TI TPD4S009DRYR

TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008
4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE
FEATURES
1
• Supports High-Speed Differential Data Rates
(3-dB Bandwidth > 4 GHz)
• 0.05-pF Matching Capacitance Between
Differential Signal Pairs
• Low 0.8-pF Line Capacitance for Each Data
Line to GND
• Flow-Through Single-in-Line Pin Mapping for
High-Speed Lines Ensures No Additional
Board Layout Burden While Placing ESD
Protection Chip Near Connector
• IEC 61000-4-2 (Level 4) System-Level ESD
Compliance
• 2.5-A Peak Pulse Current (8/20-µs Pulse)
• Ioff Feature
• Industrial Temperature Range:
–40°C to 85°C
• Space-Saving Package Options
2
DBV OR DCK PACKAGE
(TOP VIEW)
D1+
1
6
D1–
GND
2
5
VCC
D2+
3
4
D2–
DRY PACKAGE
(TOP VIEW)
D1+
1
6
D1–
GND
2
5
VCC
D2+
3
4
D2–
DESCRIPTION/ORDERING INFORMATION
The TPD4S009 provides an electrostatic discharge (ESD) solution for high-speed differential lines. This device
offers four ESD clamp circuits for dual differential lines. The monolithic silicon technology allows matching
between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF
line-line) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The
TPD4S009 is suitable for high-speed differential applications, such as high-definition multimedia interface
(HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394
(FireWire®), etc.
The TPD4S009 complies with IEC 61000-4-2 (Level 4) ESD. This device is offered in space-saving DBV, DCK,
and DRY packages.
The TPD4S009 is characterized for operation over the ambient air temperature range of –40°C to 85°C.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
PACKAGE
(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SON – DRY
Reel of 5000
TPD4S009DRYR
3H
SOT (SOT-23) – DBV
Reel of 3000
TPD4S009DBVR
NFJK
SOT (SC-70) – DCK
Reel of 3000
TPD4S009DCKR
PREVIEW
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FireWire is a registered trademark of Apple Inc.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008, Texas Instruments Incorporated
TPD4S009
SLVS817 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com
CIRCUIT DIAGRAM
VCC
D2+
D1+
D1–
D2–
GND
TERMINAL FUNCTIONS
TERMINAL
2
TYPE
DESCRIPTION
NAME
NO.
D1+, D1–,
D2+, D2–
1, 3,
4, 6
GND
2
GND
Ground
VCC
5
Supply
Supply
ESD port
High-speed ESD clamp provides ESD protection to the high-speed differential data lines.
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
–0.3
6
V
0
VCC
V
Storage temperature range
–65
125
°C
Characterized free-air operating temperature range
–40
85
°C
260
°C
IEC 61000-4-2 Contact Discharge
±8
kV
IEC 61000-4-2 Air-Gap Discharge
±9
kV
Peak pulse power (tp = 8/20 µs)
25
W
Peak pulse current (tp = 8/20 µs)
2.5
A
VCC
Supply voltage range
VIO
IO signal voltage range
Tstg
TA
Lead temperature, 1.6 mm (1/16 in) from case for 10 s)
UNIT
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
VRWM
Reverse standoff voltage
Any IO pin to ground
VBR
Breakdown voltage
IIO = 1 mA
Any IO pin to ground
IIO
IO port current
VIO = 3.3 V, VCC = 5 V
Any IO pin
Ioff
Current from IO port to supply pins
VIO = 3.3 V, VCC = 5 V
Any IO pin
VD
Diode forward voltage
IIO = 8 mA
Lower clamp diode
RDYN
Dynamic resistance
I=1A
Any IO pin
1.1
CIO
IO capacitance
VCC = 5 V, VIO = 2.5 V
Any IO pin
0.8
ICC
Operating supply current
VIO = Open, VCC = 5 V
VCC pin
0.1
MAX
UNIT
5.5
V
0.1
µA
0.01
0.1
µA
0.8
0.95
9
V
0.01
0.6
pF
1
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
V
Ω
µA
3
TPD4S009
SLVS817 – MAY 2008 ........................................................................................................................................................................................................ www.ti.com
TYPICAL CHARACTERISTICS
2
70
D1+
Leakage Current (pA)
Insertion Loss (dB)
0
D2+
-2
-4
-6
-8
60
50
40
30
20
10
-10
100k
1.E+05
1M
1.E+06
10M
1.E+07
100M
1.E+08
1G
1.E+09
0
10G
1.E+10
55
25
Temperature, TA (°C)
–40
Frequency (Hz)
Figure 1. Insertion Loss S21 – I/O to GND
85
Figure 2. Leakage Current vs Temperature (VIO = 2.5 V)
220
5.0
200
180
160
140
3.0
Amplitude (V)
IO Capacitance (pF)
4.0
2.0
1.0
120
100
80
60
40
20
0
0.0
1
3
2
–20
5
4
0
25
IO Voltage (V)
Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V)
3.0
30
2.5
25
75
100 125 150 175 200 225 250
Time (nS)
Figure 4. IEC Clamping Waveforms
(8-kV Contact, Average of Ten Waveforms)
20
Current (A)
1.5
15
1.0
10
PPP (W)
IPP (A)
2.0
50
Power (W)
5
0.5
0.0
0
0
5
10
15
20
25 30 35
Time (µs)
40
45
50
Figure 5. Pulse Waveform (8/20 µs Pulse)
4
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
TPD4S009
www.ti.com ........................................................................................................................................................................................................ SLVS817 – MAY 2008
TYPICAL CHARACTERISTICS (continued)
Figure 6. Eye Diagram Without TPD4S009
Figure 7. Eye Diagram With TPD4S009
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Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): TPD4S009
5
PACKAGE OPTION ADDENDUM
www.ti.com
28-Jul-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPD4S009DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS &
no Sb/Br)
TPD4S009DCKR
PREVIEW
SC70
DCK
6
3000
TPD4S009DRYR
ACTIVE
SON
DRY
6
5000 Green (RoHS &
no Sb/Br)
TBD
Lead/Ball Finish
CU NIPDAU
Call TI
CU NIPDAU
MSL Peak Temp (3)
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jul-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
TPD4S009DBVR
SOT-23
DBV
6
3000
180.0
TPD4S009DRYR
SON
DRY
6
5000
179.0
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
9.2
3.23
3.17
1.37
4.0
8.0
Q3
8.4
1.2
1.65
0.7
4.0
8.0
Q1
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Jul-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD4S009DBVR
TPD4S009DRYR
SOT-23
DBV
6
3000
205.0
200.0
33.0
SON
DRY
6
5000
220.0
205.0
50.0
Pack Materials-Page 2
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