not suitable suitable(4) DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS not PLCC(5), SO, SOJ suitable REFLOW(2) suitable suitable suitable not recommended(5)(6) suitable SSOP, TSSOP, VSO, VSSOP not recommended(7) suitable PMFP(8) not suitable LQFP, QFP, TQFP not suitable Notes 1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. 2003 Oct 01 17 Philips Semiconductors Product specification Charge switch UBA2007 14 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS 16 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Oct 01 18 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/01/pp19 Date of release: 2003 Oct 01 Document order number: 9397 750 11502