TI DS15EA101SQE/NOPB

DS15EA101
www.ti.com
SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
DS15EA101 0.15 to 1.5 Gbps Adaptive Cable Equalizer with LOS Detection
Check for Samples: DS15EA101
FEATURES
DESCRIPTION
•
The DS15EA101 is an adaptive equalizer optimized
for equalizing data transmitted over copper cables.
The DS15EA101 operates over a wide range of data
rates from 150 Mbps to 1.5+ Gbps and automatically
adapts to equalize any cable length from zero meters
to lengths that attenuate the signal by 35 dB at 750
MHz.
1
2
•
•
•
•
•
•
•
•
Automatic Equalization of Coaxial, Twin-Ax
and Twisted Pair Cables
High Data Rates: 150 Mbps to 1.5+ Gbps
Up to 35 dB of Boost at 750 MHz
LOS Detection and Output Enable
Single-Ended or Differential Input
50Ω Differential Outputs
Low Power Operation, 210 mW (typ) at 1.5
Gbps
Industrial -40°C to +85°C Temperature
Space-Saving 4 x 4 mm WQFN-16 Package
APPLICATIONS
•
•
•
•
The DS15EA101 allows either single-ended or
differential input drive. This enables equalization of
coaxial cables as well as differential twin-ax and
twisted pair cables.
Additional features include an LOS output and an
output enable which, when tied together, disable the
output when no signal is present.
The DS15EA101 is powered from a single 3.3V
supply and consumes 210 mW at 1.5 Gbps. It
operates over the full −40°C to +85°C industrial
temperature range and is available in a space saving
4 x 4 mm WQFN-16 package which allows for high
density placement of components in multi-channel
applications.
Cable Extention Applications
Security Cameras
Remote LCDs and LED Panels
Data Recovery Equalization
Typical Application
Serializer
50-ohm Coaxial Cable
(i.e. Belden 9914)
CML
DS15BA101
150 Mbps
to
1.5 Gbps
DS15EA101
Max Cable Loss ~ 35 dB @ 750 MHz
Deserializer
100-ohm Differential Cable
(i.e. CAT5e/6/7, Twinax)
LVDS
LVPECL
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2013, Texas Instruments Incorporated
DS15EA101
SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
−0.5V to 3.6V
Supply Voltage
−0.3V to VCC+0.3V
Input Voltage (all inputs)
−65°C to +150°C
Storage Temperature Range
Junction Temperature
+150°C
Lead Temperature
(Soldering 4 Sec)
+260°C
Package Thermal Resistance
θJA RGH0016A
θJC RGH0016A
+42.1°C/W
+8.2°C/W
ESD Rating (HBM)
8 kV
ESD Rating (MM)
250V
(1)
"Absolute Maximum Ratings" are those parameter values beyond which the life and operation of the device cannot be ensured. The
stating herein of these maximums shall not be construed to imply that the device can or should be operated at or beyond these values.
The table of Electrical Characteristics specifies acceptable device operating conditions.
Recommended Operating Conditions
Supply Voltage (VCC )
3.3V ±5%
Input Coupling Capacitance
1.0 µF
Loop Capacitor (Connected between
CAP+ and CAP-)
1.0 µF
Operating Free Air Temperature (TA)
-40°C to +85°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Symbol Parameter
VCM
Conditions
Input Common Mode Voltage
VIN
(1) (2)
Reference
.
Min
IN+, IN-
Typ
950
VOS
Output Common Mode Voltage
VOUT
Output Voltage Swing
50Ω load, differential
VLOS
LOS Output Voltage
Valid signal not present
OUT+, OUTLOS
ICC
Supply Current
Min to disable outputs
V
750
mVP-P
2.6
V
0.4
EN
(2)
(3)
(4)
(5)
2
(5)
V
3.0
V
Max to enable outputs
(1)
mVP-P
VCC –
VOUT/2
Valid signal present
EN Input Voltage
Units
V
(3) (4)
Input Voltage
VIN(EN)
Max
1.9
63
0.8
V
77
mA
Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to 0 volts.
Typical values are stated for VCC = +3.3V and TA = +25°C.
Specification is ensured by characterization.
The maximum input voltage amplitude assumes a DC-balanced signal.
Supply current depends on the amount of cable being equalized. The current is highest for short cable and decreases as the cable
length is increased.
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SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
AC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Conditions
(1)
.
Symbol
Parameter
Reference
Min
IN+, IN-
150
BRIN
Input Data Rate
tTRJ
Total Residual Jitter @ BER-12 1.5 Gbps
(2)
25m CAT5e (Belden 1700A),
0.25
UI
1.0 Gbps
50m CAT5e (Belden 1700A),
0.25
UI
0.5 Gbps
100m CAT5e (Belden 1700A),
0.25
UI
1.5 Gbps
50m CAT7 (Siemon Tera),
0.25
UI
1.5 Gbps
75m CAT7 (Siemon Tera),
0.30
UI
1.0 Gbps
100m CAT7 (Siemon Tera),
0.40
UI
1.5 Gbps
200m Belden 9914,
0.25
UI
(1)
(1)
(1)
(1)
(1)
(1)
(1)
tTLH
Transition Time from Low to
High
20% – 80%,
(3)
(3)
tTHL
Transition Time from High to
Low
20% – 80%,
ROUT
Output Resistance
single-ended,
(1)
(2)
(3)
(4)
OUT+, OUT-
(4)
Typ
Max
Units
1500
Mbps
100
220
ps
100
220
ps
50
Ω
Typical values are stated for VCC = +3.3V and TA = +25°C.
The total residual jitter at BER-12 was calculated as DJ+14.1xRJ, where DJ is deterministic jitter and RJ is random jitter. The jitter is
expressed as a portion of a unit interval (UI). One UI is a reciprocal of a bit rate (or data rate). For example, a 1.5 Gbps (gigabit per
second) signal has 1 / (1.5 Gb/s) = 666.67 ps (picosecond) unit interval. A 0.25 UI jitter is equivalent to 0.25 x 666.67 ps = 166.67 ps.
Specification is ensured by characterization.
Specification is ensured by design.
VCC
LOS
EN
VCC
15
14
13
OUT-
9
GND
8
(GND)
7
4
OUT+
10
GND
GND
11
GND
3
6
2
IN-
GND
5
IN+
12
DAP
CAP-
1
CAP+
GND
16
CONNECTION DIAGRAM
16-Pad WQFN
Package Number RGH0016A
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3
DS15EA101
SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
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PIN DESCRIPTIONS
Pin #
4
Name
Description
1
GND
Ground pin.
2
IN+
Non-inverting input pin.
3
IN-
Inverting input pin.
4
GND
Ground pin.
5
CAP+
Loop filter positive pin.
6
CAP-
Loop filter negative pin.
7
GND
Ground pin.
8
GND
Ground pin.
9
GND
Ground pin.
10
OUT-
Inverting output pin.
11
OUT+
Non-inverting output pin.
12
GND
Ground pin.
13
VCC
Power supply pin.
14
EN
Output enable pin.
15
LOS
Los of signal circuitry output pin.
16
VCC
Power supply pin.
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DS15EA101
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SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
DEVICE OPERATION
Input Interfacing
The DS15EA101 accepts either differential or single-ended input. The input must be AC coupled. Transformer
coupling is not supported. If the signal is differential, its amplitude must be 800 mVp-p ±10% (400 mV singleended). If the signal is single-ended, its amplitude must be 800 mV ±10%.
Output Interfacing
The DS15EA101 uses current mode outputs. They are internally terminated with 50Ω. The following two figures
illustrate typical DC-coupled interface to common differential receivers and assume that the receivers have high
impedance inputs. While most receivers have an input common mode voltage range that can accomodate CML
signals, it is recommended to check respective receiver's datasheet prior to implementing the suggested
interface implementations.
DS15EA101 Output
VCC
50:
50:
100: Differential T-Line
IN+
OUT+
100:
LVDS
IN-
OUT-
Figure 1. Typical DS15EA101 Output DC-Coupled Interface to an LVDS Receiver
DS15EA101 Output
VCC
50:
50:
OUT+
100: Differential T-Line
IN+
100:
CML3.3V
IN-
OUT-
Figure 2. Typical DS15EA101 Output DC-Coupled Interface to a CML Receiver
Cable Extender Application
The DS15EA101 together with the DS15BA101 form a cable extender chipset optimized for extending serial data
streams from serializer/deserializer (SerDes) pairs and field programmable gate arrays (FPGAs) over 100Ω
differential (i.e. CAT5e/6/7 and twinax) and 50Ω coaxial cables. Setting correct DS15BA101 output amplitude and
proper cable termination are keys for optimal operation. The following two figures show recommended chipset
configuration for 100Ω differential and 50Ω coaxial cables.
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DS15EA101
SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
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VCC
VCC
50:
953:
50:
0.1 PF
0.1 PF
100: Differential TP Cable
100:
1 PF
1 PF
RVO
IN+
OUT+
IN+
100:
DS15BA101
DS15EA101
1 PF
1 PF
IN-
OUT-
IN-
OUT+
OUT-
CAP+
CAP-
1 PF
Figure 3. Cable Extender Chipset Connection Diagram for 100Ω Differential Cables
VCC
VCC
50:
487:
50:
0.1 PF
0.1 PF
50: Coaxial Cable
IN+
100:
RVO
OUT+
1 PF
1 PF
IN+
50:
DS15BA101
OUT+
DS15EA101
1 PF
IN-
OUT-
IN-
25:
OUT-
CAP+
CAP-
1 PF
Figure 4. Cable Extender Chipset Connection Diagram for 50Ω Coaxial Cables
Reference Design
There is a complete reference design (P/N: DriveCable02EVK) available for evaluation of the cable extender
chipset (DS15BA101 and DS15EA101).
For more information visit http://www.ti.com/tool/drivecable02evk
6
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DS15EA101
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SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
Typical Performance
Maximum Data Rate as a Function of CAT7 (Siemon CAT7
Tera) Length
Maximum Data Rate as a Function of CAT5e (Belden 1700A)
Length
3.0
3.0
VCC = 3.3V
MAXIMUM DATA RATE (Gbps)
MAXIMUM DATA RATE (Gbps)
0.5 UI [email protected]
2.5
0.25 UI [email protected]
2.0
1.5
1.0
VCC= 3.3V
0.5
TA=25°C
2.5
TA = 25 °C
NRZ PRBS-7
2.0
0.5 UI [email protected]
1.5
1.0
0.5
0.25 UI [email protected]
NRZ PRBS-7
0
0
0
20
40
60
80
100
0
25
50
75
100
125
CAT5E LENGTH (m)
CAT7 LENGTH (m)
Figure 5.
Figure 6.
Maximum Data Rate as a Function of 50Ω Coaxial (Belden
9914) Length
Residual Jitter as a Function of Data Rate and Temperature
for the Chipset with 50m CAT5e
600
RESIDUAL JITTER @ BERT-12 (ps)
MAXIMUM DATA RATE (Gbps)
3.0
2.5
2.0
1.5
0.25 UI [email protected]
0.5 UI [email protected]
1.0
VCC= 3.3V
TA=25 °C
0.5
NRZ PRBS-7
0
0
60
120
180
240
VCC = 3.3V
500
0.25 UI
400
0.5 UI
300
85 °C
200
-40 °C
100
25 °C
0
300
50m CAT5e
NRZ PRBS-7
0
0.4
0.8
1.2
1.6
2.0
DATA RATE (Gbps)
BELDEN 9914 LENGTH (M)
Figure 7.
Figure 8.
Residual Jitter as a Function of Data Rate and Temperature
for the Chipset with 75m CAT5e
Residual Jitter as a Function of Data Rate and Temperature
for the Chipset with 100m CAT5e
600
VCC = 3.3V
75m CAT5e
NRZ PRBS-7
500
400
85 °C
300
0.5 UI
-40 °C
200
25 °C
100
0
0.25 UI
0
0.4
0.8
1.2
1.6
RESIDUAL JITTER @ BERT-12 (ps)
RESIDUAL JITTER @ BERT-12 (ps)
600
2.0
DATA RATE (Gbps)
VCC = 3.3V
100m CAT5e
NRZ PRBS-7
500
85 °C
400
300
0.5 UI
-40 °C
200
25 °C
100
0.25 UI
0
0
0.4
0.8
1.2
1.6
2.0
DATA RATE (Gbps)
Figure 9.
Figure 10.
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Typical Performance (continued)
8
A 1.5 Gbps NRZ PRBS-7 After 25m CAT5e
V:100 mV / DIV, H:100 ps / DIV
An Equalized 1.5 Gbps NRZ PRBS-7 After 25m CAT5e
V:100 mV / DIV, H:100 ps / DIV
Figure 11.
Figure 12.
A 1.0 Gbps NRZ PRBS-7 After 50m CAT5e
V:100 mV / DIV, H:150 ps / DIV
An Equalized 1.0 Gbps NRZ PRBS-7 After 50m CAT5e
V:100 mV / DIV, H:150 ps / DIV
Figure 13.
Figure 14.
A 0.5 Gbps NRZ PRBS-7 After 100m CAT5e
V:100 mV / DIV, H:400 ps / DIV
An Equalized 0.5 Gbps NRZ PRBS-7 After 100m CAT5e
V:100 mV / DIV, H:400 ps / DIV
Figure 15.
Figure 16.
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Typical Performance (continued)
A 1.5 Gbps NRZ PRBS-7 After 50m CAT7
V:100 mV / DIV, H:100 ps / DIV
An Equalized 1.5 Gbps NRZ PRBS-7 After 50m CAT7
V:100 mV / DIV, H:100 ps / DIV
Figure 17.
Figure 18.
An Equalized 1.5 Gbps NRZ PRBS-7 After 75m CAT7
V:100 mV / DIV, H:100 ps / DIV
A 1.5 Gbps NRZ PRBS-7 After 75m CAT7
V:100 mV / DIV, H:100 ps / DIV
Figure 19.
Figure 20.
A 1.0 Gbps NRZ PRBS-7 After 100m CAT7
V:100 mV / DIV, H:150 ps / DIV
An Equalized 1.0 Gbps NRZ PRBS-7 After 100m CAT7
V:100 mV / DIV, H:150 ps / DIV
Figure 21.
Figure 22.
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Typical Performance (continued)
10
A 1.5 Gbps NRZ PRBS-7 After 200m Belden 9914
V:100 mV / DIV, H:100 ps / DIV
An Equalized 1.5 Gbps NRZ PRBS-7 After 200m Belden
9914, V:100 mV / DIV, H:100 ps / DIV
Figure 23.
Figure 24.
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SNLS235H – SEPTEMBER 2006 – REVISED APRIL 2013
REVISION HISTORY
Changes from Revision G (April 2013) to Revision H
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 10
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PACKAGE OPTION ADDENDUM
www.ti.com
12-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
DS15EA101SQ/NOPB
ACTIVE
WQFN
RGH
16
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
15EA101
DS15EA101SQE/NOPB
ACTIVE
WQFN
RGH
16
250
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
15EA101
DS15EA101SQX/NOPB
ACTIVE
WQFN
RGH
16
4500
Green (RoHS
& no Sb/Br)
CU SN
Level-3-260C-168 HR
-40 to 85
15EA101
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
DS15EA101SQ/NOPB
WQFN
RGH
16
DS15EA101SQE/NOPB
WQFN
RGH
DS15EA101SQX/NOPB
WQFN
RGH
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1000
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
250
178.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
16
4500
330.0
12.4
4.3
4.3
1.3
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Apr-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DS15EA101SQ/NOPB
WQFN
RGH
16
1000
213.0
191.0
55.0
DS15EA101SQE/NOPB
WQFN
RGH
16
250
213.0
191.0
55.0
DS15EA101SQX/NOPB
WQFN
RGH
16
4500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
RGH0016A
SQA16A (Rev A)
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