NEC MC-7896

DATA SHEET
GaAs MULTI-CHIP MODULE
MC-7896
1 GHz CATV 27 dB POWER DOUBLER AMPLIFIER
DESCRIPTION
The MC-7896 is a GaAs Multi-chip Module designed for use in CATV applications up to 1 GHz. This unit has low
distortion, low noise figure and return loss across the entire frequency band.
Reliability and performance uniformity are assured by our stringent quality and control procedures.
FEATURES
• Low distortion
• High linear gain
GL = 27.0 dB MIN. @ f = 1 GHz
• Low return loss
ORDERING INFORMATION
Part Number
MC-7896
Order Number
MC-7896-AZ
Package
Supplying Form
7-pin special with heatsink (Pb-Free)
25 pcs MAX./Tray
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: MC-7896
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Supply Voltage
Symbol
Ratings
Unit
VDD
30
V
Note
Vi
65.0
dBmV
Operating Case Temperature
TC
−30 to +100
°C
Storage Temperature
Tstg
−40 to +100
°C
Input Voltage
Note In case of single tone
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10674EJ01V0DS (1st edition)
Date Published July 2007 NS
Printed in Japan
2007
MC-7896
RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω, unless otherwise specified)
Parameter
Supply Voltage
Input Voltage
Symbol
Test Conditions
VDD
Vi
77 channel,
MIN.
TYP.
MAX.
Unit
23.5
24.0
24.5
V
−
25.0
31.0
dBmV
−30
+25
+85
°C
7 dB tilted across the band
Operating Case Temperature
TC
ELECTRICAL CHARACTERISTICS (TC = 30±5°C, VDD = 24 V, ZS = ZL = 75 Ω, unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Linear Gain 1
GL1
f = 40 MHz
25.6
−
26.8
dB
Linear Gain 2
GL2
f = 1 GHz
27.0
−
28.0
dB
f = 40 MHz to 1 GHz
0.6
−
2.0
dB
f = 40 MHz to 1 GHz, Peak to valley
−
−
0.8
dB
Gain Slope
GSlope
Gain Flatness
GFlatness
Noise Figure 1
NF1
f = 50 MHz
−
−
5.0
dB
Noise Figure 2
NF2
f = 1 GHz
−
−
5.5
dB
RF OFF
−
−
385
mA
Operating Current
IDD
Composite Triple Beat
CTB
77 channel,
−
−
−63
dBc
Cross Modulation
XM
VO = 52 dBmV at 547.25 MHz,
−
−
−60
dBc
Composite 2nd Order Beat
CSO
7 dB tilted across the band
−
−
−65
dBc
Input Return Loss 1
RLi1
f = 40 MHz
20
−
−
dB
Input Return Loss 2
RLi2
f = 1 GHz
14
−
−
dB
Output Return Loss 1
RLo1
f = 40 MHz
21
−
−
dB
Output Return Loss 2
RLo2
f = 1 GHz
16
−
−
dB
2
Data Sheet PG10674EJ01V0DS
MC-7896
PACKAGE DIMENSIONS
7-PIN SPECIAL WITH HEATSINK (UNIT: mm)
8.1 MAX.
38.1±0.25
+0.25
φ 4.25–0.35
27.5 MAX.
4.0±0.25
14.85 MAX.
3.2 MAX.
45.08 MAX.
19.05±0.38
25.4±0.25
6-32UNC2B
0.51±0.05
10.75±0.25
7 8 9
2.62±0.35
5
12.9 MAX.
1 2 3
21.5 MAX.
4.19±0.13
2.54±0.25
A
2.54±0.38
6.3
0.51±0.05
2.5
0.38.. A
±0.05
PIN CONNECTION
VDD
5
1
9
IN
OUT
2
3
7
8
GND
Data Sheet PG10674EJ01V0DS
3
MC-7896
NOTES ON CORRECT USE
(1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress
to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance.
Recommended that space is 2.0 to 3.0 mm typical.
(2) Recommended torque strength of the screw is 59 to 78 Ncm.
(3) Form the ground pattern as wide as possible to minimize ground impedance.
(to prevent undesired oscillation)
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Partial Heating
Soldering Conditions
Peak temperature (pin temperature) : 350°C or below
Soldering time (per pin of device)
Recommended Condition Symbol
Note
: 3 seconds or less
Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead.
4
Data Sheet PG10674EJ01V0DS
−
MC-7896
• The information in this document is current as of July, 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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redundancy, fire-containment and anti-failure features.
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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M8E 02. 11-1
Data Sheet PG10674EJ01V0DS
5
MC-7896
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.