NEC UPG154

DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG154TB
L-BAND SPDT SWITCH
DESCRIPTION
The µPG154TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
cellular or cordless telephone application.
The device can operate from 100 MHz to 2.5 GHz, having the low
insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy
to install and contributes to miniaturizing the system.
FEATURES
• Low Insertion Loss
: LINS = 0.65 dB TYP. @VCONT = +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz
• High Power Switching : Pin (1 dB) = +30 dBm TYP. @VCONT = +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz
• Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
• PCS, WLAN and WLL applications
ORDERING INFORMATION
Part Number
Marking
µPG154TB-E3
G1K
Package
Supplying Form
6-pin super minimold
Embossed tape 8 mm wide.
Pin 1, 2, 3 face to tape perforation side.
Qty 3 kp/reel.
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order: µPG154TB)
Caution The IC must be handled with care to prevent static discharge because its circuit is composed of
GaAs MES FET.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P13656EJ2V0DS00 (2nd edition)
Date Published September 1999 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1998, 1999
µPG154TB
ABSOLUTE MAXIMUM RATINGS (TA = +25°°C)
Parameter
Symbol
Control Voltage 1, 2
Ratings
Unit
Note
–6.0 to +6.0
VCONT1, 2
V
Supply Voltage
VDD
5.0
V
Input Power
Pin
+31
dBm
Total Power Dissipation
Ptot
0.15
W
Operating Temperature
TA
–45 to +85
°C
Storage Temperature
Tstg
–55 to +150
°C
Note Condition 2.5 ≤ | VCONT1 – VCONT2 | ≤ 6.0 V
Remarks 1. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C
2. Operation in excess of any one of these parameters may result in permanent damage.
PIN CONNECTIONS
Pin No.
Connection
Pin No.
Connection
1
OUT1
4
VCONT2
2
VDD
5
IN
3
OUT2
6
VCONT1
3
2
1
G1K
(Top View)
(Bottom View)
4
4
3
5
5
2
6
6
1
RECOMMENDED OPERATING CONDITIONS (TA = +25°°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Control Voltage (Low)
VCONT
–0.2
0
+0.2
V
Control Voltage (High)
VCONT
+2.5
+3.0
+5.3
V
VDD
+2.5
VCONT(H)
VCONT(H) + 0.3
V
Supply Voltage
2
Data Sheet P13656EJ2V0DS00
µPG154TB
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = +25°C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, ZO = 50 Ω,
VDD = 3.0 V, Off chip DC blocking capacitors value; 51 pF)
Parameter
Insertion Loss
Symbol
LINS
Isolation
ISL
Test Conditions
MIN.
TYP.
MAX.
Unit
f = 100 M to 1.0 GHz,
CX = 12.0 pF
−
0.30
0.65
dB
f = 2.0 GHz, CX = 2.0 pF
−
0.65
0.90
f = 1.0 GHz, CX = 12.0 pF
20
24
−
f = 1.5 GHz, CX = 4.5 pF
−
22
−
f = 2.0 GHz, CX = 2.0 pF
18
21
−
dB
Input Return Loss
RLin
f = 100 M to 2.0 GHz,
CX = 2.0 pF
11
15
−
dB
Output Return Loss
RLout
f = 100 M to 2.0 GHz,
CX = 2.0 pF
11
15
−
dB
Input Power at 0.1 dB
Note
Compression Point
Pin (0.1 dB)
f = 2.0 GHz, CX = 2.0 pF
−
26.5
−
dBm
Input Power at 1 dB
Note
Compression Point
Pin (1 dB)
f = 2.0 GHz, CX = 2.0 pF
27
30
−
dBm
−
30
−
ns
−
2
10
µA
Switching Speed
Control Current
tsw
ICONT
VCONT = 3 V/0 V
Note Pin (1 dB) and Pin (0.1 dB) are measured the input power level when the insertion loss increase more 1 dB or 0.1
dB than that of linear range. All other characteristics are measured in linear range.
Cautions
1. The value of trap capacitor to improve the isolation performance should be chosen to
accommodate the operating frequency, band width, switching speed and the condition with
actual board of your system. The distance between IC’s No.2 pin and trap capacitor CX
should be placed as shorter as possible to avoid parasitic parameters.
2. When the µPG154TB is used, it is necessary to use DC blocking capacitors for No.1 (OUT1),
No.3 (OUT2) and No.5 (IN).
The value of DC blocking capacitors should be chosen to
accommodate the operating frequency, band width, switching speed and the condition with
actual board of your system. The range of recommended DC blocking capacitor value is
less than 100 pF.
Data Sheet P13656EJ2V0DS00
3
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 12 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
1: –15.819 dB
1 GHz
2: –17.331 dB
1.5 GHz
3: –15.135 dB
2 GHz
4: –12.383 dB
2.5 GHz
0
–10
1
CH1 S12
2
4
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 1
1 GHz
4
2
1
–20
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1: –0.705 dB
1 GHz
2: –0.913 dB
1.5 GHz
3: –1.684 dB
2 GHz
4: –3.617 dB
2.5 GHz
MARKER 1
1 GHz
1
CH1 S22
2
3
–2
4
–3
log MAG
10 dB/REF 0 dB
1: –16.072 dB
1 GHz
2: –16.268 dB
1.5 GHz
3: –11.895 dB
2 GHz
4: –8.346 dB
2.5 GHz
MARKER 1
1 GHz
0
–10
1
2
3
4
–20
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
4
1: –25.11 dB
1 GHz
2: –16.514 dB
1.5 GHz
3: –9.938 dB
2 GHz
4: –5.895 dB
2.5 GHz
3
–10
–40
–1
10 dB/REF 0 dB
0
–30
0
log MAG
MARKER 1
1 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
Data Sheet P13656EJ2V0DS00
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 4.5 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S12
1: –16.788 dB
1 GHz
2: –17.799 dB
1.5 GHz
3: –14.495 dB
2 GHz
4: –10.133 dB
2.5 GHz
0
4
–10
1
2
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 2
1.5 GHz
1: –14.948 dB
1 GHz
2: –22.345 dB
1.5 GHz
3: –13.136 dB
2 GHz
4: –5.559 dB
2.5 GHz
4
2
–20
–40
3
1
–10
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1
CH1 S22
1: –0.802 dB
1 GHz
2: –0.744 dB
1.5 GHz
3: –1.241 dB
2 GHz
4: –3.255 dB
2.5 GHz
MARKER 2
1.5 GHz
–1
10 dB/REF 0 dB
0
–30
0
log MAG
MARKER 2
1.5 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
2
3
–2
4
–3
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
log MAG
10 dB/REF 0 dB
1: –17.437 dB
1 GHz
2: –19.166 dB
1.5 GHz
3: –13.512 dB
2 GHz
4: –8.162 dB
2.5 GHz
MARKER 2
1.5 GHz
0
4
–10
1
3
2
–20
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
Data Sheet P13656EJ2V0DS00
5
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 2 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
CH1 S12
1: –16.635 dB
1 GHz
2: –20.537 dB
1.5 GHz
3: –16.53 dB
2 GHz
4: –10.019 dB
2.5 GHz
0
4
–10
1
2
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 3
2 GHz
1
–10
1: –12.2 dB
1 GHz
2: –13.778 dB
1.5 GHz
3: –20.075 dB
2 GHz
4: –11.954 dB
2.5 GHz
4
2
3
–20
–40
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1: –0.980 dB
1 GHz
2: –0.927 dB
1.5 GHz
3: –0.952 dB
2 GHz
4: –1.972 dB
2.5 GHz
MARKER 3
2 GHz
1
CH1 S22
2
3
–1
4
–2
–3
log MAG
10 dB/REF 0 dB
1: –16.683 dB
1 GHz
2: –21.59 dB
1.5 GHz
3: –17.13 dB
2 GHz
4: –9.277 dB
2.5 GHz
MARKER 3
2 GHz
0
4
–10
1
2
–20
3
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
6
10 dB/REF 0 dB
0
–30
0
log MAG
MARKER 3
2 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
Data Sheet P13656EJ2V0DS00
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 13 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
1: –14.995 dB
1 GHz
2: –18.465 dB
1.5 GHz
3: –19.04 dB
2 GHz
4: –14.189 dB
2.5 GHz
0
–10
1
CH1 S12
4
2
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 1
1 GHz
1: –26.751 dB
1 GHz
2: –16.888 dB
1.5 GHz
3: –10.56 dB
2 GHz
4: –6.652 dB
2.5 GHz
4
3
–10
2
–20
–40
–40
1
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1
CH1 S22
1: –0.626 dB
1 GHz
2: –8.29 dB
1.5 GHz
3: –1.398 dB
2 GHz
4: –2.818 dB
2.5 GHz
MARKER 1
1 GHz
–1
10 dB/REF 0 dB
0
–30
0
log MAG
MARKER 1
1 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
2
3
–2
4
–3
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
log MAG
10 dB/REF 0 dB
1: –14.449 dB
1 GHz
2: –19.088 dB
1.5 GHz
3: –18.88 dB
2 GHz
4: –13.6 dB
2.5 GHz
MARKER 1
1 GHz
0
1
–10
2
3
4
–20
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
Data Sheet P13656EJ2V0DS00
7
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 5.5 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
1: –14.995 dB
1 GHz
2: –18.465 dB
1.5 GHz
3: –19.04 dB
2 GHz
4: –14.189 dB
2.5 GHz
0
–10
1
CH1 S12
2
4
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 2
1.5 GHz
1: –14.383 dB
1 GHz
2: –23.015 dB
1.5 GHz
3: –13.513 dB
2 GHz
4: –7.75 dB
2.5 GHz
4
2
–20
–40
3
1
–10
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1: –0.79 dB
1 GHz
2: –0.728 dB
1.5 GHz
3: –1.105 dB
2 GHz
4: –2.404 dB
2.5 GHz
MARKER 2
1.5 GHz
1
CH1 S22
2
3
–1
4
–2
–3
log MAG
10 dB/REF 0 dB
1: –14.449 dB
1 GHz
2: –19.088 dB
1.5 GHz
3: –18.88 dB
2 GHz
4: –13.36 dB
2.5 GHz
MARKER 2
1.5 GHz
0
4
1
–10
2
3
–20
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
8
10 dB/REF 0 dB
0
–30
0
log MAG
MARKER 2
1.5 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
Data Sheet P13656EJ2V0DS00
µPG154TB
TYPICAL CHARACTERISTICS (Cx = 3 pF)
TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer.
OUT1
IN
OUT2
50 Ω
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
1: –14.995 dB
1 GHz
2: –18.465 dB
1.5 GHz
3: –19.04 dB
2 GHz
4: –14.189 dB
2.5 GHz
0
1
–10
CH1 S12
2
4
3
–20
Isolation ISL (dB)
10 dB/REF 0 dB
MARKER 3
2 GHz
10 dB/REF 0 dB
1: –11.549 dB
1 GHz
2: –13.477 dB
1.5 GHz
3: –20.71 dB
2 GHz
4: –11.895 dB
2.5 GHz
0
1
–10
4
2
3
–20
–30
–40
–40
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
IN-OUT1 INSERTION LOSS vs. FREQUENCY
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
log MAG
1 dB/REF 0 dB
1
CH1 S22
1: –0.991 dB
1 GHz
2: –0.899 dB
1.5 GHz
3: –0.847 dB
2 GHz
4: –1.530 dB
2.5 GHz
MARKER 3
2 GHz
0
log MAG
MARKER 3
2 GHz
–30
CH1 S21
Insertion Loss LINS (dB)
log MAG
2
3
4
–1
–2
–3
Output Return Loss RLout (dB)
Input Return Loss RLin (dB)
CH1 S11
IN-OUT1 ISOLATION vs. FREQUENCY
log MAG
10 dB/REF 0 dB
1: –14.449 dB
1 GHz
2: –19.088 dB
1.5 GHz
3: –18.88 dB
2 GHz
4: –13.6 dB
2.5 GHz
MARKER 3
2 GHz
0
4
1
–10
2
3
–20
–30
–40
–4
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
START 0.300 000 000 GHz STOP 3.300 000 000 GHz
Frequency f (GHz)
Frequency f (GHz)
Caution This data is including loss of the test fixture.
Data Sheet P13656EJ2V0DS00
9
µPG154TB
TEST CIRCUIT
TA = +25°C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, VDD = +3.0 V, f = 2 GHz, ZO = 50 Ω
Off chip DC blocking capacitors value: C0 = 51 pF
C1 = 1 000 pF (Bypass: Select a suitable value for your application, especially concerning switching speed),
CX = 2.0 pF (In case of 2 GHz), using NEC standard evaluation board
VDD
C1
Cx
OUT1
OUT2
C0
C0
1
2
3
G1K
6
5
4
C1
C1
C0
VCONT1
IN
VCONT2
EVALUATION BOARD
Board for customer
Evaluation board
VDD
VDD
OUT1
OUT1
OUT2
VCONT1
VCONT2
IN
10
OUT2
VCONT1
Data Sheet P13656EJ2V0DS00
IN
VCONT2
µPG154TB
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
VCONT1
VCONT(H)
VCONT2
VCONT(L)
VCONT(H)
OUT1
IN
OUT1
OUT2
IN
OUT2
VCONT(L)
OUT1
IN
OUT1
OUT2
IN
OUT2
PACKAGE DIMENTIONS
6 PIN SUPER MINIMOLD (Unit: mm)
0.1 MIN.
0.15 +0.1
–0
1.25 ±0.1
2.1 ±0.1
0.2 +0.1
–0
0 to 0.1
0.65
0.7
0.65
1.3
0.9 ±0.1
2.0 ±0.2
Data Sheet P13656EJ2V0DS00
11
µPG154TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering method and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Note
Count: 3, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Note
Count: 3, Exposure limit: None
VP15-00-3
Wave Soldering
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Note
Count: 1, Exposure limit: None
WS60-00-1
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per pin row)
Note
Exposure limit: None
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
12
Data Sheet P13656EJ2V0DS00
µPG154TB
[MEMO]
Data Sheet P13656EJ2V0DS00
13
µPG154TB
[MEMO]
14
Data Sheet P13656EJ2V0DS00
µPG154TB
[MEMO]
Data Sheet P13656EJ2V0DS00
15
µPG154TB
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8