DATA SHEET MOS INTEGRATED CIRCUIT µPD16856 MONOLITHIC CD-ROM 3-PHASE SPINDLE MOTOR DRIVER The µPD16856 is a CD-ROM 3-phase spindle motor driver consisting of a CMOS controller and MOS bridge outputs. By employing 3-phase full-wave PWM as the drive method and MOS FETs at the output stage, it has been possible to reduce the power consumption of the µPD16856 ever further than the conventional linear drive drivers that use bipolar transistors. By using a 30-pin shrink SOP package, a more compact-size has been achieved. FEATURES • Supply voltage for controller block: 5 V, supply voltage for output block: 12 V 3 V input available for the input interface • Low on-state resistance (total on-state resistance of upper and lower MOS FETs) RON = 1.3 Ω (TYP.) • Low power consumption due to 3-phase full-wave PWM drive method • On-chip hole bias switch (linked with STB pin) • On-chip IND (FG) pulse switching function, 1-phase output or 3-phase composite output • START/STOP pin included, acting as a brake during STOP • Standby pins included, turning off internal circuit in standby • Low current consumption: IDD = 3 mA (Max.), IDD (ST) = 1 µA (Max.) • On-chip thermal shutdown circuit • On-chip current limiting circuit; reference voltage can be set externally • On-chip low voltage malfunction prevention circuit • On-chip reverse rotation prevention circuit • 30-pin plastic shrink SOP (300 mil) ORDERING INFORMATION Part Number µPD16856GS Package 30-pin shrink SOP (0.8-mm pitch, 300 mil) The information in this document is subject to change without notice. Document No. S13447EJ1V0DS00 (1st edition) Date Published April 1999 N CP(K) Printed in Japan © 1999 µPD16856 ABSOLUTE MAXIMUM RATINGS (TA = 25°°C) Parameter Symbol Supply voltage Input voltage Instantaneous output current Note 1 Ratings Unit VDD −0.5 to +6.0 V VM −0.5 to +13.5 V VIN −0.5 to VDD + 0.5 V ±2.0 A/phase IDR (pulse) Note 2 Conditions PW ≤ 5 ms, Duty ≤ 30% Power consumption PT 1.0 W Peak channel temperature TCH (MAX) 150 °C Storage temperature range Tstg −55 to +150 °C Notes 1. Allowable current per phase while on-board 2. When mounted on glass epoxy board (100 mm × 100 mm × 1 mm) RECOMMENDED OPERATING RANGE Parameter Supply voltage Symbol Conditions MIN. TYP. MAX. Unit VDD 4.5 5.0 5.5 V VM 10.8 12.0 13.2 V ±0.5 A/Phase ±1.5 A/Phase 10 15 mA ±2.5 ±5 mA Output current (DC) IDR (DC) Instantaneous output current IDR (pulse) Hole bias current IHB IND pin output current IFG 0 CL pin input voltage VCL 0.1 0.4 V Operating temperature range TA −20 75 °C 2 PW ≤ 5 ms, Duty ≤ 10% Data Sheet S13447EJ1V0DS00 µPD16856 ELECTRICAL SPECIFICATIONS (UNLESS OTHERWISE SPECIFIED, TA = 25°°C, VDD = 5 V, VM = 12 V) Parameter Symbol Conditions MIN. TYP. MAX. Unit 1.5 3.0 mA 1.0 µA VDD V 0.8 V [General] Current consumption 1 (during operation) IDD Current consumption (in standby) IDD STB = VDD STB = GND (ST) [ST/SP, STB, REV, FGsel] Input voltage, high VIH Input voltage, low VIL Input pull-down resistor RIND 1.8 120 kΩ 75 kHz [Controller block] Triangle wave oscillation frequency fPWM CT = 100 pF [Hole amplifier] Common mode input voltage range VHch 1.0 Hysteresis voltage VHhys Input bias current IHbias VH = 2.5 V 3.5 15 V mV 1.0 µA 0.5 V [Hole bias block] Hole bias voltage VHB IHB = 10 mA IND-pin voltage, high VFG_H IFG = −2.5 mA IND-pin voltage, low VFG_L IFG = +2.5 mA Output on-state resistance (upper stage + lower stage) RON IDR = 200 mA TA = −20°C to +75°C Leakage current during OFF IDR (OFF) In standby Output turn-on time tONH RM = 5 Ω Output turn-off time tOFFH Star connection 0.3 [FG output] 4.0 V 0.5 V 1.8 Ω 10 µA 1.0 2.0 µs 1.0 2.0 µs [Output block] 1.3 [Torque command] Control reference input voltage range ECR 0.3 4.0 V Control input voltage range EC 0.3 4.0 V Input current IIN 50 µA 30 Note Input voltage difference ECR-EC DUTY = 100% 1.0 V Dead zone (+) EC_d+ 1.5 V ≤ ECR ≤ 2.5 V 0 50 100 mV Dead zone (−) EC_d− 1.5 V ≤ ECR ≤ 2.5 V 0 −50 −100 mV +15 mV [Overcurrent detection block] Input offset voltage −15 VIO Note Dead zone not included. Remarks 1. The thermal shutdown circuit (T.S.D.) operates with TCH > 150°C. 2. The low-voltage malfunction prevention circuit (UVLO) operates with a voltage of 4 VTYP. Data Sheet S13447EJ1V0DS00 3 µPD16856 PIN FUNCTIONS Package: 30-pin Shrink SOP (300 mil) IND STB VM VM OUT2 RF RF OUT1 VM VM OUT0 RF RF ISEN CL Pin No. 1 Caution 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 Pin Name Pin Function IND Index signal output pin 2 STB Standby operation input pin 3 VM Supply input pin for motor block (12 V) 4 VM Supply input pin for motor block (12 V) 5 OUT2 Motor connection pin 6 RF 3-phase bridge common pin 7 RF 3-phase bridge common pin 8 OUT1 Motor connection pin Supply input pin for motor block (12 V) 9 VM 10 VM Supply input pin for motor block (12 V) 11 OUT0 Motor connection pin 12 RF 3-phase bridge common pin 13 RF 3-phase bridge common pin 14 ISEN Sense resistor connection pin 15 CL Overcurrent detection voltage input pin 16 GND GND pin 17 REV Reverse rotation input pin (reverse brake pin) 18 ST/SP Start/stop input pin 19 FGsel IND pulse selection pin 20 HB Hole bias pin 21 H0− Hole signal input pin 22 H0+ Hole signal input pin 23 H1− Hole signal input pin 24 H1+ Hole signal input pin 25 H2− Hole signal input pin 26 H2+ Hole signal input pin 27 CT Oscillation frequency setup capacitor connection pin 28 VDD Controller block supply input pin (5 V) 29 ECR Control reference voltage input pin 30 EC Control voltage input pin When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected to their targets. 4 EC ECR VDD CT H2+ H2– H1+ H1– H0+ H0– HB FGsel ST/SP REV GND Data Sheet S13447EJ1V0DS00 µPD16856 BLOCK DIAGRAM IND 1 30 EC STB 2 29 ECR 28 VDD VM 3 UVLO OSC VM 4 27 CT Q5 T.S.D OUT2 5 + 26 H2+ Q6 RF 6 Phase excitation pulse generator RF 7 – + 25 H2– 24 H1+ Q3 – OUT1 8 23 H1– Q4 VM 9 + – VM 10 22 H0+ 21 H0– Q1 OUT0 11 20 HB Q2 RF 12 Ganged with STB RF 13 ISEN 14 18 ST/SP Reverse rotation detection circuit CL 15 Caution 19 FGsel 17 REV 16 GND When there is more than one pin of the same kind of pin (VM and RF), all pins should be connected to their targets. Data Sheet S13447EJ1V0DS00 5 µPD16856 TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE CHARACTERISTICS PT vs. TA Characteristics 1.4 While mounted on a 100 mm × 100 mm × 1.0 mm glass epoxy board Total power dissipation PT (W) 1.2 25˚C 1.0 W 1.0 125˚C/W 0.8 0.6 0.4 0.2 75˚C 0 –20 0 25 50 75 100 125 150 Ambient temperature TA (˚C) Remark It is possible to apply a maximum of 1 W of power when the ambient temperature is 25°C or lower. When the ambient temperature is higher than 25°C, derate based on the above chart. It is possible to apply 0.6 W to the IC when the ambient temperature is 75°C, which is within recommended ambient temperature conditions. 6 Data Sheet S13447EJ1V0DS00 µPD16856 STANDARD CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, TA = 25°°C) IDD and IDD (ST) vs. VDD Characteristics IIN vs. VDD Characteristics (EC and ECR pins) Torque command block input current IIN (µA) Circuit current IDD (mA) Circuit current in standby IDD (ST) (µA) 2.0 IDD 1.0 0 4.5 IDD (ST) 5.0 50 EC, ECR = 4 V 40 30 IIN 20 10 0 4.5 5.5 Controller block supply voltage VDD (V) 5.0 Controller block supply voltage VDD (V) VHhys vs. VDD Characteristics (Hole Amplifier Input) VIH and VIL vs. VDD Characteristics (ST/SP, REV, STB, and FGsel pins) 2.0 20 Hole amplifier hysteresis voltage VHhys (mV) Input voltage, high VIH (V) Input voltage, low VIL (V) 5.5 1.5 VIH VIL 1.0 4.5 5.0 VH = 2.5 V VHhys 15 10 4.5 5.5 Controller block supply voltage VDD (V) 5.0 5.5 Controller block supply voltage VDD (V) fPWM vs. VDD Characteristics RON vs. TA Characteristics 100 1.5 fPWM 50 VIL 0 4.5 VDD = 5 V Output on-state resistance RON (Ω) PWM oscillation frequency fPWM (kHz) CT = 100 pF 5.0 5.5 Controller block supply voltage VDD (V) RON 1.0 0.5 30 40 50 60 70 Operating ambient temperature TA (V) Data Sheet S13447EJ1V0DS00 7 µPD16856 FUNCTION OPERATION TABLE (1) ST/SP = “H” Input Signal Circuit Operation Mode CMP0 CMP1 CMP2 PWM H H L H Operation H H L L Brake H L L H Operation H L L L Brake H L H H Operation H L H L Brake L L H H Operation L L H L Brake L H H H Operation L H H L Brake L H L H Operation L H L L Brake Source → Sink W→V W→U V→U V→W U→W U→V Brake: Regenerates via the high-side Pch MOS FET channel. (2) ST/SP = “L” Input Signal Circuit Operation Mode CMP0 CMP1 CMP2 PWM − − − − Short brake Short brake: Turns the high-side MOS FET on and the low-side MOS FET off. (3) Torque Command The curve shown below is the relationship to torque of the difference (ECR – EC) between the control reference voltage (ECR) and the control voltage (EC). Duty cycle Normal direction torque 100% → ECR–EC (–) (+) –100% Reverse direction torque Reverse Rotation Pin Voltage (REV) L ECR > EC ECR < EC 8 Note Stops after detecting reverse rotation H Reverse rotation The reverse drive current flows in the high-side Pch Stop MOS FET channel on reverse rotation. Note Normal rotation Note Reverse rotation Data Sheet S13447EJ1V0DS00 µPD16856 (4) Standby Mode The setting of the standby mode allows the power supply in the device to be turned off forcibly. The status of outputs from pins in standby is high impedance (H-bridge all OFF). In addition it is possible to reduce the circuit current since the internal oscillation block stops. When the stop operation is executed by the standby pin during normal operation, the motor is stopped by inertia force. When the normal status is reset, it takes several tens of µs to be activated. STB Pin Operation Mode H Normal operation mode L Standby mode Data Sheet S13447EJ1V0DS00 9 µPD16856 TIMING CHART (1) Hole Signal Input H0 H1 H2 (2) CMP Signal (FGsel = L: IND1, FGsel = H: IND2) CMP0 CMP1 CMP2 IND1 IND2 (3) Selection of Output MOS FET Drive and Comparator (A Blank Indicates Switch OFF) Q1 SW SW Q2 SW SW Q3 SW Q4 SW Q5 ON Q6 10 ON ON ON ON SW SW SW SW ON SW SW SW SW ON SW SW SW SW ON ON Data Sheet S13447EJ1V0DS00 ON ON SW SW SW SW ON SW SW SW SW ON µPD16856 (4) Motor Drive Waveform OUT0 OUT1 OUT2 PWM PWM PWM PWM PWM Data Sheet S13447EJ1V0DS00 PWM PWM 11 12 V 47 µF Remark (47 µF in the above figure). This circuit is for reference only and is not intended for use in mass production. Moreover, set VCL and RS to values within the ratings. 12 Data Sheet S13447EJ1V0DS00 VCL 0.3 V 330 pF RFIL 1.8 kΩ Motor U phase Motor V phase CFIL CL 15 ISEN 14 RF 13 RF 12 OUT0 11 VM 10 VM 9 OUT1 8 RF 7 VM 4 Q5 OUT2 5 Q6 RF 6 Q3 Q1 Phase excitation pulse generator Q4 Q2 Reverse rotation detection circuit Ganged with STB T.S.D + – + – + – 100 pF 16 GND CPU CPU 18 ST/SP 17 REV CPU 200 Ω HW 200 Ω 19 FGsel 20 HB 21 H0– 22 H0+ 23 H1– 24 H1+ 25 H2– 26 H2+ 27 CT HV 28 VDD VM 3 OSC controller 29 ECR STB 2 CPU UVLO controller 30 EC IND 1 15 µF controller Motor W phase RS 0.3 Ω + + HU 5V µPD16856 APPLICATION CIRCUIT EXAMPLE To eliminate noise during PWM, it is recommended to insert a tantalum capacitor between VM and GND µPD16856 PACKAGE DRAWING 30-Pin Plastic Shrink SOP (300 mil) (Unit: mm) 30 16 3˚ +7 -3 Detail of lead end 1 15 1.55±0.1 13.0 MAX. 7.7±0.3 1.05±0.2 0.8 0.10 +0.10 0.35–0.05 0.9 MAX. 0.20 –0.05 0.1±0.1 +0.10 1.8 MAX. 5.6±0.2 0.6±0.2 0.10 M Data Sheet S13447EJ1V0DS00 13 µPD16856 RECOMMENDED SOLDERING CONDITIONS µPD16856 should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. • For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 sec. Max. (at 210°C or higher), Recommended Condition Symbol IR35-00-3 Note Count: three times or less, Exposure limit: none , Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended VPS Package peak temperature: 215°C, Time: 40 sec. Max. (at 200°C or higher), VP15-00-3 Note Count: three times or less, Exposure limit: none , Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended Wave soldering Package peak temperature: 260°C, Time: 10 sec. Max., Proheating temperature: 120°C Max., Count: once, Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% Max.) is recommended WS60-00-1 Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period. Caution 14 Do not use different soldering methods together. Data Sheet S13447EJ1V0DS00 µPD16856 Regional Information Some information contained in this document may vary from country to country. Before using any NEC product in your application, pIease contact the NEC office in your country to obtain a list of authorized representatives and distributors. They will verify: • Device availability • Ordering information • Product release schedule • Availability of related technical literature • Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) • Network requirements In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics Inc. (U.S.) NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd. Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 Benelux Office Eindhoven, The Netherlands Tel: 040-2445845 Fax: 040-2444580 Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics (France) S.A. Velizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (France) S.A. NEC Electronics Singapore Pte. Ltd. Spain Office Madrid, Spain Tel: 91-504-2787 Fax: 91-504-2860 United Square, Singapore 1130 Tel: 65-253-8311 Fax: 65-250-3583 NEC Electronics (Germany) GmbH Duesseldorf, Germany Tel: 0211-65 03 02 Fax: 0211-65 03 490 NEC Electronics (UK) Ltd. Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 NEC Electronics Hong Kong Ltd. NEC Electronics Taiwan Ltd. NEC Electronics Italiana s.r.l. NEC Electronics (Germany) GmbH Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 Scandinavia Office Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC do Brasil S.A. Electron Devices Division Rodovia Presidente Dutra, Km 214 07210-902-Guarulhos-SP Brasil Tel: 55-11-6465-6810 Fax: 55-11-6465-6829 J99.1 Data Sheet S13447EJ1V0DS00 15 µPD16856 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5