SEOUL AWT801-S

Z-Power LED
X10490
Technical
Data
Sheet
Specification
AWT801-S
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 01
August 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Features & Application
2.
Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Rank of AWT801-S
6. Color & Binning
7. Outline Dimension
8. Packing
9. Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
12. Reliability Test Item and Condition
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
AWT801-S
Features
Description
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a molded
plastic reflector sitting on top
of a bent lead frame. The die is
attached within the reflector
cavity and the cavity is
encapsulated by epoxy or
silicone
The package design coupled
with careful selection of
component materials allow
these products to perform with
high reliability in a larger
temperature range -40℃ to
100℃. The high reliability
feature is crucial to Automotive
interior and Indoor ESS.
AWT801-S
사진
• Industry Standard
PLCC SMT package
• High brightness
using InGaN dice
technologies
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Features & Application
• Warm-White colored SMT package
• Material InGaN/SiC
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
•Interior automotive
•Electronic Signs and Signals
•Office Automation, Electrical Appliances, Industrial Equipment
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
120
mW
Forward Current
IF
30
mA
Peak Forward Current
IFM *2
90
mA
Reverse Voltage
VR
5
V
Topr
-40 ~ +100
oC
Tstg
-40 ~ +100
oC
Operating
Temperature
Storage Temperature
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF=20 mA
2.7
3.3
4.0
V
Reverse Current
IR
VR=5V
-
-
50
μA
Luminous Intensity*1
IV
IF=20 mA
1600
mcd
Luminance Flux
ΦV
IF =20 mA
4
lm
2θ1/2
IF=20 mA
Optical Efficiency
ηop
IF =20 mA
Thermal Resistance*3
Rthja
IF =20 mA
Viewing Angle
*1.
the
the
*2.
*3.
*2
-
120
-
63
-
120
deg.
lm/W
-
K/W
The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with
mechanical axis of
LED package. Luminous Intensity Measurement allowance is ±10%
2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rthja results from mounting on PCB FR4(pad size≥16mm2 per pad, thickness≒ 0.6mm)
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
(Ta=25 OC )
2.2
Relative Luminous Intensity [a.u.]
2.0
Forward Current IF[mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
1
10
0
10
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.2
0
10
Forward Voltage VF[V]
20
30
Forward Current Derating Curve
Radiation Diagram
(Ta=25 OC )
40
Forward Current IF[mA]
40
Forward Current IF[mA]
0
30
-30
30
20
-60
60
10
0
-40
-20
0
20
40
60
80
100
120
-90
90
o
Ambient Temperature TA[ C]
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Rank of AWT801-S
▣ Rank Name
X1
X2
X3
IV
Color Rank
VF
▣ Luminous Intensity [mcd]
Rank Name
MIN
MAX
Color Target
J0
1000
1300
V, W
J3
1300
1700
R, S, T, V, W
J7
1700
2300
R, S, T, V
Rank Name
MIN
MAX
Z
3.0
3.3
A
3.3
3.6
▣ Forward Voltage [V]
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.9
515
0.8
520 525
530
510
535
0.7
540
545
550
555
505
560
0.6
565
570
575
580
585
590
595
600
CIE (y)
500
0.5
0.4
0.3
0.2
0.1
0.0
0.0
495
610
620
630
830
490
485
480
475
470
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CI E(x)
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
0.46
2700K
0.44
3000K
0.40
4500K
R1
0.38
R0
RA
0.36
SA
V0
T0
S1
S0
W0
T1
4000K
VA
TA
W1
V1
3500K
0.42
Y
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
WA
WB
VB
TB
SB
RB
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
X
● COLOR RANK
0.48
0.50
<IF=20mA, Ta=25℃>
4500K
RB
X
0.3515
0.35
0.3649
0.3676
RA
Y
0.3487
0.34
0.3482
0.36
X
0.3531
0.3515
0.3676
0.3704
R0
Y
0.3605
0.3487
0.36
0.3725
X
0.3546
0.3531
0.3704
0.3733
R1
Y
0.3717
0.3605
0.3725
0.3855
X
0.3562
0.3546
0.3733
0.376
Y
0.3855
0.3725
0.3881
0.402
X
0.376
0.3733
0.3997
0.4044
Y
0.3983
0.3843
0.3991
0.4127
X
0.4037
0.3985
0.4283
0.4356
Y
0.4127
0.3991
0.4058
0.422
X
0.4356
0.4283
0.4541
0.4617
Y
0.422
0.4058
0.415
0.43
X
0.4617
0.4541
0.4867
0.497
Y
0.3826
0.3717
0.3855
0.3974
4000K
SB
X
0.3676
0.3649
0.3866
0.391
SA
Y
0.36
0.3482
0.3618
0.375
X
0.3704
0.3676
0.391
0.3952
S0
Y
0.3725
0.36
0.375
0.3881
X
0.3733
0.3704
0.3952
0.3997
S1
Y
0.3974
0.3855
0.402
0.416
3500K
TB
X
0.3898
0.386
0.4106
0.4158
TA
Y
0.3716
0.36
0.372
0.3841
X
0.394
0.3898
0.4158
0.4225
T0
Y
0.3843
0.3716
0.3841
0.3991
X
0.3985
0.394
0.4225
0.4283
T1
Y
0.414
0.3983
0.4127
0.4294
3000K
VB
X
0.4158
0.4106
0.4307
0.4381
VA
Y
0.3841
0.372
0.3768
0.391
X
0.4225
0.4158
0.4381
0.4457
V0
Y
0.3991
0.3841
0.391
0.4058
X
0.4283
0.4225
0.4457
0.4541
V1
Y
0.4294
0.4127
0.422
0.4371
2700K
WB
X
Y
0.4381
0.391
0.4307
0.3768
0.4588
0.3838
0.467
0.3979
* Measurement Uncertainty
WA
X
0.4457
0.4381
0.467
0.478
of the Color
W0
Y
0.4058
0.391
0.3979
0.415
Coordinates
X
0.4541
0.4457
0.478
0.4867
: ± 0.01
W1
Y
0.4371
0.422
0.43
0.4466
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.46
2700K
0.44
W1
3000K
0.40
S2
R1
0.38
R0
RA
0.36
SA
V0
T0
S1
4500K
W0
T1
4000K
Y
V1
3500K
0.42
TA
VA
VB
WA
WB
TB
SB
RB
0.34
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
0.50
X
0.46
0.44
0.42
Y
2500K
2900K
0.40
3200K
3700K
0.38
4200K
0.36
4700K
0.34
0.34
0.36
0.38
0.40
0.42
X
0.44
0.46
0.48
0.50
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Recommended Solder Pattern
1.9
2.80
2.20
1.8
0.80
0.85
1.6
Cathode
1.8
1.50
3.20
2.40
1.65
Anode
0.50
0.15
2.2
ATTENTION MARKING ON LED IS ANODE(+)
( Tolerance: ±0.2, Unit: mm )
8. packing
4 .0 ±0 .1
3.5±0.1
5° 5°
1.75±0.1
2 .0 ±0 .0 5
0 .2 2 ±0 .0 5
1 .5 5 ± 0 .0 5
1 .0 ±0 .1
3.83±0.1
C0.8
8±0.1
8°
3 .1 ±0 .1
2 .2 2 ±0 .1
11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13 ±0.2
30°
10
60
Z-Power LED
X10490
Technical
Data
Sheet
7.outline dimension
22
Package
M arking
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape
is turned off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp
proof Package
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
c
a
b
245 220 102
7inch
245 220 142
TYPE
1 SIDE
c
TUV
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
MADE IN KOREA
Acriche
1
Semiconductor EcoLight
b
RoHS
a
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August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. soldering
(1) Lead Solder
Lead Solder
2.5~5 o C / sec.
Lead Solder
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box
(or a desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
12. Reliability Test Item and Condition
Item
Reference
Test Condition
Duration
/ Cycle
Number
of
Damage
Thermal Shock
EIAJ ED4701
Ta =-40oC (30MIN) ~ 100oC
(30MIN)
100
Cycle
0/22
Temperature
Cycle
EIAJ ED4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100
Cycle
0/22
High
Temperature
Storage
High
Temperature
High Humidity
Storage
Low
Temperature
Storage
EIAJ ED4701
Ta =100oC
1000
Hours
0/22
EIAJ ED4701
Ta =85oC, RH=85%
1000
Hours
0/22
EIAJ ED4701
Ta =-40oC
1000
Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =20mA
1000
Hours
0/22
Internal
Reference
Ta =85oC, RH=85%, IF =15mA
300
Hours
0/22
Internal
Reference
Ta =85oC, IF =20mA
500
Hours
0/22
Internal
Reference
Ta =-40oC, IF =20mA
1000
Hours
0/22
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
High
Temperature
High Humidity
Life Test
High
Temperature
Life Test
Low
Temperature
Life Test
ESD(HBM)
Criteria for Judging the Damage
Item
Symbol
Condition
Forward Voltage
VF
Reverse Current
Luminous
Intensity
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 01
August 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)