TI TPD4EUSB30DQAR

TPD2EUSB30, TPD4EUSB30
www.ti.com
SLVSAC2 – AUGUST 2010
2, 4-CHANNEL ESD SOLUTION FOR SUPER-SPEED (6 GBPS) USB 3.0 INTERFACE
Check for Samples: TPD2EUSB30, TPD4EUSB30
FEATURES
1
•
•
•
•
•
•
•
•
Single and Dual-Pair Differential Lines to
Protect the Differential Data and Clock Lines of
the USB3.0, eSATA, or LVD Interface
Flow-Through Pin Mapping for the High-Speed
Lines Ensures Zero Additional Skew Due to
Board Layout While Placing ESD-Protection
Chip Near the Connector
Supports Data Rates in Excess of 6 Gbps
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
Low Capacitance 0.05pF (IO to IO)
5-A Peak Pulse Current (per 8/20 ms Pulse)
Industrial Temperature Range: –40°C to 85°C
Space-Saving DRT, DQA Packages
APPLICATIONS
•
•
•
•
•
Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
TPD2EUSB30DRTR PACKAGE
(TOP VIEW)
D+
1
3
D–
GND
2
TPD4EUSB30DQAR PACKAGE
(TOP VIEW)
D1+
1
10
N.C.
D1–
2
9
N.C.
GND
3
8
GND
D2+
4
7
N.C.
D2–
5
6
N.C.
DESCRIPTION/ORDERING INFORMATION
The TPD2EUSB30 and TPD4EUSB30 provide 2 and 4 channel ESD clamp circuits with flow-through pin
mapping for ease of board layout. These devices have been designed to protect sensitive components which are
connected to ultra high-speed data and transmission lines. The TPDxEUSB30 offer protection from stress
caused by ESD (electrostatic discharge). These devices also offer 5 A (8/20 ms) peak pulse current ratings per
IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The differential 0.05-pF
capacitance ensures that the signal distortion due to added ESD clamp remains minimal at high-speed
differential data transmission.
The TPD2EUSB30 and TPD4EUSB30 conform to IEC61000-4-2 (Level 4) ESD protection. The TPD2EUSB30 is
offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (1 mm
× 2.5 mm) package.
The TPD2EUSB30 and TPD4EUSB30 are characterized for operation over ambient air temperature range of
–40°C to 85°C.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
TPD2EUSB30, TPD4EUSB30
SLVSAC2 – AUGUST 2010
www.ti.com
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
(2)
(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SOT – DRT
Tape and reel
TPD2EUSB30DRTR
5PX
SON – DQA
Tape and reel
TPD4EUSB30DQAR
66R
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
CIRCUIT DIAGRAMS
TPD4EUSB30DQA Circuit
D1+
D2+
D1D2-
GND
TPD2EUSB30DRT Circuit
D–
D+
GND
TERMINAL FUNCTIONS
TERMINAL
DRT
PIN NO.
DQA PIN NO.
Dx+,
Dx–
1,
2
1,2,
4, 5
ESD port
GND
3
3, 8
GND
N.C.
2
TYPE
NAME
6, 7,
9, 10
Submit Documentation Feedback
DESCRIPTION
High-speed ESD clamp, provides ESD protection to the high-speed differential
data lines
Ground
Not normally connected
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
TPD2EUSB30, TPD4EUSB30
www.ti.com
SLVSAC2 – AUGUST 2010
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
IO voltage tolerance
D+, D– pins
MIN
MAX
0
6
UNIT
TA
Operating free-air temperature range
–40
85
Tstg
Storage temperature range
–65
125
°C
ESD protection
(1)
°C
IEC 61000-4-2 Contact Discharge
D+, D– pins
±8
kV
IEC 61000-4-2 Air-Gap Discharge
(TPD2EUSB30)
D+, D– pins
±8
kV
IEC 61000-4-2 Air-Gap Discharge
(TPD4EUSB30)
D+, D– pins
±9
kV
Peak pulse current (tp = 8/20 ms)
D+, D– pins
5
A
Peak pulse power (tp = 8/20 ms)
D+, D– pins
45
W
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum-rated conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VRWM
Reverse stand-off voltage
D+,D– pins to ground
Vclamp
Clamp voltage
D+,D– pins to ground,
IIO = 1 A
IIO
Current from IO port to supply pins
VIO = 2.5 V,
ID = 8 mA
VD
Diode forward voltage
D+,D– pins,
lower clamp diode,
VIO = 2.5 V,
ID = 8 mA
Rdyn
Dynamic resistance
D+,D– pins
I=1A
CIO-IO
Capacitance IO to IO
D+,D– pins
VIO = 2.5 V
MIN
0.6
D+,D– pins (DRT)
CIO-GND Capacitance IO to GND
D1+, D1-,
D2+, D2- (DQA )
VBR
IIO = 1 mA
Break-down voltage
TYP
MAX
UNIT
5.5
V
8
V
0.01
0.1
mA
0.8
0.95
V
1
Ω
0.05
pF
0.7
VIO = 2.5 V
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
0.8
7
Submit Documentation Feedback
pF
V
3
TPD2EUSB30, TPD4EUSB30
SLVSAC2 – AUGUST 2010
www.ti.com
TYPICAL OPERATING CHARACTERISTICS
1.20E-12
10
TA = 25°C
5
1.10E-12
Leakage Current (pA)
Capacitnace (Farads)
0
1.00E-12
9.00E-13
DQA Package
8.00E-13
DRT Package
7.00E-13
–5
–10
–15
D–
–20
D+
–25
–30
6.00E-13
VIO = 2.5 V
–35
5.00E-13
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
–40
Figure 1. IO Capacitance vs IO Voltage
85
Figure 2. Leakage Current vs Temperature
6.0
Measured at one IO,
the other IO open
5.5
55
25
Temperature (°C)
–40
Voltage (V)
60
11
55
10
5.0
50
4.5
45
9
40
3.5
35
3.0
30
2.5
25
Current (A)
2.0
20
1.5
15
1.0
10
7
Current (A)
4.0
PPP (W)
IPP (A)
8
6
5
4
3
2
Power (W)
5
0.5
1
0
0.0
5
0
10
15
20
25
30
Time (ms)
35
40
45
50
0
0
100
20
90
10
80
0
70
-10
60
-20
50
40
30
-70
0
-80
-10
-90
-20
-100
75
100
Time (ns)
125
150
175
Figure 5. IEC Clamping Waveforms (8 kV Contact)
4
Submit Documentation Feedback
25
30
35
40
-50
-60
50
20
Voltage (V)
-40
10
25
15
-30
20
0
10
Figure 4. D+,D– Transmission Line Pulser Plot (100 ns
Pulse, 10 ns Rise Time)
Amplitude (V)
Amplitude (V)
Figure 3. Peak Pulse Waveforms
5
200
0
25
50
75
100
Time (ns)
125
150
175
200
Figure 6. IEC Clamping Waveforms (–8 kV Contact)
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
TPD2EUSB30, TPD4EUSB30
www.ti.com
SLVSAC2 – AUGUST 2010
APPLICATION INFORMATION
Layout Guide with TPDxEUSB30DRTR
Refer to Figure 7, the TPD2EUSB30DRTR is offered in space saving DRT package. The DRT package is a
1mm* 1mm package with flow-through pin-mapping for the high-speed differential lines. The TPD4EUSB30DRTR
is offered in space saving DQA package. The DQA is a 1mm* 2.5mm package with flow-through pin-mapping for
the high-speed differential lines. It is recommended to place the package right next to the USB 3.0 connector.
The GND pin should connected to GND plane of the board through a large VIA. If a dedicated GND plane is not
present right underneath, it is recommended to route to the GND plane through a wide trace. The current
associated with IEC ESD stress can be in the range of 30Amps or higher momentarily. A good, low impedance
GND path ensures the system robustness against IEC ESD stress.
The TPDxEUSB30 can provide system level ESD protection to the high-speed differential ports (>6 Gbps data
rate). The flow-through package offers flexibility for board routing with traces up to 15 mills wide. It allows the
differential signal pairs couple together right after they touch the ESD ports of the TPDxEUSB30.
TX+
VBUS
TXTPD2EUSB30DRTR
D-
USB 3.0
Host/ Controller
1-mm
DGND
GND
D+
8-mm
D+
RX+
GND
1-mm
RX-
Three TPD2EUSB30 to Protect USB3.0 Class A connector (One Layer Routing)
TPD4EUSB30
D1+
TX+
VBUS
N.C.
TXD1-
N.C.
GND
D2+
N.C.
D2-
N.C.
D-
2.5-mm
GND
USB 3.0
Host/ Controller
GND
D+
8-mm
RX+
GND
RX-
1-mm
One TPD4EUSB30 & One TPD2EUSB30 to Protect USB3.0 Class A connec tor (Two Layer Routing)
Figure 7. Layout Guide with the TPDxEUSB30 at the USB3.0 Class A Connector
TPDxEUSB30 Eye Pattern Test
See Figure 9 for a demonstration of the TPDxEUSB30 performance the lab set-up. Figure 8 shows a lab board
that was designed to demonstrate the degradation of the eye pattern quality with and without the TPD2EUSB30
in the USB 3.0 signal path. Figure 10 shows that there is only ~2 ps jitter penalty to the differential signal when
the TPD2EUSB30 device was added in the signal path. Similar setup was employed to measure eye pattern for
the TPD4EUSB30.
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
Submit Documentation Feedback
5
TPD2EUSB30, TPD4EUSB30
SLVSAC2 – AUGUST 2010
www.ti.com
Eye Pattern
Measurement Point
Pattern Generator
36” Lossy Transmission Line
USB3.0 Receiver PHY
Figure 8. Measurement Setup to collect the Eye Pattern on a Reference Board with TPD2EUSB30
Eye Pattern
Measurement Point
Pattern Generator
36” Lossy Transmission Line
TPD2EUSB30
USB3.0 Receiver PHY
Figure 9. Measurement Setup to collect the Eye Pattern on a Reference Board with TPD2EUSB30
Figure 10. Lab Setup for the Eye-Pattern Measurement with TPDxEUSB30
6
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
TPD2EUSB30, TPD4EUSB30
www.ti.com
SLVSAC2 – AUGUST 2010
Figure 11. Output Eye Diagram Without
TPD2EUSB30 (Figure 8 Setup, 5 Gbps Data Rate)
Figure 12. Output Eye Diagram with the
TPD2EUSB30 (Figure 8 Setup, 5 Gbps Data Rate)
Figure 13. Output Eye Diagram Without the
TPD4EUSV30 (5 Gbps Data Rate)
Figure 14. Output Eye Diagram with the
TPD4EUSV30 (5 Gbps Data Rate)
Figure 15. TPDxEUSV30 EVM – TPD4EUSB30 Side
Figure 16. TPDxEUSV30 EVM – TPD2EUSB30 Side
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): TPD2EUSB30, TPD4EUSB30
Submit Documentation Feedback
7
PACKAGE OPTION ADDENDUM
www.ti.com
25-Aug-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
TPD2EUSB30DRTR
ACTIVE
SOT
DRT
3
3000
Green (RoHS
& no Sb/Br)
TPD4EUSB30DQAR
PREVIEW
SON
DQA
10
3000
TBD
Lead/
Ball Finish
MSL Peak Temp
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
Call TI
(3)
Call TI
Request Free Samples
Samples Not Available
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TPD2EUSB30DRTR
Package Package Pins
Type Drawing
SOT
DRT
3
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
8.4
Pack Materials-Page 1
1.16
B0
(mm)
K0
(mm)
P1
(mm)
1.16
0.63
4.0
W
Pin1
(mm) Quadrant
8.0
Q3
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TPD2EUSB30DRTR
SOT
DRT
3
3000
202.0
201.0
28.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated