DATA SHEET GaAs INTEGRATED CIRCUIT µPG2179TB L, S-BAND SPDT SWITCH DESCRIPTION The µPG2179TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 2.5 to 5.3 V. This device can operate frequency from 0.05 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. FEATURES • Switch control voltage : Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • Low insertion loss : Lins1 = 0.25 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins4 = 0.40 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High isolation : ISL1 = 27 dB TYP. @ f = 0.05 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 24 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • Handling power : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +32.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • PCS, W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number µPG2179TB-E4 Package 6-pin super minimold Marking G4C Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2179TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10454EJ02V0DS (2nd edition) Date Published March 2004 CP(K) Printed in Japan The mark shows major revised points. NEC Compound Semiconductor Devices 2003, 2004 µPG2179TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) G4C 1 (Top View) 2 3 (Bottom View) 6 1 6 6 1 5 2 5 5 2 4 3 4 4 3 Pin No. Pin Name 1 OUTPUT1 2 GND 3 OUTPUT2 4 Vcont2 5 INPUT 6 Vcont1 TRUTH TABLE Vcont1 Vcont2 INPUT−OUTPUT1 INPUT−OUTPUT2 Low High ON OFF High Low OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings Vcont 6.0 Unit Note V Input Power Pin +33 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Vcont1 − Vcont2 ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.5 3.0 5.3 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V 2 Data Sheet PG10454EJ02V0DS µPG2179TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Symbol Test Conditions Note1 MIN. TYP. MAX. Unit − 0.25 0.45 dB Insertion Loss 1 Lins1 f = 0.05 to 1.0 GHz Insertion Loss 2 Lins2 f = 1.0 to 2.0 GHz − 0.30 0.50 dB Insertion Loss 3 Lins3 f = 2.0 to 2.5 GHz − 0.35 0.55 dB Insertion Loss 4 Lins4 f = 2.5 to 3.0 GHz − 0.40 0.60 dB Isolation 1 ISL1 f = 0.05 to 2.0 GHz 23 27 − dB Isolation 2 ISL2 f = 2.0 to 3.0 GHz Input Return Loss Output Return Loss 0.1 dB Loss Compression Input Power RLin RLout Pin (0.1 dB) Note2 Note1 20 24 − dB f = 0.05 to 3.0 GHz Note1 15 20 − dB f = 0.05 to 3.0 GHz Note1 15 20 − dB f = 2.0 GHz +25.5 +29.0 − dBm f = 2.5 GHz +25.5 +29.0 − dBm f = 0.5 to 3.0 GHz − +29.0 − dBm Switch Control Current Icont No signal − 4 20 µA Switch Control Speed tsw 50%CTL to 90/10%RF − 50 500 ns Note1. DC cut capacitor = 1 000 pF at f = 0.05 to 0.5 GHz. 2. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) Parameter Symbol 1 dB Loss Compression Pin (1 dB) Input Power Test Conditions MIN. TYP. MAX. Unit f = 0.5 to 3.0 GHz − +32.0 − dBm f = 0.5 to 3.0 GHz, 2 tone, − +60.0 − dBm Note 3rd Order Intermodulation Intercept Point IIP3 5 MHz spicing Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution When using this IC, a DC coupling capacitor must be externally attached to the I/O pins. A DC coupling capacitor with a capacitance of 100 pF or lower is recommended when using a frequency of 0.5 GHz or higher, and one with a capacitance of 1,000 pF is recommended when using a frequency of less than 0.5 GHz. The ideal value changes depending on the frequency and bandwidth used, so select a capacitor with a suitable capacitance according to the usage conditions. Data Sheet PG10454EJ02V0DS 3 µPG2179TB EVALUATION CIRCUIT OUTPUT2 OUTPUT1 CO CO 3 2 1 4 5 6 CO 1 000 pF Vcont2 1 000 pF INPUT Vcont1 Remark CO : 0.05 to 0.5 GHz 1 000 pF 0.5 to 3.0 GHz 100 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10454EJ02V0DS µPG2179TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin SMM SPDT SW Vc2 OUTPUT2 C2 C 2 C 4 OUT 2 INPUT G4C C1 C3 C1 C1 IN C 1 C 5 C2 OUT 1 OUTPUT1 Vc1 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 100 pF 1 000 pF Data Sheet PG10454EJ02V0DS 5 µPG2179TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC cut capacitors = 100 pF, unless otherwise specified) INPUT–OUTPUT2 INSERTION LOSS vs. FREQUENCY 0.5 0.4 0.4 0.3 0.3 Insertion Loss Lins (dB) 0.5 0.2 0.1 0 –0.1 –0.2 –0.3 0.2 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.4 –0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY INPUT–OUTPUT2 ISOLATION vs. FREQUENCY 50 40 40 30 30 Isolation ISL (dB) 50 20 10 0 –10 –20 20 10 0 –10 –20 –30 –30 –40 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 50 40 40 Input Return Loss RLin (dB) Input Return Loss RLin (dB) Isolation ISL (dB) Insertion Loss Lins (dB) INPUT–OUTPUT1 INSERTION LOSS vs. FREQUENCY 30 20 10 0 –10 –20 –30 30 20 10 0 –10 –20 –30 –40 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10454EJ02V0DS INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 50 40 40 Output Return Loss RLout (dB) Output Return Loss RLout (dB) µPG2179TB 30 20 10 0 –10 –20 –30 –40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Frequency f (GHz) OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER 33 f = 1.0 GHz 31 29 Output Power Pout (dBm) Output Power Pout (dBm) 31 33 27 25 23 21 19 17 15 13 15 17 f = 2.5 GHz 29 27 25 23 21 19 17 15 19 21 23 25 27 29 31 33 35 13 15 17 Input Power Pin (dBm) 19 21 23 25 27 29 31 33 35 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PG10454EJ02V0DS 7 µPG2179TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 2.0±0.2 1.25±0.1 8 Data Sheet PG10454EJ02V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.9±0.1 0.1 MIN. µPG2179TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow VPS Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (package surface temperature) : 215°C or below Time at temperature of 200°C or higher : 25 to 40 seconds Preheating time at 120 to 150°C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 VP215 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10454EJ02V0DS 9 µPG2179TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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