CYSTEKEC MTP3001N3

Spec. No. : C400N3
Issued Date : 2006.10.17
Revised Date :
Page No. : 1/5
CYStech Electronics Corp.
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
MTP3001N3
Description
The MTP3001N3 is a P-channel enhancement-mode MOSFET, providing the designer with
the best combination of fast switching, ruggedized device design, low on-resistance and cost
effectiveness.
Features
• RDS(ON)[email protected]=-10V, ID=-5.3A
RDS(ON)[email protected]=-4.5V, ID=-4.2A
• Simple drive requirement
• Low on-resistance
• Fast switching speed
• Pb-free package
Applications
• Power management in notebook computer, portable equipment and battery powered systems.
Equivalent Circuit
MTP3001N3
Outline
SOT-23
D
G:Gate
S:Source
D:Drain
MTP3001N3
G
S
CYStek Product Specification
Spec. No. : C400N3
Issued Date : 2006.10.17
Revised Date :
Page No. : 2/5
CYStech Electronics Corp.
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Unit
Drain-Source Breakdown Voltage
BVDSS
-30
V
Gate-Source Voltage
VGS
±20
V
Continuous Drain Current @TA=25 °C (Note 1)
ID
-5.3
A
Continuous Drain Current @TA=70 °C (Note 1)
ID
-4
A
IDM
-20
A
Pd
1.25
W
Tj
-55~+150
°C
Tstg
-55~+150
°C
Rth,ja
50
°C/W
Pulsed Drain Current (Note 2)
Total Power Dissipation @ TA=25 °C
(Note 1)
Operating Junction Temperature
Storage Temperature
Thermal Resistance, Junction-to-Ambient
Note : 1.Surface mounted on 1 in² copper pad of FR-4 board, t≤10s.
2.Pulse width limited by maximum junction temperature.
Electrical Characteristics (Ta=25°C)
Symbol
Min.
Typ.
Max.
BVDSS
-30
VGS(th)
-1
-1.5
-3
IGSS
±100
IDSS
-1
60
70
*RDS(ON)
75
90
*GFS
4
7
Ciss
551
Coss
91
Crss
61
td(ON)
10.8
tr
2.3
td(OFF)
23
tf
4
Qg
9.5
Qgs
3.4
Qgd
1.7
ISD
-1.7
*VSD
-1.3
Unit
V
V
nA
μA
S
Test Conditions
VGS=0, ID=-250μA
VDS=VGS, ID=-250μA
VGS=±20V, VDS=0
VDS=-24V, VGS=0
ID=-5.3A, VGS=-10V
ID=-4.2A, VGS=-4.5V
VDS=-15V, ID=-5.3A
pF
VDS=-15V, VGS=0, f=1MHz
mΩ
ns
ns
ns
ns
nC
nC
nC
A
V
VDD=-15V, ID=-1A,
VGS=-10V, RGEN=6Ω, RD=15Ω
VDS=-15V, ID=-5.3A,
VGS=-10V,
VGS=0V, ISD=-1.7A
*Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2%
Ordering Information
Device
MTP3001N3
MTP3001N3
Package
SOT-23
(Pb-free)
Shipping
Marking
3000 pcs / Tape & Reel
01
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C400N3
Issued Date : 2006.10.17
Revised Date :
Page No. : 3/5
Characteristic Curves
On-Resistance vs Gate Voltage
On Resistance vs Drain Current
250
140
RDSON, On - Resistance (mΩ)
RDSON, On-Resistance(mΩ)
-ID=5.3A
200
150
100
50
120
100
VGS=-4.5V
80
60
VGS=-10V
40
0
20
1
2
3
4
5
6
7
8
9
10
-VGS , Gate-to-Source Voltage(V)
0
3
6
9
ID , Drain Current (A)
12
15
Power Dearting Curve
1.5
PD, Power Dissipation(W)
1.25
1
0.75
0.5
0.25
0
0
25
50
75
100
125
150
TA , Ambient Temperature(℃)
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C400N3
Issued Date : 2006.10.17
Revised Date :
Page No. : 4/5
Reel Dimension
Carrier Tape Dimension
MTP3001N3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C400N3
Issued Date : 2006.10.17
Revised Date :
Page No. : 5/5
SOT-23 Dimension
Marking:
A
L
3
B
TE
01
S
2
1
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
G
V
Style: Pin 1.Gate 2.Source 3.Drain
C
D
H
K
J
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102 0.1204
0.0472 0.0630
0.0335 0.0512
0.0118 0.0197
0.0669 0.0910
0.0005 0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034 0.0070
0.0128 0.0266
0.0335 0.0453
0.0830 0.1083
0.0098 0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
MTP3001N3
CYStek Product Specification