TI LM34904

LM34904
500mA Current Limited Power Switch
General Description
Features
The LM34904 is a 0.5A PFET switch used to control the input
voltage of electronic devices. It is easily integrated into system
designs that have a 2.8V to 5.3V voltage rail. Besides the
0.4Ω PFET switch, the LM34904 can be enabled or disabled
by a logic signal. The IC monitors the presence of a downstream electronic device via a dedicated pin to decide whether
to turn on the PFET switch. A power good signal generated
by the IC can be used by system control to determine the status of the switch. The LM34904 also provides over-current
and over-temperature protection. The IC comes in a tiny 6bump thin micro SMD package.
●
●
●
●
●
●
●
●
●
Input voltage of 2.8V to 5.3V
0.5A maximum switch current
0.4Ω typical total on-resistance
Load detection
Enable/disable
Switch on indicator
Peak current limit
Thermal shutdown
6-bump thin micro SMD package
Applications
● Handsets, tablets, notebooks
● Portable devices
Typical Application Circuit
30194201
PRODUCTION DATA information is current as of
publication date. Products conform to specifications per
the terms of the Texas Instruments standard warranty.
Production processing does not necessarily include
testing of all parameters.
301942 SNVS803D
Copyright © 1999-2012, Texas Instruments Incorporated
LM34904
Connection Diagram
30194202
Top View
6-Bump Thin Micro SMD Package
See NS Package Number TMD06AAA
Ordering Information
Order Number
Supplied As
LM34904ITM/NOPB
250 Units on Tape and Reel
LM34904ITMX/NOPB
3000 Units on Tape and Reel
Pin Descriptions
Name
Pin Number
Function
VCC
A1
Power input of the PFET switch. It also provides power to the entire IC. Connect
to the voltage rail that the accessory device is expected to work off.
GND
B1
Common Ground (device substrate).
POK
C1
Open-drain PFET status indicator. When the PFET is off, this pin floats. When
PFET is on, it is grounded.
ACC_DET
C2
Pull this pin low to tell the IC that the downstream accessory device is plugged
in.
ENABLE
B2
When this pin is low, the PFET will be turned off and POK will be open-drained.
Current limit circuitry will also be disabled. The IC will be in a low-power state.
This pin should be held low until VCC is established to ensure proper initial state
of internal logic. When ENABLE is high, the PFET switch will be allowed to turn
on.
ACC_PWR
A2
Power output terminal of the PFET switch. Connect to input rail of accessory
device.
Truth Table
Input
Output
ACC_DET
Current Limit
Detected
TJ Limit
Exceeded
2.8V < VCC < 5.3V
PFET Switch
Status
POK
0
x
No
No
Yes
Open
Open Drain
x
1
No
No
Yes
Open
Open Drain
0 to 1
0
No
No
Yes
On
Grounded
0 to 1
0
Yes
No
Yes
Current Limited
Grounded
x
x
x
Yes
2.2V < VCC < 5.3V
Open
Open Drain
0
x
x
No
2.2V < VCC < 2.8V
Open
Open Drain
ENABLE
Note: "x" stands for "don't care".
2
Copyright © 1999-2012, Texas Instruments Incorporated
LM34904
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for
availability and specifications.
VCC
ENABLE, POK, ACC_DET,
ACC_PWR (Note 2)
Junction Temperature (TJ)
Storage Temperature Range
ESD Susceptibility
Human Body Model (Note 3)
-0.3V to 6V
-0.3V to 6V
+150°C
−65°C to +150°C
2kV
Operating Ratings
VCC Voltage (Note 4)
Junction Temperature (TJ)
LM34904
2.8V to 5.3V
-40°C to +85°C
Electrical Characteristics
Unless otherwise stated, the following conditions apply: VCC = 3V. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the operating juction temperature (TJ) range. Minimum and maximum limits are guaranteed through test,
design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C and are provided for reference
purposes only.
Symbol
Parameter
Conditions
VIL
Input Low Voltage,
ACC_DET, ENABLE
VIH
Input High Voltage,
ACC_DET, ENABLE
VIHS
Input Hysteresis,
ACC_DET, ENABLE
ILK
Input Current, ACC_DET,
ENABLE
ACC_DET, ENABLE between 0V and
VCC
ISD
VCC Current in Shutdown
Mode
VENABLE = 0V
IQ
VCC Quiescent Current
RON
Total On Resistance
Between VCC and
ACC_PWR Pins
ILK_ACC
ACC_PWR Leakage
Current When PFET is Off
ILIMIT
PFET Switch Current Limit
VPOK
POK Current Sink Capability POK asserted. 1mA sink current
IPOK
POK Leakage Current
T1
ACC_DET Response Time
T2
ENABLE Response Time
T3
Minimum ENABLE Cycle
Time (Note 5)
Min
Typ
Max
Units
0.45
V
V
1.35
55
VVCC = 5.3V
VENABLE = 1.8V
VVCC = 5.3V, IACC_PWR = 0A
VVCC = 2.8V to 5.3V
IACC_PWR = 0.5A
mV
1
µA
0.005
1
µA
47
100
µA
0.4
0.6
Ω
1
µA
0.76
A
0.4
V
1
µA
VACC_PWR = 0V to VCC
VVCC = 5.3V
VENABLE = 0V
VVCC = 2.8V to 5.3V
VACC_PWR = 0V
0.50
0.59
POK de-asserted
VPOK = 3.3V
ACC_DET rising to either PFET or POK
FET turn-off
107
ns
ENABLE rising to either PFET or POK
FET turn-on
10
µs
ACC_DET tied to ground. ENABLE logic
high = 1.8V. VCC = 2.8V to 5.3V.
300
ns
Copyright © 1999-2012, Texas Instruments Incorporated
3
LM34904
Thermal Characteristics
Symbol
Description
Conditions
Typical Value
Unit
104
°C/W
θJA1
Junction-to-Ambient
Thermal Resistance
Mount device on a standard 4-layer 4" x 3" JEDEC board. Apply known
amount of power to the package. Measure junction temperature and
surrounding air temperature. No air flow. Refer to JESD51-7 for more
information.
θJA2
Junction-to-Ambient
Thermal Resistance
Mount device on a 2-layer 2.19" x 2.9" board. Copper thickness is 1 oz
per layer. No air flow. Power dissipation is 0.5W.
136
°C/W
TSD
Thermal Shutdown
Threshold
Raise TJ from below 120°C until POK is de-asserted. No load is
connected at ACC_PWR.
135
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the
device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the
Electrical Characteristics table.
Note 2: The voltages on these pins should never exceed VCC+0.3V.
Note 3: The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Test method is per JESD-22-A114.
Note 4: For VCC between 2.2V and 2.8V, if ENABLE is a logic low, the LM34904 will not turn on the PFET switch.
Note 5: If ENABLE toggles low from a high state, it needs to stay low for at least T3 long before toggling back to high. Otherwise the internal flip-flop may not be
set and the PFET switch may not turn on.
4
Copyright © 1999-2012, Texas Instruments Incorporated
LM34904
Typical Performance Characteristics
Total ON Resistance vs Temperature
Unless indicated otherwise, VCC = 3.0V and TJ = 25°C.
Total ON Resistance vs Switch Current
500
450
RON (mΩ)
RON (mΩ)
450
400
350
400
350
300
250
300
-40
-20
0
20
40
60
TEMPERATURE (°C)
80
0
100
200
300
400
IACC_PWR (mA)
500
30194212
30194214
Current Limit vs Temperature
450
650
400
625
ILIMIT (mA)
RON (mΩ)
Total ON Resistance vs VCC
350
600
300
575
250
550
2.5
3.0
3.5
4.0
4.5
VCC (V)
5.0
5.5
-40
-20
0
20
40
60
TEMPERATURE (°C)
80
30194211
Input Logic High Threshold vs Temperature
30194213
Input Logic Low Threshold vs Temperature
1.1
1.1
VCC = 5.3V
1.0
1.0
0.8
VCC = 2.8V
0.7
0.8
0.7
0.6
VCC = 2.8V
0.6
0.5
-20
VCC = 5.3V
0.9
VIL (V)
0.9
0.5
0
20
40
60
80
-20
30194216
Copyright © 1999-2012, Texas Instruments Incorporated
0
20
40
60
TEMPERATURE (°C)
80
30194215
5
LM34904
Block Diagram
30194203
Application Hints
To turn on the PFET switch, both the ENABLE and the ACC_DET pins need to be asserted. In addition, ACC_DET needs to be
asserted no later than the rising edge of the ENABLE signal. De-assertion of either the ENABLE or the ACC_DET will result in
turned-off PFET switch and de-asserted POK signal.
To prevent a glitch in the otherwise asserted ACC_DET from keeping the FETs turned off, it is a good practice to cycle the ENABLE
following every falling edge in the ACC_DET signal. When cycling the ENABLE, make sure it stays low for at least T3 long before
toggling back high. If ENABLE logic high level is not 1.8V, make sure ENABLE stays low for at least 1µs.
When laying out the PCB, try to keep the ENABLE and ACC_DET traces as short as possible and away from noisy traces.
6
Copyright © 1999-2012, Texas Instruments Incorporated
LM34904
Physical Dimensions inches (millimeters) unless otherwise noted
TMD06AAA Package
6-Bump Thin Micro SMD Package
NS Package Number TMD06AAA
X1 = 0.815 ±0.03mm
X2 = 1.215 ±0.03mm
X3 = 0.600 ±0.075mm
Copyright © 1999-2012, Texas Instruments Incorporated
7
Notes
Copyright © 1999-2012, Texas Instruments
Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated