DATA SHEET GaAs INTEGRATED CIRCUIT µPG132G L-BAND SPDT SWITCH DESCRIPTION µPG132G is an L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 8 pin SSOP that is smaller than usual 8 pin SOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications. FEATURES • Maximum transmission power : 0.6 W (typ.) • Low insertion loss : 0.6 dB (typ.) at f = 2 GHz • High switching speed : 30 ns : 8 pins SSOP : PHS, PCS, DECT etc. • +3 V/0 V control voltage • Small package APPLICATION • Digital cordless telephone • Digital hand-held cellular phone, WLAN ORDERING INFORMATION PART NUMBER PACKAGE µPG132G-E1 8 pin plastic SSOP PACKING FORM Carrier tape width 12 mm. QTY 2kp/Reel. For evaluation sample order, please contact your local NEC sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C) Control Voltage VCONT Input Power Pin –0.6 to +6 V 31 dBm Total Power Dissipation Ptot 0.4 W Operating Case Temperature Topt –65 to +90 ˚C Storage Temperature Tstg –65 to +150 ˚C CAUTION: The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. Document No. P10732EJ2V0DS00 (2nd edition) Date Published April 1996 P Printed in Japan © 1996 µPG132G PIN CONNECTION DIAGRAM (Top View) 1. VCONT2 1 8 2 7 3 6 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 5 4 8. VCONT1 SPDT SWITCH IC SERIES PRODUCTS PART NUMBER Pin (1dB) (dBm) LINS (dB) ISL (dB) VCONT (V) PACKAGE +34 0.5 @1G 32 @1G –5/0 8 pin SOP PDC, IS-136, PHS PHS, PCS, WLAN µPG130GR APPLICATIONS µPG131GR +30 0.6 @2G 23 @2G –4/0 (225 mil) µPG130G +34 0.5 @1G 32 @1G –5/0 8 pin SSOP PDC, IS-136, PHS (175 mil) PHS, PCS, WLAN µPG131G +30 0.6 @2G 23 @2G –4/0 µPG132G +30 0.6 @1G 22 @2G +3/0 PHS, PCS, WLAN µPG133G +25 0.6 @2G 20 @2G –3/0 DIVERSITY etc Remark: As for detail information of series products, please refer to each data sheet. APPLICATION EXAMPLE (PHS) DEMO RX ÷N PLL µ PG132G SW I Q PLL µ PC8105GR I 0˚ TX PA 2 µ PC8106T 90˚ Q µPG132G RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT Control Voltage (ON) VCONT +2.7 +3.0 +5.0 V Control Voltage (OFF) VCONT –0.2 0 +0.2 V 27 29 dBm TYP. MAX. UNIT 0.6 1.0 dB Input Power Level Pin ELECTRICAL CHARACTERISTICS (TA = 25 ˚C) CHARACTERISTICS SYMBOL Insertion Loss MIN. LINS 0.8Note1 Isolation ISL 20 TEST CONDITION f = 2.5 GHz 22 dB 20Note1 f = 2.5 GHz Input Return Loss RLin 11 dB Output Return Loss RLout 11 dB VCONT1 = 0 V dBm VCONT2 = +3 V Input Power at 1dB Compression Point Pin (1dB)Note2 Switching Speed Control Current 27 30 f = 100 MHz to 2 GHz or tsw 30 ICONT 50 ns VCONT1 = +3 V µA VCONT2 = 0 V Notes 1: Characteristic for reference at 2.0 to 2.5 GHz. 2: Pin (1dB) is measured the input power level when the insertion loss increase more 1dB than that of linear range. All other characteristics are measured in linear range. NOTE ON CORRECT USE • When the µPG132G is used it is necessary to use DC blocking capacitor for No. 2 pin (OUT2), No. 5 pin (IN) and No. 7 pin (OUT1). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation. • Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to same side of No. 5 pin (IN). • The distance between IC’s GND pins and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. 3 µPG132G TYPICAL CHARACTERISTICS (TA = 25 ˚C) Note This data is including loss of the test fixture. IN-OUT1 INSERTION LOSS vs. FREQUENCY 0 VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm + 1.0 ISL - Isolation - dB LINS - Insertion Loss - dB + 2.0 IN-OUT1 ISOLATION vs. FREQUENCY 0 – 1.0 – 2.0 – 3.0 100 M 200 M VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm –10 –20 – 30 – 40 500 M 1G – 50 100 M 200 M 2G 3G f - Frequency - Hz 500 M f - Frequency - Hz 1G ISL LINS OUT1 OUT1 OUT2 IN IN 50 Ω RLin - Input Return Loss - dB + 10 VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm 0 –10 – 20 – 30 – 40 100 M 200 M f - Frequency - Hz 500 M 1G 2G 3G OUT2 50 Ω IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY + 10 RLout - Output Return Loss - dB IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm 0 –10 – 20 – 30 – 40 100 M 200 M 500 M 1G f - Frequency - Hz RLin OUT2 50 Ω 4 2G 3G RLOUT OUT1 IN 2G 3G OUT1 OUT2 IN 50 Ω µPG132G IN-OUT2 ISOLATION vs. FREQUENCY IN-OUT2 INSERTION LOSS vs. FREQUENCY 0 VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm + 1.0 0 – 1.0 – 2.0 – 3.0 100 M 200 M VCONT1 = 0 V VCONT2 = +3 V Pin = 0 dBm –10 ISL - Isolation - dB LINS - Insertion Loss - dB + 2.0 –20 – 30 – 40 500 M 1G – 50 100 M 200 M 2G 3G f - Frequency - Hz 500 M 1G f - Frequency - Hz OUT1 50 Ω OUT1 50 Ω IN IN OUT2 LINS VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm 0 –10 – 20 – 30 f - Frequency - Hz 500 M 1G 2G 3G + 10 VCONT1 = +3 V VCONT2 = 0 V Pin = 0 dBm 0 –10 – 20 – 30 – 40 100 M 200 M 500 M 1G 2G 3G f - Frequency - Hz RLin OUT1 50 Ω IN IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY RLout - Output Return Loss - dB RLin - Input Return Loss - dB + 10 OUT2 ISL IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY – 40 100 M 200 M 2G 3G OUT2 OUT1 50 Ω IN OUT2 RLOUT 5 µPG132G IN-OUT2 Pin vs. Pout VCONT1 = +3 V VCONT2 = 0 V f = 1.9 GHz Pout - Output Power - dBm 32 30 28 OUT1 50 Ω 26 24 IN OUT2 22 20 20 22 24 26 28 30 32 Pin - Input Power - dBm Internal Equivalent Circuit Between the GND pins and FETs of this IC, a capacitor of 3.6 pF for floating is inserted to realize switching between positive voltages of +3 V and 0 V. However, the basic configuration of the µPG132G is the same as that of the µPG131G. In addition, the µPG132G has a monitor pin and a resistor to check the internal circuitry. OUT1 VCONT1 IN GND GND VCONT2 OUT2 6 µPG132G TEST BOARD IN 0.9 mm width NEC G132 C 3 0.4 mm thickness teflon glass R = 50 Ω C C 2 1 OUT1 R R VCONT1 VCONT2 OUT2 TEST CIRCUIT 50 Ω VCONT2 = 0 V/+3 V C1 1 000 pF OUT2 50 Ω ZO = 50 Ω 1 8 2 7 3 6 4 5 1 000 pF VCONT1 = +3 V/0 V C2 ZO = 50 Ω OUT1 C3 ZO = 50 Ω IN C1, C2, C3 = 51 pF 7 µPG132G APPLICATIONS Dependency on control voltage The input/output characteristics, insertion loss, and isolation characteristics hardly fluctuate up to Pin (1 dB) = +27 dBm, even if the control voltage is changed in a range of +3.0 V to +5.0 V. When the IC is used at Pin = +22 dBm in a PHS extension, therefore, the characteristics of the IC do not fluctuate even if a battery whose discharging characteristics fluctuate, such as a lithiumion battery, is used. Relation between Control Voltage and Input/Output Characteristics 32 30 28 VCONT1 = +3.0 to +5.0 V VCONT2 = 0 V f = 2 GHz Non-modulated wave (CW) input VCONT1 = +3.0 V VCONT1 = +4.0 V VCONT1 = +5.0 V Pout (dBm) 26 24 22 20 18 16 14 14 16 18 20 22 24 Pin (dBm) 8 26 28 30 32 34 µPG132G Relation between Small Signal Characteristics and Control Voltage IN-OUT2 INSERTION LOSS vs. FREQUENCY 0 VCONT1 = VCONT2 = 0 V Pin = 0 dBm +1.0 VCONT1 = 0 V VCONT2 = Pin = 0 dBm –10 Isolation ISL (dB) Insertion loss LINS (dB) +2.0 IN-OUT2 ISOLATION vs. FREQUENCY 0 –1.0 –20 +3.0 V –30 –2.0 –40 –3.0 –50 +4.5 V +5.0 V 100 M 200 M 500 M 1 G 2G 3G 100 M 200 M 500 M 1 G Frequency freq. (Hz) Frequency freq. (Hz) OUT1 50 Ω IN OUT1 50 Ω IN OUT2 LINS +10 VCONT1 = VCONT2 = 0 V Pin = 0 dBm 0 –10 +3.0 V +4.0 V +5.0 V –20 –30 100 M 200 M 500 M 1 G IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY 2G 3G Frequency freq. (Hz) Output return loss RLOUT (dB) Input return loss RLin (dB) +10 OUT2 LINS IN-OUT2 RETURN LOSS vs. FREQUENCY –40 2G 3G VCONT1 = VCONT2 = 0 V Pin = 0 dBm 0 –10 +3.0 V +4.0 V +5.0 V –20 –30 –40 100 M 200 M 500 M 1 G 2G 3G Frequency freq. (Hz) RLin OUT1 50 Ω OUT1 50 Ω IN IN OUT2 RLOUT OUT2 VCONT1 = +3 V (isolation only, VCONT2 = +3 V) VCONT1 = +4 V (isolation only, VCONT2 = +4 V) VCONT1 = +5 V (isolation only, VCONT2 = +5 V) The measured values include all losses of the measuring jig. 9 µPG132G Relation between Control Voltage and Second Harmonic –40 VCONT1 = +3.0 to +5.0 V VCONT2 = 0 V f = 2 GHz Non-modulated wave (CW) input 2fo harmonics (dBc) –50 VCONT1 = +3.0 V VCONT1 = +4.0 V VCONT1 = +5.0 V –60 –70 –80 15 20 25 30 35 Pin (dBm) Relation between Control Voltage and Third Harmonic VCONT1 = +3.0 to +5.0 V VCONT1 = 0 V –30 f = 2 GHz Non-modulated wave (CW) input 3fo harmonics (dBc) –40 VCONT1 = +3.0 V VCONT1 = +4.0 V VCONT1 = +5.0 V –50 –60 –70 –80 15 20 25 Pin (dBm) 10 30 µPG132G Temperature characteristics Next, results from evaluating the temperature characteristics of the µPG132G are shown. As shown, favorable characteristics are obtained in a range of TA = –55 to +90 ˚C. The temperature coefficient of the insertion loss is about +0.0014 dB/˚C, indicating that the higher the temperature, the more the insertion loss. Temperature Characteristics of Input/Output Pout (dBm) 30 VCONT1 = +3.0 VCONT2 = 0 V f = 2 GHz Non-modulated wave (CW) input 25 TA = –55 ˚C TA = +25 ˚C TA = +60 ˚C TA = +90 ˚C 20 15 15 30 25 20 35 Pin (dBm) VCONT1 = +3 V VCONT2 = 0 V 0.8 f = 2 GHz Pin = +23 dBm Non-modulated wave (CW) input LINS 0.6 –50 0.4 0.2 –60 2fo 2fo, 3fo harmonics (dBc) Insertion loss LINS (dB) Temperature Characteristics of Insertion Loss, and Double and Triple Harmonics 3fo –70 –100 –50 0 +50 +100 TA (˚C) 11 µPG132G µPG132G TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 +3 V 0V OUT1 OUT1 +3 V IN IN OUT2 OUT2 VCONT2 0V OUT 1 OUT1 IN IN OUT 2 OUT2 8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm) 8 5 3˚ +7 –3 Detail of lead end 1 4 4.94 ±0.2 3.0 MAX. 0.1 ±0.1 12 0.87 ±0.2 0.15 +0.10 –0.05 1.5 ±0.1 1.8 MAX. 3.2 ±0.1 0.575 MAX. 0.5 ±0.2 0.65 0.3 +0.10 –0.05 0.10 M 0.15 µPG132G RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [µPG132G] Soldering process Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 230 ˚C Hour: within 30 s. (more than 210 ˚C) Time: 2 time, Limited days: no.Note IR30-00-2 VPS Package peak temperature: 215 ˚C Hour: within 40 s. (more than 200 ˚C), Time: 2 time, Limited days: no.Note VP15-00-2 Wave Soldering Soldering tub temperature: less than 260 ˚C, Hour: within 10 s. Time: 1 time, Limited days: no.Note WS60-00-1 Pin part heating Pin area temperature: less than 300 ˚C, Hour: within 10 s. Limited days: no.Note Note It is the storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535EJ7V0IF00). 13 µPG132G The application circuits and their parameters are for references only and are not intended for use in actual designin’s. Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the Japanese law concerned. Keep the law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 2