TI TPD4E001DRLRG4

TPD4E001
LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS682C – JULY 2006 – REVISED APRIL 2007
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
•
•
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ESD Protection Exceeds
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC 61000-4-2 Contact Discharge
– ±15-kV IEC 61000-4-2 Air-Gap Discharge
Low 1.5-pF Input Capacitance
Low 1-nA (Max) Leakage Current
Low 1-nA Supply Current
0.9-V to 5.5-V Supply-Voltage Range
Four-Channel Device
Space-Saving DRL and QFN Package Options
Alternate 2-, 3-, 6-Channel Options Available:
TPD2E001, TPD3E001, and TPD6E001
USB 2.0
Ethernet
FireWire™
Video
Cell Phones
SVGA Video Connections
Glucosemeters
DESCRIPTION/ORDERING INFORMATION
The TPD4E001 is a low-capacitance ±15-kV ESD-protection diode array designed to protect sensitive
electronics attached to communication lines. Each channel consists of a pair of diodes that steer ESD current
pulses to VCC or GND. The TPD4E001 protects against ESD pulses up to ±15-kV Human-Body Model (HBM),
±8-kV Contact Discharge, and ±15-kV Air-Gap Discharge, as specified in IEC 61000-4-2. This device has a
1.5-pF capacitance per channel, making it ideal for use in high-speed data IO interfaces.
The TPD4E001 is a quad-ESD structure designed for Ethernet and FireWire™ applications.
The TPD4E001 is available in DRL and thin QFN packages and is specified for –40°C to 85°C operation.
ORDERING INFORMATION
PACKAGE (1)
TA
–40°C to 85°C
(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
1.6 × 1.6 DRL
Reel of 4000
TPD4E001DRLR
2CR
3 × 3 QFN
Reel of 1000
TPD4E001DRSR
ZWM
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
QFN PACKAGE
(TOP VIEW)
DRL PACKAGE
(TOP VIEW)
IO1
1
6
VCC
IO2
2
5
IO4
GND
3
4
IO3
IO1
1
6
VCC
IO2
2
5
IO4
4
IO3
GND
GND
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
FireWire is a trademark of Apple Computer, Inc.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
TPD4E001
LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS682C – JULY 2006 – REVISED APRIL 2007
FUNCTIONAL BLOCK DIAGRAM
VCC
IO1
IO3
IO2
IO4
GND
PIN DESCRIPTION
QFN/DRL NO.
NAME
1, 2, 4, 5
IOx
FUNCTION
3
GND
Ground
6
VCC
Power-supply input. Bypass VCC to GND with a 0.1-µF ceramic capacitor.
EP
EP
Exposed pad. Connect to GND.
ESD-protected channel
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
VI/O
Tstg
Storage temperature range
TJ
Junction temperature
Bump temperature (soldering)
2
MAX
7
–0.3
VCC + 0.3
V
–65
150
°C
150
°C
Infrared (15 s)
220
Vapor phase (60 s)
215
Lead temperature (soldering, 10 s)
(1)
MIN
–0.3
300
UNIT
V
°C
°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Submit Documentation Feedback
www.ti.com
TPD4E001
LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
SLLS682C – JULY 2006 – REVISED APRIL 2007
Electrical Characteristics
VCC = 5 V ± 10%, TA = -40°C to 85°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VCC
Supply voltage
ICC
Supply current
VF
Diode forward voltage
IF = 10 mA
0.65
VBR
Breakdown Voltage
IBR = 10mA
11
Channel clamp voltage (2)
VC
0.9
1
TA = 25°C, ±15-kV HBM,
IF = 10 A
Positive transients
TA = 25°C,
±8-kV Contact Discharge
(IEC 61000-4-2), IF = 24 A
Positive transients
TA = 25°C,
±15-kV Air-Gap Discharge
(IEC 61000-4-2), IF = 45 A
Positive transients
Ii/o
Channel leakage current
Vi/o = GND to VCC
Ci/o
Channel input capacitance
VCC = 5 V, Bias of VCC/2
(1)
(2)
TYP (1)
MAX
UNIT
5.5
V
100
nA
0.95
V
V
VCC + 25
Negative transients
–25
VCC + 60
Negative transients
–60
V
VCC + 100
Negative transients
–100
±1
1.5
nA
pF
Typical values are at VCC = 5 V and TA = 25°C.
Channel clamp voltage is not production tested
ESD Protection
PARAMETER
TYP
UNIT
±15
kV
IEC 61000-4-2 Contact Discharge
±8
kV
IEC 61000-4-2 Air-Gap Discharge
±15
kV
HBM
Submit Documentation Feedback
3
TPD4E001
LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS682C – JULY 2006 – REVISED APRIL 2007
TYPICAL OPERATING CHARACTERISTICS
IO CAPACITANCE
vs
IO VOLTAGE
(VCC = 5.0 V)
2.20
IO Capacitance (pF)
2.00
1.80
1.60
1.40
1.20
1.00
0.00
1.00
2.00
2.50
3.00
4.00
5.00
IO Voltage (V)
IO LEAKAGE CURRENT
vs
TEMPERATURE
(VCC = 5.5 V)
IO Leakage Current (pA)
1000
100
10
1
–40
25
45
Temperature (°C)
4
Submit Documentation Feedback
65
85
TPD4E001
LOW-CAPACITANCE 4-CHANNEL ±15-kV ESD PROTECTION ARRAY
FOR HIGH-SPEED DATA INTERFACES
www.ti.com
SLLS682C – JULY 2006 – REVISED APRIL 2007
APPLICATION INFORMATION
VBUS
0.1 µF
VCC
D+
D–
RT
GND
IO4
IO1
USB
Controller
D1
IO3
IO2
VBUS
D+
GND
D–
GND
Detailed Description
When placed near the connector, the TPD4E001 ESD solution offers little or no signal distortion during normal
operation due to low IO capacitance and ultra-low leakage current specifications. The TPD4E001 ensures that
the core circuitry is protected and the system is functioning properly in the event of an ESD strike. For proper
operation, the following layout/ design guidelines should be followed:
1. Place the TPD4E001 solution close to the connector. This allows the TPD4E001 to take away the energy
associated with ESD strike before it reaches the internal circuitry of the system board.
2. Place a 0.1-µF capacitor very close to the VCC pin. This limits any momentary voltage surge at the IO pin
during the ESD strike event.
3. Ensure that there is enough metallization for the VCC and GND loop. During normal operation, the
TPD4E001 consumes nA leakage current. But during the ESD event, VCC and GND may see 15 A to
30 A of current, depending on the ESD level. Sufficient current path enables safe discharge of all the
energy associated with the ESD strike.
4. Leave the unused IO pins floating .
5. The VCC pin can be connected in two different ways:
a. If the VCC pin is connected to the system power supply, the TPD4E001 works as a transient suppressor
for any signal swing above VCC + VF. A 0.1-µF capacitor on the device VCC pin is recommended for ESD
bypass.
b. If the VCC pin is not connected to the system power supply, the TPD4E001 can tolerate higher signal
swing in the range up to 10V. Please note that a 0.1µF capacitor is still recommended at the VCC pin for
ESD bypass.
Submit Documentation Feedback
5
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPD4E001DRLR
ACTIVE
SOT-553
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TPD4E001DRLRG4
ACTIVE
SOT-553
DRL
6
4000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-May-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
TPD4E001DRLR
7-May-2007
Package Pins
DRL
6
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
HNT
180
9
1.78
1.78
0.69
4
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TPD4E001DRLR
DRL
6
HNT
201.0
192.0
26.0
Pack Materials-Page 2
W
Pin1
(mm) Quadrant
8
Q3
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