AMI AMIS40616AGA

AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
1.0 General Description
The AMIS-40616 is a full-featured local interconnect network (LIN) transceiver designed to interface between a LIN protocol controller
and the physical bus. The transceiver is implemented in AMI Semiconductor’s SmartPower, high-voltage, mixed-signal 0.35µm CMOS
technology enabling both high-voltage analog circuitry and digital functionality to co-exist on the same chip.
The AMIS-40616 LIN device is a member of AMI Semiconductor’s in-vehicle networking (IVN) transceiver family and integrates a LIN
v2.0 physical transceiver and a 5V voltage regulator. It is designed to work in harsh automotive environments and is certified to the
TS16949 qualification flow.
The LIN bus is designed to communicate low rate data from control devices such as door locks, mirrors, car seats, and sunroofs at the
lowest possible cost. The bus is designed to eliminate as much wiring as possible and is implemented using a single wire in each node.
2.0 Key Features
2.1 LIN-Bus Transceiver
•
•
•
•
•
LIN compliant to specification revision 2.0 (backwards compatible to version 1.3) and J2602
SmartPower, high-voltage, mixed-signal 0.35µ CMOS technology
Bus voltage ± 45V
Transmission rate up to 20kBaud
SOIC 14 Green package
2.2 Protection
•
•
•
•
•
Thermal shutdown
Indefinite short-circuit protection of pins LIN and WAKE to supply and ground
Load dump protection (45V)
Bus pins protected against transients in an automotive environment
ESD protection level for LIN, INH, WAKE, and Vbb up to ±8kV
2.3 EMI Compatibility
• Integrated slope control
2.4 Voltage Regulator
•
•
•
•
Output voltage 5V / ~50mA
Wake-up input
Enable inputs for stand-by and sleep mode
INH output for auxiliary purposes (switching of an external pull-up or resistive divider towards battery, control of an external voltage
regulator etc.)
2.5 Modes
•
•
•
•
Normal mode: LIN communication with either low (up to 10kBaud) or normal slope
Sleep mode: VCC is switched “off” and no communication on LIN bus
Stand-by mode: VCC is switched “on” but there is no communication on LIN bus
Wake-up bringing the component from sleep mode into standby mode is possible either by LIN command or digital input signal on
WAKE pin. Wake-up from LIN bus can also be detected and flagged when the chip is already in standby mode.
AMI Semiconductor – January 2007, M-20545-001
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1
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
3.0 Ordering Information
Table 1: Ordering Information
Marketing Name
AMIS40616 AGA
Package
SOIC 150 14 GREEN (JEDEC MS-012)
Temperature Range
-40°C…105°C
4.0 Key Technical Characteristics
Table 2: Key Technical Characteristics
Symbol
Parameter
Vbb
Nominal battery operating voltage
(1)
Vbb
Load dump protection
Ibb_SLP
Supply current in sleep mode
Regulated Vcc output in normal mode, Vcc load 1mA-30mA
(5)
Vcc_out
Regulated Vcc output in normal mode, Vcc load 0mA-50mA
Regulated Vcc output in standby mode, Vcc load 0mA-50mA
(2)
Iout_max
Maximum continuous Vcc output current
(2)
Maximum Vcc output current, thermal shutdown can occur
V_wake
Operating DC voltage on WAKE pin
Maximum rating voltage on WAKE pin
Tj
Junction thermal shutdown temperature
Tamb
Operating ambient temperature
(3)
Vesd
Electrostatic discharge voltage (LIN, INH, WAKE, VBB) System HBM
(4)
Electrostatic discharge voltage (LIN, INH, WAKE, VBB) HBM
(4)
Electrostatic discharge voltage (other pins) HBM
Min.
6
Typ.
12
4.9
4.83
4.8
30
50
0
-45
165
-40
-8
-4
-2
5.0
5.0
5.0
Max.
26
45
20
5.1
5.17
5.2
Vbb
Vbb + 0.3
195
+105
+8
+4
+2
Unit
V
V
µA
V
V
V
mA
mA
V
V
°C
°C
kV
kV
kV
Notes:
1.
2.
3.
4.
5.
The applied transients shall be in accordance with ISO 7637 part 1, test pulse 5. The device complies with functional class C; class A can be reached
depending on the application and external components.
Current limitation is set above 50mA but thermal shutdown can occur for currents above 30mA.
Equivalent to discharging a 150pF capacitor through a 330Ω resistor conform to IEC Standard 1000-4-2. The specified values are a target to be verified on
first prototypes. Based on the evaluation results, additional external protection components might be recommended to reach the specified system ESD
levels.
Equivalent to discharging a 100pF capacitor through a 1.5kΩ resistor conform to MIL STD 883 method 3015.7.
Vcc voltage must be properly stabilized by external capacitors: capacitor of min. 80nF with ESR<10mΩ in parallel with a capacitor of min. 8µF, ESR<1Ω.
AMI Semiconductor – January 2007, M-20545-001
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2
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
5.0 Block Diagram
VBB
VCC
OTP_ZAP
INH
V-reg
Osc
VCC
Bandgap
STB
WAKE
State
&
Wake-up
Control
VBB
EN
RxD
Thermal
shutdown
COMP
Filter
VCC
TxD
Slope Control
time-out
VBB
TEST
POR
VCC
AMIS-40616
GND
PD20061213.1
Figure 1: Block Diagram
AMI Semiconductor – January 2007, M-20545-001
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3
LIN
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
6.0 Typical Application
6.1 Application Schematic
The EMC immunity of the master-mode device can be further enhanced by adding a capacitor between the LIN output and ground. The
optimum value of this capacitor is determined by the length and capacitance of the LIN bus, the number and capacitance of slave
devices, the pull-up resistance of all devices (master & slave), and the required time constant of the system, respectively.
Vcc voltage must be properly stabilized by external capacitors: capacitor of min. 80nF (ESR<10mΩ) in parallel with a capacitor of min.
8µF (ESR<1Ω).
VCC
14
13
LIN 2
AMIS- 12
40616 9
5
10
7 3 4 11 8
WAKE
10nF
1
WAKE
VCC
11
TxD
EN
Micro
controller
LIN
STB
WAKE
GND
GND
GND
KL30
LIN-BUS
KL31
Figure 2: Typical Application Diagram
6.2 Pin Description
6.2.1. Pin Out (top view)
1
14
VCC
LIN
2
13
RxD
GND
3
12
TxD
GND
4
11
GND
WAKE
5
10
STB
INH
6
9
EN
OTP_ZAP
7
8
TEST
AMIS40616
VBB
PC20060426.1
Figure 3: Pin Configuration
AMI Semiconductor – January 2007, M-20545-001
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10 uF 100nF
VBB
RxD
220pF
LIN
VBB
11
Slave Node
10 uF 100nF
VBAT
4
10nF
1 nF 1 kΩ
INH
GND
Master Node
10 uF 100nF
10 uF 100nF
VBAT
1
VCC
14
13
LIN 2
AMIS- 12
40616 9
5
10
7 3 4 11 8
WAKE
GND
VCC
RxD
TxD
EN
Micro
controller
STB
GND
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
6.2.2. Pin Description
Table 3: Pin Description
Pin
Name
1
VBB
2
LIN
3
GND
4
GND
5
WAKE
6
INH
7
OTP_ZAP
8
TEST
9
EN
10
STB
11
GND
12
TxD
13
RxD
14
Vcc
Description
Battery supply input
LIN bus output/input
Ground
Ground
High voltage digital input pin to switch the part from sleep- to stand-by-mode
Inhibit output
Supply for programming of trimming bits at factory testing, should be grounded in the application
Digital input for factory testing, should be grounded in the application
Enable input, transceiver in normal operation mode when high
Standby mode control input
Ground
Transmit data input, low in dominant state
Receive data output; low in dominant state; push-pull output
Supply voltage (output)
AMI Semiconductor – January 2007, M-20545-001
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5
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
7.0 Functional Description
7.1 Overall Functional Description
LIN is a serial communication protocol that efficiently supports the control of mechatronic nodes in distributed automotive applications.
The domain is class-A multiplex buses with a single master node and a set of slave nodes.
AMIS-40616 is designed as a master or slave node for the LIN communication interface with integrated 5V voltage regulator having a
current capability up to 50mA for supplying any external components (microcontroller).
AMIS-40616 contains the LIN transmitter, LIN receiver, voltage regulator, power-on-reset (POR) circuits and thermal shutdown (TSD).
The LIN transmitter is optimized for the maximum specified transmission speed of 20kBaud with EMC performance due to reduced slew
rate of the LIN output.
The junction temperature is monitored via a thermal shutdown circuit that switches the LIN transmitter and voltage regulator off when
temperature exceeds the TSD trigger level.
AMIS-40616 has four operating states (normal mode, low slope mode, stand-by mode, and sleep mode) that are determined by the
input signals EN, WAKE, STB, and TxD.
7.2 Operating States
AMIS-40616 provides four operating states, two modes for normal operation with communication, one stand-by without communication
and one low power mode with very low current consumption. See Figure 4.
Vcc: “on”
LIN TX: “off”
INH: “floating”
Term: “current
”
source”
RxD: high/low
Normal mode
(low slope)
-
EN goes from 0 to 1 while TxD = 1
EN goes from 1 to 0 while STB = 1
Local wake-up
or LIN wake-up
EN goes from 1 to 0 while STB = 0
Vcc: “on”
LIN TX: “on”
INH: “high”/”floating”
Term: 30k Ω
RxD: LIN data
Figure 4: State Diagram
AMI Semiconductor – January 2007, M-20545-001
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6
-
Normal mode
(normal slope)
Vcc: “on”
LIN TX: “on”
INH: “high”/”floating”
Term: 30k Ω
RxD: LIN data
EN goes from 1 to 0
while STB = 0
Stand-by mode
EN goes from 1 to 0
while STB = 1
-
EN goes from 0 to 1
while TxD = 0
Power up Vbb
-
Sleep mode
Vcc: “off”
LIN TX: “off”
INH: “floating”
Term: “current source”
RxD: =VCC
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
Table 4: Mode Selection
Mode
Vcc
Normal - Slope
On
Normal - Low Slope
On
Stand-by
Sleep
On
Off
Notes:
1.
2.
3.
RxD
Low = dominant state
High = recessive state
Low = dominant state
High = recessive state
Low after LIN wake-up, high otherwise
Clamped to Vcc
INH
High if STB = High during state
transition; floating otherwise
High if STB = High during state
transition; floating otherwise
Floating
Floating
LIN
Normal slope
30kΩ on LIN
On
Note
(1)
Low slope
On
(2)
Off
Off
Off
Off
(3)
The normal slope mode is entered when pin EN goes high while TxD is in high state during EN transition.
The low slope mode is entered when pin EN goes high while TxD is in low state during EN transition. LIN transmitter gets on only after TxD returns to high after the
state transition.
The stand-by mode is entered automatically after power-up.
7.2.1. Normal Slope Mode
In normal slope mode the transceiver can transmit and receive data via LIN bus with speed up to 20kBaud. The transmit data stream of
the LIN protocol is present on the TxD pin and converted by the transmitter into a LIN bus signal with controlled slew rate to minimize
EMC emission. The receiver consists of the comparator that has a threshold with hysteresis in respect to the supply voltage and an
input filter to remove bus noise. The LIN output is pulled high via an internal 30kΩ pull-up resistor. For master applications it is needed
to put an external 1kΩ resistor with a serial diode between LIN and Vbb (or INH). See Figure 2. The mode selection is done by
EN=HIGH when TxD pin is high. If STB pin is high during the standby-to-normal slope mode transition, INH pin is pulled high.
Otherwise, it stays floating.
7.2.2. Low Slope Mode
In low slope mode the slew rate of the signal on the LIN bus is reduced (rising and falling edges of the LIN bus signal are longer). This
further reduces the EMC emission. As a consequence the maximum speed on the LIN bus is reduced up to 10kBaud. This mode is
suited for applications where the communication speed is not critical. The mode selection is done by EN=HIGH when TxD pin is low. In
order not to transmit immediately a dominant state on the bus (because TxD=LOW), the LIN transmitter is enabled only after TxD
returns to high. If STB pin is high during the standby-to-low slope mode transition, INH pin is pulled high. Otherwise, it stays floating.
7.2.3. Stand-by Mode
The stand-by mode is always entered after power-up of the AMIS-40616. It can also be entered from normal mode when the EN pin is
low and the stand-by pin is high. From sleep mode it can be entered after a local wake-up or LIN wakeup. In stand-by mode the Vcc
voltage regulator for supplying external components (e.g. a microcontroller) stays active. Also the LIN receiver stays active to be able to
detect a remote wake-up via bus. The LIN transmitter is disabled and the slave internal termination resistor of 30kΩ between LIN and
Vbb is disconnected in order to minimize current consumption. Only a pull-up current source between Vbb and LIN is active.
7.2.4. Sleep Mode
The sleep mode provides extreme low current consumption. This mode is entered when both EN and STB pins are low coming from
normal mode. The internal termination resistor of 30kΩ between LIN and Vbb is disconnected and also the Vcc regulator is switched off
to minimize current consumption.
7.2.5. Wake-up
AMIS-40616 has two possibilities to wake-up from sleep or stand-by mode (see Figure 4):
• Local wake-up: enables the transition from sleep mode to stand-by mode.
• Remote wake-up via LIN: enables the transition from sleep- to stand-by mode and can be also detected when already in standby
mode.
A local wake-up is only detected in sleep mode if a transition from low to high or from high to low is seen on the wake pin.
AMI Semiconductor – January 2007, M-20545-001
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7
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
Wake
Detection of Local Wake-Up
Wake
VBB
Detection of Local Wake-Up
VBB
50% VBB typ.
Sleep Mode
50% VBB typ.
t
Stand-by Mode
Sleep Mode
Stand-by Mode
t
PC20060427.3
Figure 5: Local Wake-up Signal
A remote wake-up is only detected if a combination of (1) a falling edge at the LIN pin (transition from recessive to dominant) is
followed by (2) a dominant level maintained for a time period > tWAKE and (3) again a rising edge at pin LIN (transition from dominant to
recessive) happens.
LIN
Detection of Remote Wake-Up
VBB
LIN recessive level
tWAKE
60% Vbb
40% Vbb
LIN dominant level
Sleep Mode
Stand-by Mode
t
PC20060427.2
Figure 6: Remote Wake-up Behavior
The wake-up source is distinguished by pin RxD in the stand-by mode:
• RxD remains high after power-up or local wake-up.
• RxD is kept low until normal mode is entered after a remote wake-up (LIN).
AMI Semiconductor – January 2007, M-20545-001
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AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
8.0 Electrical Characteristics
8.1 Definitions
All voltages are referenced to GND (Pin 13). Positive currents flow into the IC.
8.2 Absolute Maximum Ratings
Stresses above those listed in this clause may cause permanent device failure. Exposure to absolute maximum ratings for extended
periods may affect device reliability.
Table 5: Absolute Maximum Ratings
Symbol
Parameter
(1)
Vbb
Battery voltage on pin Vbb
Vcc
DC voltage on pin Vcc
I_Vcc
Current delivered by the Vcc regulator
(2)
V_LIN
LIN bus voltage
V_INH
DC voltage on inhibit pin
V_WAKE
DC voltage on WAKE pin
V_Dig_in
DC input voltage on pins TxD, RxD, EN, STB
Tjunc
Maximum junction temperature
(3)
Vesd
Electrostatic discharge voltage (pins LIN, INH, WAKE, and Vbb) system HBM
(4)
Electrostatic discharge voltage (pins LIN, INH, WAKE, and Vbb) HBM
(4)
Electrostatic discharge voltage (other pins) HBM
(5)
Electrostatic discharge voltage; charge device model
Notes:
1.
2.
3.
4.
5.
Min.
-0.3
0
50
-40
-0.3
-45
-0.3
-40
-8
-4
-2.0
-250
Max.
+45
+7
+45
Vbb + 0.3
Vbb + 0.3
Vcc + 0.3
+165
+8
+4
+2.0
+250
Unit
V
V
mA
V
V
V
V
°C
kV
kV
kV
V
The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, and 5. The device complies with functional class C; class A can be
reached depending on the application and external components.
The applied transients shall be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, and 3b. The device complies with functional class C; class A can be
reached depending on the application and external components.
Equivalent to discharging a 150pF capacitor through a 330Ω resistor conform to IEC Standard 1000-4-2. The specified values are a target to be verified on first
prototypes. Based on the evaluation results, additional external protection components might be recommended to reach the specified system ESD levels.
Equivalent to discharging a 100pF capacitor through a 1.5k Ω resistor conform to MIL STD 883 method 3015.7.
Conform to EOS/ESD-DS5.3 (socket mode).
8.3 DC Characteristics
VBB = 6V to 26V; Tjunc = -40°C to +150°C; unless otherwise specified.
Table 6: DC Characteristics Supply
Symbol
Parameter
Pins VBB and VCC
Ibb_ON
Supply current
Ibb_STB
Supply current
Ibb_SLP
Supply current
Regulator output voltage
Vcc_out
Regulator output voltage
Regulator output voltage
Iout_max_cont
Maximum output current
Iout_max_conta
Maximum output current
Iout_max_abs
Absolute maximum output current
Iout_lim
Over-current limitation
AMI Semiconductor – January 2007, M-20545-001
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Conditions
Normal mode; LIN recessive
Stand-by mode, Vbb = 6 – 18V
Sleep mode, Vbb = 6 – 18V
Normal mode, Vcc load 1mA-30mA
Normal mode, Vcc load 0mA-50mA
Stand-by mode, Vcc load 0mA-50mA
Vbb = 16V; Tamb = 105°C
Vbb = 26V; limited lifetime
Thermal shutdown can occur
Min.
4.9
4.83
4.8
50
9
Typ.
5.0
5.0
5.0
Max.
Unit
1
60
20
5.1
5.17
5.2
30
30
50
150
mA
µA
µA
V
V
V
mA
mA
mA
mA
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
Table 7: DC Characteristics LIN Transmitter
Symbol
Parameter
Pin LIN
VLin_dom_LoSup
LIN dominant output voltage
VLin_dom_HiSup
LIN dominant output voltage
VLin_rec
LIN recessive output voltage
ILIN_lim
Short circuit current limitation
Rslave
Internal pull-up resistance
ILIN_off_dom
LIN output current bus in dominant state
ILIN_off_rec
LIN output current bus in recessive state
ILIN_no_GND
Communication not affected
ILIN_no_Vbb
LIN bus remains operational
Conditions
Min.
TXD = low; Vbb = 7.3V
TXD = low; Vbb = 18V
TXD = high; Ilin = 0mA
VLin = Vbb_max
Typ.
Vbb - Vγ (1)
40
20
-1
Driver off; Vbb = 12V
Driver off; Vbb = 12V
Vbb = GND = 12V; 0 < VLin < 18V
Vbb = GND = 0V; 0 < VLin < 18V
Max.
Unit
1.2
2.0
V
V
V
mA
kΩ
mA
µA
mA
µA
130
47
33
20
1
100
-1
Note:
1.
Vγ is the forward diode voltage. Typically (over the complete temperature) Vγ = 1V.
Table 8: DC Characteristics LIN Receiver
Symbol
Parameter
Pin LIN
Vrec_dom
Receiver threshold
Vrec_rec
Receiver threshold
Vrec_cnt
Receiver center voltage
Vrec_hys
Receiver hysteresis
Table 9: DC Characteristics I/Os
Symbol
Parameter
Pin WAKE
V_wake_th
Threshold voltage
(1)
I_leak
Input leakage current
T_wake_min
Debounce time
Pins TxD and STB
Vil
Low level input voltage
Vih
High level input voltage
(1)
Rpu
Pull-up resistance to Vcc
Pin INH
Delta_VH
High level voltage drop
I_leak
Leakage current
Pin EN
Vil
Low level input voltage
Vih
High level input voltage
(1)
Rpd
Pull-down resistance to ground
Pin RxD
Vol
Low level output voltage
Voh
High level output voltage
Conditions
LIN bus recessive → dominant
LIN bus dominant → recessive
(Vbus_dom + Vbus_rec) / 2
Conditions
Vwake = 0V; Vbb = 18V
Sleep mode; rising and falling edge
Min.
Typ.
0.4
0.4
0.475
0.05
Max.
Unit
0.6
0.6
0.525
0.175
Vbb
Vbb
Vbb
Vbb
Min.
Typ.
Max.
Unit
0.35
-1
8
-0.5
0.65
1
54
Vbb
µA
µs
0.3
1
200
Vcc
Vcc
kΩ
-1
0.75
1
V
µA
0
0.7
50
0.3
1
200
Vcc
Vcc
kΩ
0
0.8
0.2
1
Vcc
Vcc
0
0.7
50
IINH = 15mA
Sleep mode; VINH = 0V
Isink = 2mA
Isource = -2mA
0.35
Note:
1.
By one of the trimming bits, following reconfiguration can be done during chip-level testing in order to fit the AMIS-40616 into different interface: pins TxD, EN and
STB will have typ. 10kΩ pull-down resistor to ground and pin WAKE will have typ. 10µA pull-down current source.
Table 10: DC Characteristics
Symbol
Parameter
POR
PORH_Vbb
POR high level Vbb comparator
PORL_Vbb
POR low level Vbb comparator
POR_Vbb_hyst
Hysteresis of POR level Vbb comparator
POR_Vbb_sl
Maximum slope on Vbb to guarantee POR
PORH_Vcc
POR high level Vcc comparator
PORL_Vcc
POR low level Vcc comparator
POR_Vcc_hyst
Hysteresis of POR level Vcc comparator
TSD
Tj
Junction temperature
Tj_hyst
Thermal shutdown hysteresis
AMI Semiconductor – January 2007, M-20545-001
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Conditions
Min.
Typ.
Max.
Unit
4.5
V
V
mV
V/ms
V
V
mV
3
100
50
3
2
100
For shutdown
10
165
9
195
18
°C
°C
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
8.4 AC Characteristics
VBB = 7V to 18V; Tjunc = -40°C to +150°C; unless otherwise specified.
Table 11: AC Characteristics LIN Transmitter
Symbol
Parameter
Pin LIN
D1
Duty cycle 1 = tBUS_REC(min) / (2 x TBit)
D2
Duty cycle 2 = tBUS_REC(max) / (2 x TBit)
T_fall_norm
T_rise_norm
T_sym_norm
T_fall_norm
T_rise_norm
T_sym_norm
T_fall_low
T_rise_low
T_wake
T_dom
LIN falling edge
LIN rising edge
LIN slope symmetry
LIN falling edge
LIN rising edge
LIN slope symmetry
LIN falling edge
LIN rising edge
Dominant time-out for wake-up via LIN bus
TxD dominant time-out
Notes:
1.
2.
Conditions
THREC(min) = 0.284 x Vbb
THDOM(min) = 0.422 x Vbb
TBIT = 50µs
THREC(max) = 0.744 x Vbb
THDOM(max) = 0.581 x Vbb
TBIT = 50µs
(1)
Normal slope mode; Vbb = 12V; L1, L2
(1)
Normal slope mode; Vbb = 12V; L1, L2
(1)
Normal slope mode; Vbb = 12V; L1, L2
(1)
Normal slope mode; Vbb = 12V; L3
(1)
Normal slope mode; Vbb = 12V; L3
(1)
Normal slope mode; Vbb = 12V; L3
(2)
(1)
Low slope mode ; Vbb = 12V; L3
(2)
(1)
Low slope mode ; Vbb = 12V; L3
TxD = low
Min.
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11
Max.
Unit
0.396
0.581
-4
-5
30
6
The AC parameters are specified for following RC loads on the LIN bus: L1 = 1kΩ / 1nF; L2 = 660Ω / 6.8nF; L3 = 500Ω / 10nF.
Low slope mode is not compliant to the LIN 1.3 or LIN 2.0 standard.
AMI Semiconductor – January 2007, M-20545-001
Typ.
22.5
22.5
4
27
27
5
62
62
150
20
µs
µs
µs
µs
µs
µs
µs
µs
µs
ms
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
TxD
tBIT
tBIT
50%
t
tBUS_dom(max)
LIN
tBUS_rec(min)
THRec(max)
THDom(max)
Thresholds of
receiving node 1
THRec(min)
THDom(min)
Thresholds of
receiving node 2
t
tBUS_dom(min)
tBUS_rec(max)
PC20060428.2
Figure 7: LIN Transmitter Duty Cycle
LIN
100%
60%
60%
40%
40%
0%
t
T_fall
T_rise
Figure 8: LIN Transmitter Rising and Falling Times
AMI Semiconductor – January 2007, M-20545-001
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12
PC20060428.1
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
Table 12: AC Characteristics LIN Receiver
Symbol
Parameter
Pin LIN
Trec_prop_down
Propagation delay of receiver falling edge
Trec_prop_up
Propagation delay of receiver rising edge
Trec_sym
Propagation delay symmetry
Conditions
Min.
Trec_prop_down - Trec_prop_up
Typ.
0.1
0.1
-2
LIN
Vbb
60% Vbb
40% Vbb
t
RxD
trec_prop_down
trec_prop_up
50%
t
Figure 9: LIN Receiver Timing
AMI Semiconductor – January 2007, M-20545-001
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13
PC20060428.3
Max.
Unit
6
6
2
µs
µs
µs
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
9.0 Package Outline
SOIC-14: Plastic small outline; 14 leads; body width 150mil; JEDEC: MS-012
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14
AMIS reference: SOIC150 14 150 G
AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards (PCBs) with
high population densities. In these situations re-flow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by
screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example,
infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200
seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 260°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as
solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was
specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
the PCB;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The
footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the PCB. The footprint
must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
AMI Semiconductor – January 2007, M-20545-001
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AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
Table 13: Soldering Process
Package
Soldering Method
Wave
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
(3)
PLCC , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes:
1.
2.
3.
4.
5.
Not suitable
(2)
Not suitable
Suitable
(3)(4)
Not recommended
(5)
Not recommended
Re-flow
(1)
Suitable
Suitable
Suitable
Suitable
Suitable
All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
dry pack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
These packages are not suitable for wave soldering as a solder joint between the PCB and heat sink (at bottom version) can not be achieved, and as solder may
stick to the heat sink (on top version).
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal or smaller than 0.65mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
11.0 Revision History
Table 14: Revision History
Revision
Date
1.0
24 May 2006
1.1
9 August 2006
1.6
18 January 2007
Format
Preliminary
Preliminary
Preliminary
Description
Initial document
Major update according AMIS40615
ƒ major update according AMIS40616
ƒ version numbering aligned with AMIS40615
AMI Semiconductor – January 2007, M-20545-001
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AMIS-40616
Data Sheet
LIN Transceiver with 5V Voltage Regulator
12.0 Company or Product Inquiries
For more information about AMI Semiconductor’s LIN transceivers, send an email to [email protected]
For more information about AMI Semiconductor’s products or services visit our Web site at http://www.amis.com.
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sales only. AMIS makes no warranty, express, statutory,
implied or by description, regarding the information set forth herein or regarding the freedom of the described from patent infringement. AMIS makes no warranty of
merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI
Semiconductor’s products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high
reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such
applications. Copyright© 2007 AMI Semiconductor, Inc.
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