TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 Ultralow-Noise, High-PSRR, Fast, RF, 1-A LOW-DROPOUT LINEAR REGULATORS Check for Samples: TPS796xx-Q1 FEATURES APPLICATIONS • • • • • 1 23 • • • • • • • • • Qualified for Automotive Applications AEC-Q100 Test Guidance With the Following Results: – Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range – Device HBM ESD Classification Level H2 – Device CDM ESD Classification Level C3A 1-A Low-Dropout Regulator With Enable Available in Fixed and Adjustable (1.2 V to 5.5 V) Versions High PSRR (53 dB at 10 kHz) Ultralow-Noise (40 μVRMS, TPS79630-Q1) Fast Start-Up Time (50 μs) Stable With a 1-μF Ceramic Capacitor Excellent Load/Line Transient Response Very Low Dropout Voltage (250 mV at Full Load, TPS79630-Q1) SOT223-6 Package RF: VCOs, Receivers, ADCs Audio Bluetooth™, Wireless LAN DESCRIPTION The TPS796xx-Q1 family of low-dropout (LDO), lowpower, linear voltage regulators features high powersupply rejection ratio (PSRR), ultralow-noise, fast start-up, and excellent line and load transient responses in a small-outline SOT223-6 package. Each device in the family is stable with a small 1-μF ceramic capacitor on the output. The family uses an advanced, proprietary BiCMOS fabrication process to yield extremely low dropout voltages (for example, 250 mV at 1 A). Each device achieves fast start-up times (approximately 50 μs with a 0.001-μF bypass capacitor) while consuming very low quiescent current (265 μA typical). Moreover, when the device is placed in standby mode, the supply current is reduced to less than 1 μA. The TPS79630-Q1 exhibits approximately 40 μVRMS of output voltage noise at 3-V output, with a 0.1-μF bypass capacitor. Applications with analog components that are noisesensitive, such as portable RF electronics, benefit from the high-PSRR, low-noise features and the fast response time. TPS79630-Q1 TPS79630-Q1 RIPPLE REJECTION vs FREQUENCY OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 0.7 1 2 3 4 5 IOUT = 1 mA 60 6 GND Ripple Rejection − dB EN IN GND OUT NR/FB 70 50 VIN = 4 V COUT = 10 mF CNR = 0.01 mF IOUT = 1 A 40 30 20 10 0 1 10 100 1k 10 k 100 k 1 M 10 M Frequency (Hz) Output Spectral Noise Density - mV/ÖHz 80 DQC PACKAGE SOT223-6 (TOP VIEW) VIN = 5.5 V COUT = 2.2 mF CNR = 0.1 mF 0.6 0.5 0.4 0.3 IOUT = 1 mA 0.2 0.1 IOUT = 1.5 A 0.0 100 1k 10 k 100 k Frequency (Hz) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Bluetooth is a trademark of Bluetooth SIG, Inc. All other trademarks are the property of their respective owners. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) (1) (2) PRODUCT SPECIFIED TEMPERATURE RANGE, TA PACKAGE TYPE, PACKAGE DESIGNATOR (2) PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY TPS79633-Q1 –40°C to +125°C TPS79630-Q1 –40°C to 125°C SOT223-6, DCQ 79633Q TPS79633QDCQRQ1 Reel, 2500 SOT223-6, DCQ PREVIEW TPS79630QDCQRQ1 TPS79625-Q1 Reel, 2500 –40°C to 125°C SOT223-6, DCQ PREVIEW TPS79625QDCQRQ1 Reel, 2500 TPS79628-Q1 –40°C to 125°C SOT223-6, DCQ PREVIEW TPS79628QDCQRQ1 Reel, 2500 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) Over operating temperature range (unless otherwise noted). UNIT VIN range –0.3 V to 6 V VEN range –0.3 V to VIN + 0.3 V VOUT range 6V Peak output current Internally limited Continuous total power dissipation See Thermal Information table ESD ratings (1) 2 Human Body Model (HBM) AEC-Q100 Classification Level H2 2 kV Charged Device Model (CDM) AEC-Q100 Classification Level C3A 500 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range (unless otherwise noted). MIN Ambient temperature, TA NOM –40° MAX UNIT 125 °C THERMAL INFORMATION TPS796xx-Q1 THERMAL METRIC (1) (2) DCQ UNIT 6 PINS θJA Junction-to-ambient thermal resistance θJCtop θJB 70.4 °C/W Junction-to-case (top) thermal resistance 70 °C/W Junction-to-board thermal resistance N/A °C/W ψJT Junction-to-top characterization parameter 6.8 °C/W° ψJB Junction-to-board characterization parameter 30.1 °C/W θJCbot Junction-to-case (bottom) thermal resistance 6.3 °C/W (1) (2) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953A. For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 3 TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com ELECTRICAL CHARACTERISTICS Over recommended operating temperature range (TA = –40°C to 125°C), VEN = VIN,, VIN = VOUT(nom) + 1 V (1), IOUT = 1 mA, COUT = 10 μF, and CNR = 0.01 μF, unless otherwise noted. Typical values are at +25°C. PARAMETER TEST CONDITIONS MIN VIN Input voltage (1) IOUT Continuous output current Output voltage Accuracy Fixed VOUT < 5 V 0 μA ≤ IOUT ≤ 1 A, VOUT + 1 V ≤ VIN ≤ 5.5 V Output voltage line regulation (ΔVOUT%/VIN) (1) VOUT + 1 V ≤ VIN ≤ 5.5 V Load regulation (ΔVOUT%/ΔIOUT) 0 μA ≤ IOUT ≤ 1 A Dropout voltage (2) (VIN = VOUT (nom) – 0.1 V) MAX UNIT 5.5 V 0 1 A –2.0 +2.0 % 0.12 %/V 0.05 5 mV TPS79628-Q1 IOUT = 1 A 270 365 mV TPS79630-Q1 IOUT = 1 A 250 345 mV TPS79633-Q1 IOUT = 1 A 220 325 mV Output current limit VOUT = 0 V Ground pin current 0 μA ≤ IOUT ≤ 1 A Shutdown current (3) VEN = 0 V, 2.7 V ≤ VIN ≤ 5.5 V FB pin current VFB = 1.225 V Power-supply ripple rejection (1) TYP 2.7 TPS79630-Q1 Output noise voltage (TPS79630-Q1) Time, start-up (TPS79630-Q1) 2.4 4.2 A 265 385 μA 0.07 1 μA 1 μA f = 100 Hz, IOUT = 10 mA 59 dB f = 100 Hz, IOUT = 1 A 54 dB f = 10 Hz, IOUT = 1 A 53 dB f = 100 Hz, IOUT = 1 A 42 dB CNR = 0.001 μF 54 μVRMS CNR = 0.0047 μF 46 μVRMS CNR = 0.01 μF 41 μVRMS CNR = 0.1 μF 40 μVRMS CNR = 0.001 μF 50 μs CNR = 0.0047 μF 75 μs 110 μs BW = 100 Hz to 100 kHz, IOUT = 1 A RL = 3 Ω, COUT = 1 μF CNR = 0.01 μF EN pin current VEN = 0 V –1 1 UVLO threshold VCC rising 2.25 2.65 UVLO hysteresis 100 μA V mV High-level enable input voltage 2.7 V ≤ VIN ≤ 5.5 V 1.7 VIN V Low-level enable input voltage 2.7 V ≤ VIN ≤ 5.5 V 0 0.7 V (1) (2) (3) 4 Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater. TPS79650-Q1 is tested at VIN = 5.5 V. VDO is not measured for TPS79625-Q1 because minimum VIN = 2.7 V. For adjustable version, this applies only after VIN is applied; then VEN transitions high to low. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 FUNCTIONAL BLOCK DIAGRAM IN OUT UVLO Current Sense GND SHUTDOWN ILIM _ EN R1 + UVLO Thermal Shutdown R2 Quickstart VIN Bandgap Reference 1.225 V R2 = 40k 250 kΩ VREF NR Table 1. Terminal Functions TERMINAL NAME SOT223 (DCQ) NR 5 Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap. This improves power-supply rejection and reduces output noise. DESCRIPTION FB 5 This terminal is the feedback input voltage for the adjustable device. EN 1 Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. EN can be connected to IN if not used. GND 3, Tab IN 2 Unregulated input to the device. OUT 4 Output of the regulator. Regulator ground Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 5 TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS TPS79630-Q1 OUTPUT VOLTAGE vs OUTPUT CURRENT TPS79628-Q1 OUTPUT VOLTAGE vs JUNCTION TEMPERATURE TPS79628-Q1 GROUND CURRENT vs JUNCTION TEMPERATURE 2.795 4 3.05 VIN = 4 V COUT = 10 µF TJ = 25°C 3.04 3.03 350 VIN = 3.8 V COUT = 10 µF 340 IOUT = 1 mA 3 2.790 3.02 330 VOUT (V) 3.00 2.99 2.98 IGND (µA) 3.01 VOUT (V) VIN = 3.8 V COUT = 10 µF 2 2.785 IOUT = 1 A 320 IOUT = 1 A 310 2.780 1 IOUT = 1 mA 2.97 300 2.96 2.775 0 −40 −25 −10 5 2.95 0.2 0.4 0.6 0.8 1.0 IOUT (A) Figure 2. Figure 3. TPS79630-Q1 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY TPS79630-Q1 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY TPS79630-Q1 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 0.6 Output Spectral Noise Density − µV//Hz Output Spectral Noise Density − µV//Hz 6 TJ (°C) Figure 1. VIN = 5.5 V COUT = 2.2 µF CNR = 0.1 µF 0.5 0.4 0.3 IOUT = 1 mA 0.2 0.1 IOUT = 1.5 A 0.0 100 20 35 50 65 80 95 110 125 TJ (°C) 0.7 0.6 290 −40 −25 −10 5 20 35 50 65 80 95 110 125 1k 10k 100k 2.5 Output Spectral Noise Density − µV//Hz 0.0 VIN = 5.5 V COUT = 10 µF CNR = 0.1 µF 0.5 0.4 0.3 IOUT = 1 mA 0.2 0.1 0.0 100 IOUT = 1 A 1k 10k 100k 2.0 VIN = 5.5 V COUT = 10 µF IOUT = 1 A CNR = 0.01 µF CNR = 0.1 µF 1.5 CNR = 0.0047 µF 1.0 CNR = 0.001 µF 0.5 0.0 100 1k 10k Frequency (Hz) Frequency (Hz) Frequency (Hz) Figure 4. Figure 5. Figure 6. Submit Documentation Feedback 100k Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 TYPICAL CHARACTERISTICS (continued) TPS79628-Q1 DROPOUT VOLTAGE vs JUNCTION TEMPERATURE 80 VIN = 2.7 V COUT = 10 µF 300 50 IOUT = 1 A Ripple Rejection − dB 20 200 150 100 IOUT = 250 mA COUT = 10 µF BW = 100 Hz to 100 kHz 10 0 0.001 µF 0.0047 µF 50 30 20 10 IOUT = 250 mA 0 −40−25 −10 5 20 35 50 65 80 95 110 125 0.1 µF 0 100 1k 10k 100k TJ (_C) Frequency (Hz) Figure 7. Figure 8. Figure 9. TPS79630-Q1 RIPPLE REJECTION vs FREQUENCY TPS79630-Q1 RIPPLE REJECTION vs FREQUENCY VIN = 4 V COUT = 10 µF CNR = 0.1 µF IOUT = 1 A 40 30 20 10M START-UP TIME VIN = 4 V COUT = 2.2 µF CNR = 0.01 µF 70 Ripple Rejection − dB IOUT = 1 mA 1M 3 IOUT = 1 mA 60 VIN = 4 V, COUT = 10 µF, IOUT = 1.0 A 2.75 2.50 CNR = 0.0047 µF 2.25 IOUT = 1 A 40 30 Enable CNR = 0.001 µF 2 50 VOUT (V) 70 50 10 1 CNR (µF) 80 60 IOUT = 1 A 40 50 0.01 µF IOUT = 1 mA 60 40 30 VIN = 4 V COUT = 10 µF CNR = 0.01 µF 70 250 80 Ripple Rejection − dB TPS79630-Q1 RIPPLE REJECTION vs FREQUENCY 350 60 VDO (mV) RMS − Root Mean Squared Output Noise − µVRMS TPS79630-Q1 ROOT MEAN SQUARED OUTPUT NOISE vs BYPASS CAPACITANCE 1.75 1.50 CNR = 0.01 µF 1.25 1 20 10 10 0 0 0.75 0.50 0.25 100 1k 10k 100k 1M 10M 0 1 10 100 1k 10k 100k 1M 10M 200 300 400 500 600 t (ms) Figure 10. Figure 11. Figure 12. TPS79618-Q1 LINE TRANSIENT RESPONSE TPS79630-Q1 LINE TRANSIENT RESPONSE TPS79628-Q1 LOAD TRANSIENT RESPONSE 4 5 1 3 dv 1V + ms dt IOUT = 1 A COUT = 10 µF CNR = 0.01 µF IOUT (A) 2 4 IOUT = 1 A COUT = 10 µF CNR = 0.01 µF 3 ∆VOUT (mV) 0 −20 −40 dv 1V + ms dt 150 20 0 −20 −40 20 40 60 80 100 120 140 160 180 200 t (µs) Figure 13. Copyright © 2012, Texas Instruments Incorporated 0 0 −1 ∆VOUT (mV) 40 20 0 100 Frequency (Hz) 6 40 0 Frequency (Hz) 5 2 ∆VOUT (mV) 10 VIN (V) VIN (V) 1 20 40 60 80 100 120 140 160 180 200 t (µs) Figure 14. VIN = 3.8 V COUT = 10 µF CNR = 0.01 µF di 1A + ms dt 75 0 −75 −150 0 100 200 300 400 500 600 700 800 900 1000 t (µs) Figure 15. Submit Documentation Feedback 7 TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) TPS79630-Q1 DROPOUT VOLTAGE vs OUTPUT CURRENT TPS79625-Q1 POWER UP/POWER DOWN 3.0 ESR − Equivalent Series Resistance − Ω VOUT = 2.5 V RL = 10 Ω CNR = 0.01 µF 3.5 300 TJ = 125°C 250 2.5 VDO (mV) 2.0 200 TJ = 25°C 150 1.5 VIN 100 1.0 VOUT 0.5 TJ = −40°C 50 0 1 2 3 4 5 6 7 8 9 10 Region of Instability 10 1 Region of Stability 0.1 1 0 100 200 300 400 500 600 700 800 9001000 10 30 60 125 250 500 750 1000 200 µs/Div IOUT (mA) IOUT (mA) Figure 16. Figure 17. Figure 18. TPS79630-Q1 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 100 ESR − Equivalent Series Resistance − Ω COUT = 1 µF 0.01 0 0 COUT = 2.2 µF Region of Instability 10 1 Region of Stability 0.1 0.01 TPS79630-Q1 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT ESR − Equivalent Series Resistance − Ω 500 mV/Div 100 350 4.0 100 COUT = 10.0 µF Region of Instability 10 1 Region of Stability 0.1 0.01 1 8 TPS79630-Q1 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 10 30 60 125 250 500 750 1000 1 10 30 60 125 250 500 750 1000 IOUT (mA) IOUT (mA) Figure 19. Figure 20. Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 APPLICATION INFORMATION The TPS796xx-Q1 family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (265 μA typically), and enable input to reduce supply currents to less than 1 μA when the regulator is turned off. A typical application circuit is shown in Figure 21. VIN IN VOUT OUT TPS796xx-Q1 2.2 mF EN GND 1 mF NR 0.01 mF Figure 21. Typical Application Circuit External Capacitor Requirements Although not required, it is good analog design practice to place a 0.1-μF to 2.2-μF capacitor near the input of the regulator to counteract reactive input sources. A 2.2-μF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the TPS796xx-Q1, is required for stability and improves transient response, noise rejection, and ripple rejection. A higher-value input capacitor may be necessary if large, fast-risetime load transients are anticipated and the device is located several inches from the power source. As with most LDO regulators, the TPS796xx-Q1 requires an output capacitor connected between OUT and GND to stabilize the internal control loop. The minimum recommended capacitor is 1 μF. Any 1-μF or larger ceramic capacitor is suitable. The internal voltage reference is a key source of noise in an LDO regulator. The TPS796xx-Q1 has an NR pin that is connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in conjunction with an external bypass capacitor connected to the NR pin, creates a low-pass filter to reduce the voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR drop across the internal resistor, thus creating an output error. Therefore, the bypass capacitor must have minimal leakage current. The bypass capacitor should be no more than 0.1 μF in order to ensure that it is fully charged during the quickstart time provided by the internal switch shown in the Functional Block Diagram. For example, the TPS79630-Q1 exhibits 40 μVRMS of output voltage noise using a 0.1-μF ceramic bypass capacitor and a 10-μF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance increases because of the RC time constant at the bypass pin that is created by the internal 250-kΩ resistor and external capacitor. Board Layout Recommendation to Improve PSRR and Noise Performance To improve ac measurements such as PSRR, output noise, and transient response, it is recommended that the board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the ground pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the ground pin of the device. Regulator Mounting The tab of the SOT223-6 package is electrically connected to ground. For best thermal performance, the tab of the surface-mount version should be soldered directly to the printed circuit board (PCB) copper area. Increasing the copper area improves heat dissipation. Solder pad footprint recommendations for the devices are presented in an application bulletin Solder Pad Recommendations for Surface-Mount Devices, literature number AB-132, available for download from the TI web site (www.ti.com). Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 9 TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com Regulator Protection The TPS796xx-Q1 PMOS-pass transistor has a built-in back diode that conducts reverse current when the input voltage drops below the output voltage (for example, during power-down). Current is conducted from the output to the input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be appropriate. The TPS796xx-Q1 features internal current limiting and thermal protection. During normal operation, the TPS796xx-Q1 limits output current to approximately 2.8 A. When current limiting engages, the output voltage scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds approximately +165°C, thermal-protection circuitry shuts it down. Once the device has cooled down to below approximately +140°C, regulator operation resumes. 10 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 THERMAL INFORMATION POWER DISSIPATION Knowing the device power dissipation and proper sizing of the thermal plane that is connected to the tab or pad is critical to avoiding thermal shutdown and ensuring reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated using Equation 1: P D + ǒVIN * VOUTǓ I OUT (1) Power dissipation can be minimized and greater efficiency can be achieved by using the lowest possible input voltage necessary to achieve the required output voltage regulation. On the SON (DRB) package, the primary conduction path for heat is through the exposed pad to the PCB. The pad can be connected to ground or be left floating; however, it should be attached to an appropriate amount of copper PCB area to ensure the device does not overheat. On the SOT-223 (DCQ) package, the primary conduction path for heat is through the tab to the PCB. That tab should be connected to ground. The maximum junction-to-ambient thermal resistance depends on the maximum ambient temperature, maximum device junction temperature, and power dissipation of the device and can be calculated using Equation 2: ()125OC * T A) R qJA + PD (2) Knowing the maximum RθJA, the minimum amount of PCB copper area needed for appropriate heatsinking can be estimated using Figure 22. 160 DCQ DRB 140 qJA (°C/W) 120 100 80 60 40 20 0 0 Note: 1 2 4 5 7 3 6 Board Copper Area (in2) 8 9 10 θJA value at board size of 9 in2 (that is, 3 in × 3 in) is a JEDEC standard. Figure 22. θJA vs Board Size Figure 22 shows the variation of θJA as a function of ground plane copper area in the board. It is intended only as a guideline to demonstrate the effects of heat spreading in the ground plane and should not be used to estimate actual thermal performance in real application environments. NOTE: When the device is mounted on an application PCB, it is strongly recommended to use ΨJT and ΨJB, as explained in the Estimating Junction Temperature section. Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 11 TPS796xx-Q1 SBVS154 – MARCH 2012 www.ti.com ESTIMATING JUNCTION TEMPERATURE Using the thermal metrics ΨJT and ΨJB, as shown in the Thermal Information table, the junction temperature can be estimated with corresponding formulas (given in Equation 3). For backwards compatibility, an older θJC,Top parameter is listed as well. YJT: TJ = TT + YJT · PD YJB: TJ = TB + YJB · PD (3) Where PD is the power dissipation shown by Equation 2, TT is the temperature at the center-top of the IC package, and TB is the PCB temperature measured 1 mm away from the IC package on the PCB surface (as Figure 24 shows). NOTE: Both TT and TB can be measured on actual application boards using a thermo-gun (an infrared thermometer). For more information about measuring TT and TB, see the application note SBVA025, Using New Thermal Metrics, available for download at www.ti.com. By looking at Figure 23, the new thermal metrics (ΨJT and ΨJB) have very little dependency on board size. That is, using ΨJT or ΨJB with Equation 3 is a good way to estimate TJ by simply measuring TT or TB, regardless of the application board size. 35 DCQ YJB YJT and YJB (°C/W) 30 25 DRB YJB 20 15 10 DCQ YJT 5 DRB YJT 0 0 1 2 3 4 5 6 7 8 9 10 Board Copper Area (in2) Figure 23. ΨJT and ΨJB vs Board Size For a more detailed discussion of why TI does not recommend using θJC(top) to determine thermal characteristics, refer to application report SBVA025, Using New Thermal Metrics, available for download at www.ti.com. For further information, refer to application report SPRA953, IC Package Thermal Metrics, also available on the TI website. 12 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated TPS796xx-Q1 www.ti.com SBVS154 – MARCH 2012 TB 1 mm X TT on top (1) of IC TB on PCB surface (2) TT X 1 mm (a) Example DRB (SON) Package Measurement (b) Example DCQ (SOT-223) Package Measurement (1) TT is measured at the center of both the X- and Y-dimensional axes. (2) TB is measured below the package lead on the PCB surface. Figure 24. Measuring Points for TT and TB Copyright © 2012, Texas Instruments Incorporated Submit Documentation Feedback 13 PACKAGE OPTION ADDENDUM www.ti.com 2-Apr-2012 PACKAGING INFORMATION Orderable Device TPS79633QDCQRQ1 Status (1) ACTIVE Package Type Package Drawing SOT-223 DCQ Pins Package Qty 6 2500 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF TPS79633-Q1 : • Catalog: TPS79633 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Apr-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS79633QDCQRQ1 Package Package Pins Type Drawing SPQ SOT-223 2500 DCQ 6 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 Pack Materials-Page 1 6.8 B0 (mm) K0 (mm) P1 (mm) 7.3 1.88 8.0 W Pin1 (mm) Quadrant 12.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 2-Apr-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS79633QDCQRQ1 SOT-223 DCQ 6 2500 358.0 335.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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