SEOUL HBFR113-S

Z-Power LED
X10490
Technical
Data
Sheet
Specification
HBFR113-S
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Absolute Maximum Ratings
2.
Electro Characteristics
3.
Outline Dimension
4.
Electro-Optical characteristic Diagram
5.
Rank division
6.
Reliability tests
7.
Packing
8.
Soldering
9.
Precaution for use
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
HBFR113-S
Description
-
Small size suitable for compact
appliances.
-
Surface-mounted chip LED device.
-
Pb-free and RoHS complaint
HBFR113-S
Features
•
1.6(W) X 0.8(D)X 0.5(T)mm
•
Emitted Color : Red/Blue
•
Red: 625 nm
Blue: 470 nm
component.
-
Tape and Reel packing.
-
Increases the life time of battery.
Applications
•
Cellular phone’s keypad
lightning
•
Other decoration lighting
•
Information Boards
•
Lighting for Small Size
Device.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Absolute maximum ratings
(Ta=25℃)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
Forward Current
IF
Peak Forward Current
IFM *1
Reverse Voltage
VR
5
V
Operation Temperature
Topr.
-30 ~ 85
℃
Storage Temperature
Tstg.
-40 ~ 100
℃
Blue
66
Red
72
Blue
20
Red
30
Blue
50
Red
60
mW
mA
mA
*1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10.
2. Electro-Optical Characteristics
(Ta=25℃)
Parameter-
Symbol
Condition
Forward Voltage
VF
IF=5 ㎃
Reverse Current
IR
VR=5V
Luminous Intensity*2
IV
IF=5 ㎃
Dominant
Wavelength
λD
IF=5 ㎃
Viewing Angle*3
2θ1/2
IF=5 ㎃
Color
Min
Typ
Max
Blue
2.6
2.9
3.3
Red
2.4
Blue
10
V
㎂
Red
-
-
10
Blue
15
22
-
Red
20
30
-
Blue
462
470
475
Red
615
625
635
Blue
-
120
-
Red
120
Unit
mcd
nm
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the
LED package.
*3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
Rev.
(Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V)
00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
0.95
1.0
( Tolerance: ±0.1, Unit: mm )
1.0
Z-Power LED
X10490
Technical
Data
Sheet
3.Outline Dimension
Blue
Red
- Recommended Soldering Design
* MATERIALS
PARTS
MATERIALS
Package
BT Resin
Encapsulating Resin
Epoxy Resin
Electrodes
Au Plating Copper Alloy
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current vs. Forward Voltage (per die)
(Ta=25 OC )
Forward Current IF(mA)
100
Red
10
Blue
1
0.1
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
3.2
3.4
Forward Voltage VF(V)
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
200
180
Red
160
140
Intensity IV[mcd]
Z-Power LED
X10490
Technical
Data
Sheet
4. Electro-Optical characteristic Diagram
120
100
80
60
40
Blue
20
0
0
5
10
15
20
25
Forwa rd C urre nt IF (m A)
30
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
40
35
30
Forward current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
Ambient Temperature vs. Allowable Forward Current (per die)
25
20
15
10
5
0
-25
0
25
50
75
100
o
Ambient temperature Ta[ C]
Radiation Diagram
(Ta=25 OC )
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Rank Division
VF[V]
(IF=5mA)
RED
Blue
2.7~2.9(B)
1.70~2.40
(B)
2.9~3.1(C)
3.1~3.3 (D)
Iv[mcd]
WLD[nm]
(IF=5mA)
(IF=5mA)
RED
20~50 (B)
20~50 (B)
20~50 (B)
Blue
15~40 (B)
15~40 (B)
15~40 (B)
RED
615~635
(B)
615~635
(B)
615~635
(B)
Bin
Blue
465~470
(B)
01
470~475
(C)
02
465~470
(B)
03
470~475
(C)
04
465~470
(B)
05
470~475
(C)
06
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Reliability Tests
Item
Condition
Note
Flailed
Pass
On-Off Operating Life of
High Humidity Heat
10mA, 2s, On/Off
60℃, 90%RH
100,000cycle
0/22
O.K
Reflow Test
85℃85%24hrs => Reflow 3
times(Max260℃10sec)=>
thermal shock
500 hr
0/22
O.K
< Judging Criteria For Reliability Tests >
Item
Criteria for Judgment
Iv
< Initial * 0.5
Vf
< Initial ± 0.1V
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
4.0
0.2
8.0
(2.75)
3.5
1.75
2.0
1.5
1.85
4.0
0.5
0.95
0.5
11.4
180
9
2
60
Z-Power LED
X10490
Technical
Data
Sheet
7. Packing
Tolerance: ±0.2, Unit: ㎜
(1) Quantity: 4,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10˚angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Reel
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Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
수량 : 4000
Aluminum Vinyl Bag
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수량 : 4000
Outer Box
*Material: Paper(SW3B(B))
SIZE(mm)
TYPE
a
7inch 245
c
b
220 142
c
CHIP LED
TUV
MADE IN KOREA
Acriche
PART : SSC-HBFR113-S
CODE :
Q'YT : 40,000EA
Semiconductor EcoLight
LOT NO :
RoHS
b
a
DATE :
SEOUL SEMICONDUCTOR CO.,LTD
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or
a desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 65%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect
the light transmission efficiency, causing the light intensity to drop. Attention in followed;
a. After opened and mounted the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 30%
(3) In the case of more than 1 week passed after opening or change color of indicator
on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during
cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent
etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3
months or more after being shipped from SSC, a sealed container with a nitrogen
atmosphere should be used for storage.
(11) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(12) Repack unused products with anti-moisture packing, fold to close any opening and
then store in a dry place.
(13) The appearance and specifications of the product may be modified for improvement
without notice.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)