A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 1.0 General Description The AMIS-30663 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels for 3.3V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-30663 is able to reach outstanding levels of electromagnetic susceptibility. Similarly, extremely low electromagnetic emission is achieved by the excellent matching of the output signals. 2.0 Key Features • • • • • • • • • • • • • Fully compatible with the "ISO 11898-2" standard Certified "Authentication on CAN Transceiver Conformance (d1.1)" High speed (up to 1Mbit/s) Ideally suited for 12V and 24V industrial and automotive applications Low electromagnetic mission (EME) common-mode-choke is no longer required Differential receiver with wide common-mode range (+/- 35V) for high electro magnetic susceptibility (EMS) No disturbance of the bus lines with an un-powered node Transmit data (TxD) dominant time-out function Thermal protection Bus pins protected against transients in an automotive environment Short circuit proof to supply voltage and ground Logic level inputs compatible with 3.3V devices ESD protection level for CAN bus up to ±8kV 3.0 Technical Characteristics Table 1: Technical Characteristics Symbol VCANH VCANL Vi(dif)(bus_dom) tpd(rec-dom) tpd(dom-rec) CM-range VCM-peak VCM-step Parameter DC voltage at pin CANH DC voltage at pin CANL Differential bus output voltage in dominant state Propagation delay TxD to RxD Propagation delay TxD to RxD Input common-mode range for comparator Common-mode peak Common-mode step Conditions 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit Min. -45 -45 Max. +45 +45 Unit V V 42.5W < RLT < 60W 1.5 3 V See Figure 7 See Figure 7 Guaranteed differential receiver threshold and leakage current See Figure 8 and 9 (Note) See Figure 8 and 9 (Note) 100 100 -35 -500 -150 230 245 +35 500 150 ns ns V mV mV Note: The parameters VCM-peak and VCM-step guarantee low EME. 4.0 Ordering Information Marketing Name AMIS 30663NGA Package SOIC-8 GREEN AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com Temp. Range -40°C...125°C 1 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 5.0 Block Diagram VCC 3 Thermal shutdown V33 7 TxD Timer 'S' V33 6 Driver control 1 CANH CANL 8 AMIS-30663 Ri(cm) RxD 4 Vcc/2 + COMP VCC VREF Ri(cm) 5 2 GND PC20041012.1 Figure 1: Block Diagram 6.0 Typical Application 6.1 Application Schematic VBAT IN 5V-reg 60 W OUT 60 W 47 nF IN 3.3Vreg OUT VCC V33 8 RxD 3 4 CAN controller 7 AMIS30663 TxD GND Figure 2: Application Diagram www.amis.com 2 CANH VREF CANL 60 W 2 GND AMI Semiconductor - Rev. 1.4, Oct. 04 5 6 1 PC20040919.1 CAN BUS VCC 60 W 47 nF A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 6.2 Pin Description 6.2.1 Pin Out (top view) 1 GND 2 VCC 3 RxD 4 AMIS30663 TxD 8 V33 7 CANH 6 CANL 5 VREF PC20040918.8 Figure 3: Pin Configuration 6.2.2 Pin Description Table 2: Pin Out Pin 1 2 3 4 5 6 7 8 Name TxD GND VCC RxD VREF CANL CANH V33 Description Transmit data input; low input ® dominant driver; internal pull-up current Ground Sypply voltage Receive data output; dominant transmitter ® low output Reference voltage output LOW-level CAN bus line (low in dominant mode) HIGH-level CAN bus line (high in dominant mode) 3.3V supply for digital I/O 7.0 Functional Description 7.1 General The AMIS-30663 is the interface between the CAN protocol controller and the physical bus. It is intended for use in automotive and industrial applications requiring baud rates up to 1Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898-2" standard. 7.2 Operating Modes AMIS-30663 only operates in high-speed mode as illustrated in Table 3. The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME. AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 3 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet Table 3: Function Table (X = don’t care) 4.75 < VCC < 5.25V Pin Mode TxD 0 1 High Speed RxD 0 1 STATE Dominant Recessive Bus CANH High 0.5 VCC CANL Low 0.5 VCC VCC < PORL Mode - Pin TxD X RxD 1 STATE Recessive Bus CANH 0 < VCANH < VCC CANL 0 < VCANL < VCC RxD 1 STATE Recessive Bus CANH 0 < VCANH < VCC CANL 0 < VCANL < VCC PORL < VCC < 4.75V Mode - Pin TxD > VIH 7.3 Over-temperature Detection A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes HIGH. The thermal protection circuit is particularly needed when a bus line short circuits. 7.4 TxD Dominant Time-out Function A TxD dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin TxD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TxD. If the duration of the LOW-level on pin TxD exceeds the internal timer value tdom, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TxD. 7.5 Fail-safe Features A current-limiting circuit protects the transmitter output stage from damage caused by accidental short circuit to either positive or negative supply voltage although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Figure 4). Should TxD become disconnected, this pin is pulled high internally. When the VCC supply is removed, pins TxD and RxD will be floating. This prevents the AMIS-30663 from being supplied by the CAN controller through the I/O pins. 7.6 3.3V Interface AMIS-30663 may be used to interface with 3.3V or 5V controllers by use of the V33 pin. This pin may be supplied with 3.3V or 5V to have the corresponding digital interface voltage levels. When the V33 pin is supplied at 2.5V, even interfacing with 2.5V CAN controllers is possible. See also Digital Output Characteristics @ V33 = 2.5V, Table 7. In this case a pull resistor from TxD to V33 is necessary. AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 4 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 8.0 Electrical Characteristics 8.1 Definitions All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. 8.2 Absolute Maximum Ratings Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability. Table 4: Absolute Maximum Ratings Symbol VCC V33 VCANH VCANL VTxD VRxD VREF Vtran(CANH) Vtran(CANL) Vtran(VREF) Vesd(CANL/CANH) Vesd Latch-up Tstg Tamb Tjunc Parameter Supply voltage I/O interface voltage DC voltage at pin CANH DC voltage at pin CANL DC voltage at pin TxD DC voltage at pin RxD DC voltage at pin VREF Transient voltage at pin CANH Transient voltage at pin CANL Transient voltage at pin VREF Electrostatic discharge voltage at CANH and CANL pin Electrostatic discharge voltage at all other pins Static latch-up at all pins Storage temperature Ambient temperature Maximum junction temperature Conditions Min. -0.3 -0.3 -45 -45 -0.3 -0.3 -0.3 -150 -150 -150 -8 -500 -4 -250 0 < VCC < 5.25V; no time limit 0 < VCC < 5.25V; no time limit Note 1 Note 1 Note 1 Note 2 Note 5 Note 3 Note 5 Note 4 -55 -40 -40 Max. +7 +7 +45 +45 VCC + 0.3 VCC + 0.3 VCC + 0.3 +150 +150 +150 +8 +500 +4 +250 100 +155 +125 +150 Unit V V V V V V V V V V kV V kV V mA °C °C °C Notes 1) Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a, and 3b (see Figure 4). 2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2 3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV 4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993. 8.3 Thermal Characteristics Table 5: Thermal Characteristics Symbol Parameter Conditions Value Unit Rth(vj-a) Thermal resistance from junction to ambient in SO8 package In free air 145 K/W Rth(vj-s) Thermal resistance from junction to substrate of bare die In free air 45 K/W AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 5 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 8.4 DC Characteristics Table 6: Characteristics Symbol Conditions Parameter Min. Typ. Max. Unit Dominant; VTXD = 0V 45 65 mA Recessive; VTXD = VCC 4 8 1 mA mA 170 mA Supply (pin V CC and pin V 33) ICC Supply current I33 I/O interface current V33 = 3.3V; CL = 20pF; recessive I33 I/O interface current (1) V33 = 3.3V; CL = 20pF; 1Mbps Transmitter Data Input (pin TxD) VIH HIGH-level input voltage VIL LOW-level input voltage Output recessive 2.0 - VCC V -1.3 - +0.8 -1 0 +1 V mA -50 -200 -300 mA - 5 10 pF 0.7 x V33 0.75 x V33 IIH HIGH-level input current Output dominant VTxD = V33 IIL LOW-level input current VTxD = 0V C i Input capacitance (1) Receiver Data Output (pin RxD) VOH HIGH-level input voltage VOL LOW-level input voltage Ioh IRxD = -10mA IRxD = 5mA HIGH-level input voltage (1) VRxD = 0.7 x V33 Iol LOW-level input voltage (1) Reference Voltage Output (V REF) VRxD = 0.45V VREF -50mA < IVREF < +50mA Reference output voltage V 0.18 0.35 V -10 -15 -20 mA 5 10 15 mA 0.45 X VCC 0.50 X VCC 0.55 X VCC V 0.40 X VCC 0.50 X VCC 0.60 X VCC V -35V < VCANH < +35V VREF_CM Reference output voltage for full common-mode range -35V < VCANL < +35V Bus Lines (pins CANH and CANL) Vo(reces)(CANH) Recessive bus voltage at pin CANH Vo(reces)(CANL) Recessive bus voltage at pin CANL VTxD = VCC; no load 2.0 2.5 3.0 V VTxD = VCC; no load 2.0 2.5 3.0 V -2.5 - +2.5 mA -2.5 - -2.5 mA -35V < VCANH < +35V Io(reces)(CANH) Recessive output current at pin CANH 0V < VCC < 5.25V -35V < VCANL < +35V Io(reces)(CANL) Recessive output current at pin CANL 0V < VCC < 5.25V Vo(dom)(CANH) Dominant output voltage at pin CANH VTxD = 0V 3.0 3.6 4.25 V Vo(dom)(CANL) Dominant output voltage at pin CANL VTxD = 0V 0.5 1.4 1.75 V Vi(dif)(bus) Differential bus input voltage (VCANH - VCANL) 1.5 2.25 3.0 V VTxD = 0V; dominant; 42.5W < RLT < 60W Io(sc)(CANH) VTxD = VCC; recessive; no load -120 0 +50 mV VCANH = 0V; VTxD = 0V -45 -70 -95 mA Short circuit output current at pin CANH Io(sc)(CANL) Short circuit output current at pin CANL VCANL = 36V; VTxD = 0V 45 70 120 mA Vi(dif)(th) Differential receiver threshold voltage -5V < VCANL < +12V; -5V < VCANH < +12V; see Figure 5 0.5 0.7 0.9 V Vihcm(dif)(th) Differential receiver threshold voltage for high common-mode -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 0.25 0.7 1.05 V Vi(dif)(hys) Differential receiver input voltage hysteresis -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 50 70 100 mV Ri(cm)(CANH) Common-mode input resistance at pin CANH 15 25 37 kW Ri(cm)(CANL) Common-mode input resistance at pin CANL 15 25 37 kW Ri(cm)(m) Matching between pin CANH and pin CANL common-mode input VCANH = VCANL resistance -3 0 +3 % 25 kW Ri(dif) Differential input resistance 50 75 Ci(CANH) Input capacitance at pin CANH VTxD = VCC; not tested 7.5 20 pF Ci(CANL) Input capacitance at pin CANL VTxD = VCC; not tested 7.5 20 pF Ci(dif) Differential input capacitance VTxD = VCC; not tested 3.75 10 Input leakage current at pin CANH VCC = 0V; VCANH = 5V 170 250 pF mA ILI(CANH) AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 6 10 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet Table 6: Characteristics, Cont. Symbol Parameter Bus Lines (pins CANH and CANL) ILI(CANL) Input leakage current at pin CANL Common-mode peak during transition from dom ® rec or VCM-peak rec ® dom VCM-step Conditions Min. Typ. Max. Unit VCC = 0V; VCANL = 5V 10 170 250 mA See Figure 8 and 9 -500 500 mV Difference in common-mode between dominant and recessive state See Figure 8 and 9 -150 150 mV POR level CANH, CANL, Vref in tri-state below POR level 2.2 3.5 4.7 V 150 160 180 °C 85 60 55 100 VTxD = 0V 40 30 25 65 100 100 250 450 110 110 110 135 230 245 750 ns ns ns ns ns ns ms Conditions Min. Typ. Max. Unit VOH > 0.9 x V33 VOL < 0.1 x V33 -2.6 4 mA mA Power-on-Reset PORL Thermal Shutdown Tj(sd) Shutdown junction temperature Timing Characteristics (see Figure 6 and 7) td(TxD-BUSon) Delay TxD to bus active td(TxD-BUSoff) Delay TxD to bus inactive td(BUSon-RxD) Delay bus active to RxD td(BUSoff-RxD) Delay bus inactive to RxD tpd(rec-dom) Propagation delay TxD to RxD from recessive to dominant td(dom-rec) Propagation delay TxD to RxD from dominant to recessive tdom(TxD) TxD dominant time for time out Notes 1) Not tested on ATE. Table 7: Digital Output Characteristics @ V33 = 2.5V Symbol Parameter Receiver Data Output (pin RxD) Ioh HIGH-level output current Iol LOW-level output current VCC = 4.75 to 5.25V; V33 = 2.5V ± 5%; Tjunc = -40 to +150 °C; RLT =60W unless specified otherwise. 8.5 Measurement Set-ups and Definitions +3.3 V 100 nF +5 V VCC 100 nF V33 3 8 7 TxD CANH 1 1 nF AMIS30663 RxD 5 VREF Transient Generator 1 nF 4 6 CANL 2 20 pF GND PC20040918.9 Figure 4: Test Circuit for Automotive Transients AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 7 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet VRxD High Low Hysteresis PC20040829.7 0,9 0,5 Vi(dif)(hys) Figure 5: Hysteresis of the Receiver +3.3 V 100 nF +5 V 100 nF VCC V33 3 8 7 TxD 1 AMIS30663 RxD 4 5 CANH RLT VREF CLT 100 pF 60 W 6 CANL 2 20 pF GND PC20040918.10 Figure 6: Test Circuit for Timing Characteristics HIGH LOW TxD CANH CANL dominant Vi(dif) = VCANH - V CANL 0,9V 0,5V recessive RxD td(TxD-BUSon) 0,7 x V 33 0,3 x V 33 td(TxD-BUSoff) td(BUSon-RxD) tpd(rec-dom) tpd(dom-rec) td(BUSoff-RxD) Figure 7: Timing Diagram for AC Characteristics AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 8 PC20040829.6 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet +3.3 V 100 nF +5 V VCC V33 3 8 7 TxD 6.2 kW CANH 10 nF 1 Active Probe AMIS30663 Generator RxD 4 6 6.2 kW 5 2 20 pF CANL 30 W Spectrum Anayzer 30 W VREF 47 nF GND PC20040918.11 Figure 8: Basic Test Set-up for Electromagnetic Measurement CANH CANL recessive Vi(com) = VCANH + V CANL VCM-step VCM-peak PC20040829.7 VCM-peak Figure 9: Common-mode Voltage Peaks (see measurement set-up Figure 8) AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 9 A M I S - 3 0 6 6 3 High Speed CAN Transceiver 9.0 Package Outline SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012 Symbol A A1 A2 B C D E e H h L N a° Note AA AB AC Common Dimensions Min. Nom. Max. .061 .064 .068 .004 .006 0.010 .055 .058 .061 .0138 .061 .020 .0075 .008 .0098 See Variations .150 .155 .157 .050 BSC .230 .236 .244 .010 .013 .016 .016 .025 .035 See Variations 0° 5° 8° Variations 1 D Min. Nom. Max. .189 .194 .196 .337 .342 .344 .386 .391 .393 AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com Note 1 2 NOTES: 1. Maximum die thickness allowable is .015. 2. Dimensioning and tolerances per ANSI.Y14.5M - 1982. 3. “L” is the length of terminal for soldering to a substrate. 4. “N” is the number of terminal positions. 5. Formed leads shall be planar with respect to one another within .003 inches at seating plane. 6. Country of origin location and ejector pin on package bottom is optional and depend on assembly location. 7. Controlling dimension: inches. 2 N 8 14 16 10 Data Sheet A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet 10.0 Soldering 10.1 Introduction to Solering Surface Mount Package This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printedcircuit boards with high population densities. In these situations reflow soldering is often used. 10.2 Reflow Soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C. 10.3 Wave Soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: • Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. • For packages with leads on two sides and a pitch (e): ° Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board; ° Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the printed circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 10.4 Manual Soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C. AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 11 A M I S - 3 0 6 6 3 High Speed CAN Transceiver Data Sheet Table 8: Soldering Process Package Wave BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC (3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Soldering Method Reflow (1) Not suitable Not suitable (2) Suitable Not recommended (3)(4) Not recommended (5) Suitable Suitable Suitable Suitable Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." 2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. AMI Semiconductor - Rev. 1.4, Oct. 04 www.amis.com 12 Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2005 AMI Semiconductor, Inc.