TMS37126 www.ti.com SCBS880 – MAY 2012 REMOTE ACCESS IDENTIFICATION DEVICE WITH INTEGRATED 3D WAKEUP RECEIVER AND IMMOBILIZER INTERFACE Check for Samples: TMS37126 FEATURES 1 • Low-Frequency (LF) Immobilizer Interface – Integrated Batteryless Immobilizer Interface – Half Duplex (HDX) Immobilizer Communication Achieves up to 4 inch (10 cm) Read Range – Special Selective Addressing Mode Allows Reliable Learn-In Sequence – 80-Bit Authentication Key Length – 80-Bit DST80 Security Authentication Coprocessor – Up to 8-kbit/s Uplink Data Rate – 5-/3-Byte Challenge/Response Algorithm – Fast Authentication Within 42 ms – Fast Mutual Authentication Within 65 ms – 133-Byte EEPROM – 91-Byte Available EEPROM User Memory – 32-Bit Unique Serial Number – High EEPROM Security and Flexibility – Write-Only Authentication Keys – Pages Are Irreversibly Lockable and Protectable – Protected Pages Programmable Only Through Mutual Authentication – Battery Check and Charge Functions – Each User Page is Lockable – Resonant Frequency: 134.2 kHz – Integrated Resonant Frequency Trimming • Low-Frequency 3D Wakeup Receiver – Highest Communication Range of More Than Three Meters – High Input Sensitivity: 3.7 mVpp (Typ) – High Q System – Integrated Resonant Circuit Trimming Compensates for Component Offsets – Received Signal Strength Indicator (RSSI) Output for Each Channel – Resonant Circuit Usable as Clock Reference for Microcontroller (134.2 kHz) – Frequency Range: 120 kHz to 140 kHz – Ultra-Low Standby Current: 3.8 μA (Typ) – Interface to up to Three External Antennas – Two Different Programmable Wake Patterns – Selectable Wake Pattern Length: 0, 4, 8 or 16 Bits – Two Separate Adjustable Wake-Up Levels – Digital Channel Sensitivity Adjustment for Each Antenna DESCRIPTION The TMS37126 Remote Access Identification Device (RAID) IC combines two functions in one device: • 3D wakeup receiver • DST80 immobilizer interface The RAID has an SPI interface to connect it to an external microcontroller. RAID is ideally suited for passive entry applications. The 3D low-frequency (LF) wakeup receiver offers high sensitivity to receive LF signals between 120 kHz and 140 kHz and has several other features such as received signal strength indicator (RSSI) measurement and bidirectional LF signaling. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2012, Texas Instruments Incorporated TMS37126 SCBS880 – MAY 2012 www.ti.com The embedded DST80 immobilizer interface offers a high level of security through its hardware encryption coprocessor and can also handle mutual authentication schemes. It operates without a battery and can be accessed in terms of its memory and encryption through the SPI interface. Power management features include battery charge and check as well as a battery backup function, which allows operation of all functions with low or even no battery as long as there is sufficient energy from the LF field. The Passive Entry (PE) device manages the immobilizer communication and LF wake reception. The special high-Q design achieves communication ranges up to 3 m for the PE link with outstanding low standby current on the receiver side. The front end offers flexible configuration of two different wake patterns of 0, 4, 8 or 16 bit length. Each channel can be adjusted in sensitivity and resonance frequency, which results in reproducible system designs. Security keys and rolling codes can be stored in the integrated EEPROM memory. This memory is accessible over the LF interface without support from the battery in the key fob and over the SPI interface. The PE device offers a special battery backup mode to operate the microcontroller without battery support. The external resonant circuit with an LF coil and a resonant capacitor can be trimmed to the correct resonant frequency with the integrated trimming capability, eliminating part tolerances. Ordering Information (1) PACKAGE (2) TA -40°C to 85°C (1) (2) ORDERABLE PART NUMBER TSSOP – DBT TMS37126D3XDBTRG4 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBT PACKAGE (TOP VIEW) TDAT TEN RF2 NPOR RF3 VCC_CU WDEEN VBAT VBATI NC NC NC NC MOD TX 2 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 TCLK RF1 VCL AM_MOD GND RSSI WAKE BUSY EOBA CLKA/M NC NC SPI_SIMO SPI_SOMI SPI_CLK Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37126 TMS37126 www.ti.com SCBS880 – MAY 2012 Car side Key fob side Current Measurement Load Drivers GIO UHF Transceiver or UHF Receiver CC11x1-Q1 SPI Interface GIO UHF Antenna Optional for Battery Charge LF Base Station TMS3705-Q1 UHF Transmitter or UHF Transceiver CC11x1-Q1 Up to 13 ft (4 m) Cable Length SPI Charging Amplifier Push Buttons Microcontroller LF Immobilizer Antenna LED Embedded Processor SPI Passive Entry Device GIO PEPS LF Driver 3D LF Antenna (3D Analog Frontend, Immobilizer) TMS37126 System Supply Power Supply Figure 1. Application Diagram Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37126 3 TMS37126 SCBS880 – MAY 2012 www.ti.com VBATI Antenna Matching Network VDD RF_P RF_N UHF Transmitter or UHF Transceiver CC11x1-Q1 RBIAS SI SO/GDO1 SCLK XOSC1 VBATI CSn XTAL GND XOSC2 LED1 P1.6 P1.7 P1.4 P1.5 P1.2 TEST P2.0 /RST P2.1 XOUT P2.2 Microcontroller XIN P2.3 P3.4 P3.5 P3.6 P3.7 EOBA BUSY SPI_CLK TX P3.2 P3.3 SPI_SOMI P3.0 P2.5 P3.1 P2.4 VSS SPI_SIMO VCC_MSP MOD VBATI P1.3 P1.0 P1.1 VBATI VBAT VBATI NPOR WDEEN AMMOD RF1 WAKE CLKA/M Passive Entry Front End TMS37126 RF2 RF3 RSSI TCLK CR2 LR3 TEN CR3 VCL VCL VCL VBAT LR2 VCC_CU CR1 GND LR1 CL VBAT TEST Interface TDAT VBAT Battery Figure 2. Application Schematic 4 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37126 TMS37126 www.ti.com SCBS880 – MAY 2012 Operating Characteristics Part Number TMS37126D3XDBTRG4 Features Immobilizer plus microcontroller with integrated power management DST80 authentication logic 80-bit key length, 5-byte challenge, 3-byte signature DST80 authentication time Mutual authentication: 65 ms Fast authentication: 42 ms Supply voltage (VBAT) 1.8 V to 3.6 V Standby current consumption 3.8 μA (typ) (three LF channels active) Transponder Transmission principle HDX (half duplex telegram protocol) Operating frequency 134.2 kHz Integrated resonant frequency trimming capability via LF or Test interface Security Challenge/response, mutual authentication Downlink 100% AM, PPM bit coding with 2 kbit/s (typ) Uplink FSK modulation with 7.9 kbit/s (typ) EEPROM memory 133 bytes EEPROM endurance 200 000 cycles (min) (TA = 25°C) Clock reference for microcontroller Resonant circuit can be used as clock reference for the microcontroller Battery check Two free programmable voltage levels: 2.0 V to 3.6 V with 0.1-V steps Battery charge Integrated battery charge functionality Key learn-in Special selective addressing to provide secure learn-in procedure 91-byte free available EEPROM user memory 32-bit unique serial number 3D Wakeup Receiver Sensitivity 3.7 mVpp (typ) Sensitivity tuning Separate for each channel and each wake pattern Operating frequency 120 kHz to 140 kHz Resonant frequency trimming Separate for each channel Wake pattern Two independent wake pattern with selectable length: 0, 4, 8 or 16 Bit Operating temperature -40°C to 85°C Package 30-pin TSSOP (DBT) Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TMS37126 5 PACKAGE OPTION ADDENDUM www.ti.com 30-May-2012 PACKAGING INFORMATION Orderable Device TMS37126D3XDBTRG4 Status (1) ACTIVE Package Type Package Drawing TSSOP DBT Pins Package Qty 30 2000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TMS37126D3XDBTRG4 Package Package Pins Type Drawing TSSOP DBT 30 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 6.95 B0 (mm) K0 (mm) P1 (mm) 8.3 1.6 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMS37126D3XDBTRG4 TSSOP DBT 30 2000 367.0 367.0 38.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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