NTE NTE622

NTE622
Silicon Rectifier, General Purpose, High Voltage,
Fast Recovery
(Surface Mount)
Features:
D High Temperature Metallurgically Bonded
D Glass Passivated Junction
D High Temperature Soldering Guaranteed:
+450°C/5 Seconds at Terminals. Complete Device Submersible Temperature of
+260°C/10 Seconds in Solder Bath.
Maximum Ratings and Electrical Characteristics: (TA = +25°C unless otherwise specified.
60Hz, resistive or inductive load. For capacitive load, derate current by 20%.)
Maximum Recurrent Peak Reverse Voltage, VRRM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V
Maximum RMS Voltage, VRMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 280V
Maximum DC Blocking Voltage, VDC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400V
Maximum Average Forward Rectified Current (TT = +75°C), IT(AV) . . . . . . . . . . . . . . . . . . . . . . . 0.5A
Peak Forward Surge Current, IFSM
(8.3ms Single Half Sine–Wave Superimposed on Rated Load) . . . . . . . . . . . . . . . . . . . . 10A
Maximum Instantaneous Forward Voltage (IT = 0.5A), VF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2V
Maximum DC Reverse Current (VDC = 400V), IR
TA = +25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5µA
TA = +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50µA
Maximum Reverse Recovery Time (TJ = +25°C, Note 1), trr . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50ns
Typical Junction Capacitance (Note 2), CJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4pF
Operating Junction Temperature Range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +175°C
Storage Temperature Range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65° to +175°C
Maximum Thermal Resistance, Junction–to–Terminal (Note 3), RthJL . . . . . . . . . . . . . . . . . . . 70°C/W
Maximum Thermal Resistance, Junction–to–Ambient (Note 4), RthJA . . . . . . . . . . . . . . . . . 150°C/W
Note
Note
Note
Note
1.
2.
2.
3.
Reverse Recovery Test Conditions: IF = 0.5A, IR = 1A, IRR = 0.25A..
Measured at 1MHz and applied reverse voltage of 4VDC.
Thermal resistance, junction–to–terminal, 5.0mm2 copper pads to each terminal.
Thermal resistance, junction–to–ambient, 5.0mm2 copper pads to each terminal.
Solderable Ends
1st Band (Device Type)
2nd Band (Voltage Type)
.066
(1.676)
Max Dia
.022 (.559) Max
.145 (3.683) Max
Two Bands Indicates Cathode