TRANSCOM TC2997G

TC2997G
PRE2_20071107
Preliminary
3.5 GHz 16 W Flange Ceramic Packaged GaAs Power FETs
FEATURES
PHOTO ENLARGEMENT
 16 W Typical Power at 3.5 GHz
 9 dB Typical Linear Power Gain at 3.5 GHz
 High Linearity: IP3 = 52 dBm Typical
 High Power Added Efficiency: Nominal PAE of 37 %
 100 % DC and RF Tested
 Flange Ceramic Package
 Suitable for WiMax and WLL applications
DESCRIPTION
The TC2997G is a packaged Pseudomorphic High Electron Mobility Transistor (PHEMT) power
transistor. The flange ceramic package provides the best thermal conductivity for the GaAs FET. All
devices are 100% DC and RF tested to assure consistent quality. Typical applications include high
dynamic range power amplifier for commercial applications.
ELECTRICAL SPECIFICATIONS
Symbol
CONDITIONS
P1dB
Output Power at 1dB Gain Compression Point, Vd = 10V, Id = 4A, f=3.4 – 3.6GHz
GL
Linear Power Gain Vd = 10V, Id = 4A, f=3.4 – 3.6GHz
MIN
TYP
41.5
42.5
dBm
8
9
dB
52
dBm
rd
IP3
Intercept Point of the 3 -order Intermodulation, Vd = 10V, Id = 4A, f=3.4 – 3.6GHz, *PSCL = 32 dBm
PAE
Power Added Efficiency at 1dB Compression Power
IDSS
MAX
UNIT
37
%
Saturated Drain-Source Current at VDS = 2 V, VGS = 0 V
18.75
A
gm
Transconductance at VDS = 2 V, VGS = 0 V
13500
mS
VP
Pinch-off Voltage at VDS = 2 V, ID = 60 mA
-1.7
Volts
BVDGO
Rth
Drain-Gate Breakdown Voltage at IDGO =15 mA
20
Thermal Resistance
22
Volts
0.6
C/W
*PSCL: Output Power of Single Carrier Level, delta frequency=5MHz.
ABSOLUTE MAXIMUM RATINGS at 25 C
Symbol
VDS
VGS
IDS
Pin
PT
TCH
TSTG
Parameter
Drain-Source Voltage
Gate-Source Voltage
Drain Current
RF Input Power, CW
Continuous Dissipation
Channel Temperature
Storage Temperature
Rating
12 V
-5 V
IDSS
37.5 dBm
150 W
175 C
- 65 C to +175 C
HANDLING PRECAUTIONS:
The user must operate in a clean, dry environment.
Electrostatic Discharge (ESD) precautions should
be observed at all stages of storage, handling,
assembly, and testing. The static discharge must be
less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P1/3
TC2997G
PRE2_20071107
FLANGE PACKAGE OUTLINE (in mm)
Gate
Source
Source
Drain
EVALUATION BOARD
Co6, 10uF
Vg
Co5, 0.1uF
Co4, 1000pF
Rg7,
Thermistor
100ohm
Rg6, 100ohm
Rg3, 0ohm
VR1, 1Kohm
Vg=-5V
Rg5, 100ohm
Rg4, 1Kohm
PCB Material: RO4003
ER = 3.38
Thickness = 20 mil
Unit: mil
Vd=10V
Vd
Q1,
FMMT2907A
Ci5, 10uF
Rg2, 1Kohm
0805
Ci4, 0.1uF
Ci3, 1000pF
Rg1, 10ohm
Co1, ATC600B
0.4 pF
0805
0805
Co3, ATC600B
2 pF
Ci1, ATC600B
1.5 pF
RF in
386-350031
-001
0805
Unit: mil
0805
Ci2, ATC600B
0.2 pF
RF out
T9X_
3.3~3.8GHz
Co2, ATC600B
0.7 pF
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
P2/3
TC2997G
PRE2_20071107
Evaluation Board Parts List
Qt'y
1
2
1
2
1
1
1
2
2
2
1
1
1
1
1
Description
Chip resistor (1206) 10Ω±5%
Chip resistor (0603) 1KΩ±5%
Chip resistor (0603) 0Ω±5%
Chip resistor (0603) 100Ω±5%
Thermistor (0402) 100Ω ±5%
SMT Trimmer Potentiometers (3.0*3.0mm) 1KΩ
PNP, FMMT2907A (SOT-23)
Chip CAP (0603) 1000PF±10%
Chip CAP (0603) 0.1μF±20%
Chip CAP (1210) 10μF±20% or
(1206) 10μF±20%)
Chip CAP (0805) 1.5PF±0.1PF
Chip CAP (0805) 0.2PF±0.1PF
Chip CAP (0805) 0.4PF±0.1PF
Chip CAP (0805) 0.7PF±0.1PF
Chip CAP (0805) 2PF±0.1PF
Reference
Designator
Manufacturer
Inventory ID
Rg1
Rg2, Rg4
Rg3
Rg5, Rg6
Rg7
VR1
Q1
Ci3, Co4
Ci4, Co5
Murata
Murata
Ci5, Co6
Murata
Ci1
Ci2
Co1
Co2
Co3
American Technical Ceramics
American Technical Ceramics
American Technical Ceramics
American Technical Ceramics
American Technical Ceramics
GRM39X7R102K50V
GRM39Y5V104Z25V
GRM42-6Y5V106Z25V or
GRM31CF5E106ZA01L
ATC 600F1R5BT250 WVDC
ATC 600F0R2BT250 WVDC
ATC 600F0R4BT250 WVDC
ATC 600F0R7BT250 WVDC
ATC 600F2R0BT250 WVDC
Application Note:
High power FET turn on procedure
For evaluating or operating the high power FET, following turn-on and turn-off procedures are highly recommended to avoid
the device oscillations or burnout.
Turn-on Procedure:
1.The input and output of the device must connect to 50ohm.
2.ESD protection.
3.Vd must connect to external “Regulated Circuit” with a DC regulator included,
as similar as the idea shown herewith.
4.Voltage spike protection on input and output DC biasing is recommended.
5.Vgs set to -3V.
6.Open the output DC biasing (Vds).
7.Increase Vgs to get Idsq, quiescent drain current.
8.Turn on the RF driver.
Turn-off Procedure:
1.Turn off the RF driver.
2.Vg set to -3V.
3.Turn off Vd.
4.Turn off Vg.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Shanhua Jen, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
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