DATA SHEET GaAs INTEGRATED CIRCUIT µPG155TB L-BAND SPDT SWITCH DESCRIPTION The µPG155TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system. FEATURES • Low Insertion Loss : LINS = 0.75 dB TYP. @VCONT = +3.0 V/0 V, f = 2 GHz • High Linearity Switching: Pin (1 dB) = +34 dBm TYP. @VCONT = +3.0 V/0 V, f = 2 GHz • Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • PCS, WLAN, and WLL applications ORDERING INFORMATION Part Number Marking µPG155TB-E3 G1L Package Supplying Form 6-pin super minimold Embossed tape 8 mm wide. Pin 1, 2, 3 face to tape perforation side. Qty 3 kp/reel. Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPG155TB) Caution The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13654EJ2V0DS00 (2nd edition) Date Published November 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 1999 µPG155TB ABSOLUTE MAXIMUM RATINGS (TA = +25°°C) Parameter Symbol Control Voltage 1, 2 Ratings Unit Note –6.0 to +6.0 VCONT1, 2 V Input Power Pin +34 dBm Total Power Dissipation Ptot 0.15 W Operating Temperature TA –45 to +85 °C Storage Temperature Tstg –55 to +150 °C Note Condition 2.5 ≤ | VCONT1 – VCONT2 | ≤ 6.0 V Remarks 1. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C 2. Operation in excess of any one of these parameters may result in permanent damage. PIN CONNECTIONS Pin No. Connection Pin No. Connection 1 OUT1 4 VCONT2 2 GND 5 IN 3 OUT2 6 VCONT1 3 2 1 G1L (Top View) RECOMMENDED OPERATING CONDITIONS (TA = +25°°C) Parameter 2 Symbol MIN. TYP. MAX. Unit Control Voltage (Low) VCONT –0.2 0 +0.2 V Control Voltage (High) VCONT +2.5 +3.0 +5.3 V Data Sheet P13654EJ2V0DS00 (Bottom View) 4 4 3 5 5 2 6 6 1 µPG155TB ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, ZO = 50 Ω Off chip DC blocking capacitors value; 51 pF) Parameter Insertion Loss Symbol LINS Isolation ISL Test Conditions MIN. TYP. MAX. Unit f = 100 M to 1.0 GHz − 0.60 0.8 dB f = 2.0 GHz − 0.75 1.0 f = 2.5 GHz − f = 100 M to 2.0 GHz 13 f = 2.5 GHz − f = 1.0 GHz 18 21.5 − Note 1 0.90 16 Note 1 10 − − dB − Input Return Loss RLin f = 100 M to 2.0 GHz 11 15 − dB Output Return Loss RLout f = 100 M to 2.0 GHz 11 15 − dB Input Power at 0.1 dB Note 2 Compression Point Pin (0.1 dB) f = 2.0 GHz − 30.5 − dBm Input Power at 1 dB Note 2 Compression Point Pin (1 dB) f = 2.0 GHz 32 34 − dBm − 30 − ns − 20 50 µA Switching Speed Control Current tsw ICONT VCONT = 3 V/0 V Notes 1. Characteristic for reference at f = 2.0 to 2.5 GHz 2. Pin (0.1 dB) or Pin (1 dB) is measured the input power level when the insertion loss increases more 0.1 dB or 1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. When the µPG155TB is used, it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. Data Sheet P13654EJ2V0DS00 3 µPG155TB TYPICAL CHARACTERISTICS (ON) TEST CONDITIONS: VCONT = 3 V/0 V, Pin = 0 dBm, TA = +25°C OUT1 IN OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY log MAG 10 dB/REF 0 dB CH1 S12 1: –23.361 dB 1 GHz 2: –25.86 dB 1.5 GHz 3: –23.513 dB 2 GHz 4: –15.758 dB 2.5 GHz MARKER 1 1 GHz 0 –10 1 –20 –30 Isolation ISL (dB) Input Return Loss RLin (dB) CH1 S11 IN-OUT1 ISOLATION vs. FREQUENCY 4 2 3 0 –10 1 –20 2 4 3 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY log MAG 1 dB/REF 0 dB CH1 S22 1: –0.959 dB 1 GHz 2: –1.078 dB 1.5 GHz 3: –1.255 dB 2 GHz 4: –1.618 dB 2.5 GHz MARKER 1 1 GHz 1 –1 2 3 4 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 1 1 GHz START 0.300 000 000 GHz STOP 3.300 000 000 GHz –3 log MAG 10 dB/REF 0 dB 1: –24.263 dB 1 GHz 2: –34.835 dB 1.5 GHz 3: –25.152 dB 2 GHz 4: –15.675 dB 2.5 GHz MARKER 1 1 GHz 0 –10 1 –20 4 –30 3 –40 –4 2 START 0.300 000 000 GHz STOP 3.300 000 000 GHz START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) Caution This data is including loss of the test fixture. 4 1: –22.041 dB 1 GHz 2: –18.211 dB 1.5 GHz 3: –15.377 dB 2 GHz 4: –14.159 dB 2.5 GHz –40 CH1 S21 –2 10 dB/REF 0 dB –30 –40 0 log MAG Data Sheet P13654EJ2V0DS00 µPG155TB TYPICAL CHARACTERISTICS (OFF) TEST CONDITIONS: VCONT1 = VCONT2 = 3 V/3 V, Pin = 0 dBm, TA = +25°C OUT1 IN OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY Input Return Loss RLin (dB) CH1 S11 log MAG 10 dB/REF 0 dB 1: –11.777 dB 1 GHz 2: –11.405 dB 1.5 GHz 3: –11.344 dB 2 GHz 4: –10.281 dB 2.5 GHz MARKER 1 1 GHz 0 1 –10 2 –20 4 3 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY log MAG 10 dB/REF 0 dB 1: –4.392 dB 1 GHz 2: –4.417 dB 1.5 GHz 3: –4.447 dB 2 GHz 4: –4.594 dB 2.5 GHz MARKER 1 1 GHz 0 –10 CH1 S22 1 2 3 4 –20 –30 Output Return Loss RLout (dB) Insertion Loss LINS (dB) CH1 S21 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY –40 log MAG 10 dB/REF 0 dB 1: –14.144 dB 1 GHz 2: –13.091 dB 1.5 GHz 3: –12.966 dB 2 GHz 4: –14.503 dB 2.5 GHz MARKER 1 1 GHz 0 1 –10 2 –20 3 4 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz START 0.300 000 000 GHz Frequency f (GHz) STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. Data Sheet P13654EJ2V0DS00 5 PPG155TB TEST CIRCUIT TA = +25qC, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, f = 2 GHz, ZO = 50 : Off chip DC blocking capacitors value: C0 = 51 pF, C1 = 1 000 pF (Bypass), using NEC standard evaluation board OUT1 OUT2 C0 C0 1 2 3 G1L 6 5 4 C1 C1 C0 VCONT1 IN VCONT2 EVALUATION BOARD OUT1 OUT2 VCONT1 VCONT2 IN 6 Data Sheet P13654EJ2V0DS00 µPG155TB TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 VCONT(H) VCONT2 VCONT(L) VCONT(H) Note OUT1 IN OUT1 OUT2 IN OUT2 VCONT(L) Note OUT1 IN OUT1 OUT2 IN OUT2 Note In case of VCONT1 = VCONT2 = High or VCONT1 = VCONT2 = Low, (that is same control voltage for both pins), input signal of IN (Pin 5) is output from OUT1 (Pin 1) and OUT2 (Pin 3). PACKAGE DIMENSIONS 6 PIN MINIMOLD (Unit: mm) 0.1 MIN. 0.15 +0.1 –0 1.25 ±0.1 2.1 ±0.1 0.2 +0.1 –0 0 to 0.1 0.65 0.7 0.65 1.3 0.9 ±0.1 2.0 ±0.2 Data Sheet P13654EJ2V0DS00 7 µPG155TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering method and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Soldering Conditions Recommended Condition Symbol Infrared Reflow Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None IR35-00-3 VPS Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None VP15-00-3 Wave Soldering Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None WS60-00-1 Partial Heating Pin temperature: 300°C Time: 3 seconds or less (per pin row) Note Exposure limit: None – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). 8 Data Sheet P13654EJ2V0DS00 µPG155TB [MEMO] Data Sheet P13654EJ2V0DS00 9 µPG155TB [MEMO] 10 Data Sheet P13654EJ2V0DS00 µPG155TB [MEMO] Data Sheet P13654EJ2V0DS00 11 µPG155TB Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8