TPD4F202, TPD6F202 www.ti.com SLLS800 – JUNE 2010 FOUR-, SIX-CHANNEL EMI FILTER WITH ESD PROTECTION FOR LCD DISPLAY Check for Samples: TPD4F202, TPD6F202 FEATURES 1 • • • • Four-, Six-Channel EMI Filtering and ESD Protection for Data Lines Excellent filter Performance – >40dB Attenuation at 1GHz-3GHz – -3dB Bandwidth at 108MHz – 70 dB Crosstalk Attenuation at 100 MHz Exceeds IEC61000-4-2 (Level 4) ESD Protection Requirements – ±25-kV IEC 61000-4-2 Contact Discharge – ±25-kV IEC 61000-4-2 Air-Gap Discharge – ±15-kV Human-Body Model (HBM) Pi-Style C-R-C Filter Configuration Offers Symmetric Filter Performance • • (R = 100 Ω, CTOTAL = 30 pF) Low 10-nA Leakage Current Space-Saving WCSP Package and Flow-Through Pin Mapping Provides Optimum Performance in Portable Applications APPLICATIONS • • • • • LCD Display Interface Memory Interface SVGA Video Connections Keypad Data Lines in Portables TPD4F202 YFU PACKAGE TPD6F202 YFU PACKAGE ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) WCSP – YFU PACKAGE DIMENSION ORDERABLE PART NUMBER TOP-SIDE MARKING Length = 2.36 mm, Width = 1.053 mm, TPD6F202YFUR Pitch = 0.4 mm, Height = 0.32 mm) YMS5WS Length = 1.56 mm, Width = 1.053 mm, TPD4F202YFUR Pitch = 0.4 mm, Height = 0.32 mm) YMS57S For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010, Texas Instruments Incorporated TPD4F202, TPD6F202 SLLS800 – JUNE 2010 www.ti.com DESCRIPTION The TPDxF202 are four, six-channel EMI filters, designed particularly to suppress EMI noise in the cell phone and other portable applications. These low-pass filters also protect internal core citcuity against system level ESD strikes at the external interface pins. The pi-style C-R-C filter provides symmetric filter performance in the data lines to/ from either side of the filter. Due to tiny package parasitics of the WCSP package, the TPDxF202 series of filters provide excellent signal attenuation (-40dB at 1GHz) at the typical cell-phone carrier frequency ranges. The ultra thin (0.3-mm package height, when mounted on board) space saving YFU package enables the TPDxF202 devices to mount on the printed circuit boards where the height is a key constraint. The TPDxF202 devices offer very robust system level ESD protection specifications at both input and output ports, which eliminates the need for any additional ESD clamp diodes at the external interface pins. The TPDxF202 devices are specified for –40°C to 85°C operation. EQUIVALENT SCHEMATIC REPRESENTATION 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 TPD4F202, TPD6F202 www.ti.com SLLS800 – JUNE 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN VIO MAX IO to GND 6 Continuous power dissipation (TA = 70°C) V 100 mW 150 °C Tstg Storage temperature range TJ Junction temperature 150 °C Lead temperature (soldering, 10 s) 300 °C (1) –65 UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS TA = –40°C to 85°C (Unless otherwise noted) PARAMETER TEST CONDITIONS VBR DC breakdown voltage R Resistance C Capacitance (C1 or C2) VIO = 3.3 V IIO Channel leakage current VIO = 3.3 V fC Cut-off frequency ZSOURCE = 50 Ω, ZLOAD = 50 Ω (1) IIO = 10 mA MIN TYP (1) MAX UNIT 100 115 Ω 6 85 V 15 pF 10 nA 108 MHz Typical values are at TA = 25°C. ESD PROTECTION TYP UNIT HBM PARAMETER ±15 kV IEC 61000-4-2 Contact Discharge ±25 kV IEC 61000-4-2 Air-Gap Discharge ±25 kV Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 3 TPD4F202, TPD6F202 SLLS800 – JUNE 2010 www.ti.com APPLICATION INFORMATION Typically, there are multiple EMI filters being utilized in cell phone applications to suppress the EMI interference. This means the total board area consumed by EMI filters are relatively large. One example of space saving innovation is to place the EMI filters right under the connectors so that the main PCB space is not utilized. The YFU packages of the TPDxF202 series offer ultra low-profile package height which enables such innovative component placement in portable applications. Package under-fill is recommended while using the YFU packages in flex boards. For maximum efficiency of filtering and ESD protection, while doing the board layout, care should be taken to reduce board parasitic from package GND pins to board GND plane. The TPDxF202 devices should be connected to a ground plane with a micro via adjacent to the device GND pad. If this is not possible, the connection to the ground plane should be as direct as possible to minimize the inductance. Due to flow-through pin mapping, the signal pins routing is easily achieved in a single layer. Figure 1. Board Layout with TPDxF20 4 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 TPD4F202, TPD6F202 www.ti.com SLLS800 – JUNE 2010 TYPICAL CHARACTERISTICS Figure 2. Channel-to-Channel Crosstalk Figure 3. Frequency Response Data (0 V Bias) Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 5 TPD4F202, TPD6F202 SLLS800 – JUNE 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 4. IEC Clamping Waveforms +8 kV Contact Figure 5. IEC Clamping Waveforms -8 kV Contact 6 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 TPD4F202, TPD6F202 www.ti.com SLLS800 – JUNE 2010 TYPICAL CHARACTERISTICS (continued) Figure 6. DC Characteristics (IIN vs. VIN), TA = 25ºC Figure 7. C1 or C2 Capacitance vs. VBIAS Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): TPD4F202, TPD6F202 7 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) TPD4F202YFUR ACTIVE DSBGA YFU 10 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 57S TPD6F202YFUR ACTIVE DSBGA YFU 15 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 5WS (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. 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Addendum-Page 1 Samples PACKAGE MATERIALS INFORMATION www.ti.com 15-Oct-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPD4F202YFUR DSBGA YFU 10 3000 178.0 9.2 TPD6F202YFUR DSBGA YFU 15 3000 178.0 9.2 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.21 1.72 0.45 4.0 8.0 Q1 1.19 2.5 0.45 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Oct-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4F202YFUR DSBGA YFU 10 3000 220.0 220.0 35.0 TPD6F202YFUR DSBGA YFU 15 3000 220.0 220.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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