AMIS-39100: Octal High Side Driver with Protection
Data Sheet
1.0 General Description
The AMIS-39100 is a general purpose IC with eight integrated high side (HS) output drivers. The device is designed to control the
power of virtually any type of load in a 12V automotive environment, such as transistor gates, relays, LEDs etc.
Each of the output drivers of the AMIS-39100 is able to drive up to 275mA continuously when connected to an inductive load of 300mH.
Even higher driver output currents can be obtained as long as the total current of the device is limited. The integrated charge-pump of
the AMIS-39100, which uses only one low cost external capacitor, avoids thermal runaways even if the battery voltage is low. The HS
drivers withstand short to ground (even when AMIS-39100 has lost its ground connection), short to the battery and has over-current
limitation. In case of a potential hazardous situation, the drivers are switched off and the diagnostic state of the HS drivers can be read
out via serial peripheral interface (SPI). In case of a short to ground, the output driver is deactivated after a de-bounce time.
The AMIS-39100 can be connected to a 3.3V or 5V microcontroller by means of a SPI interface. This SPI interface is used to control
each of the output drivers individually (on or off) and to read the status of each individual output driver (read-back of possible error
conditions). This allows the detection of error situations for each driver individually. Furthermore, the SPI interface can be used to readback the status of the built-in thermal shutdown protection. The AMIS-39100 has a low-power mode and excellent handling and system
ESD characteristics.
2.0 Key Features
•
•
•
•
•
•
•
•
•
•
•
•
Eight HS drivers
Up to 830mA continuous current per driver pair (resistive load)
Charge pump with one external capacitor
Serial peripheral interface (SPI)
Short circuit protection
Diagnostic features
Power-down mode
Internal thermal shutdown
3.3V and 5V microcontroller compliant
Excellent system ESD
Automotive compliant
SO28 package with low Rthja
3.0 Typical Applications
•
•
•
•
•
•
Automotive dashboard
Automotive load management
Actuator control
LED driver applications
Relays and solenoids
Industrial process control
4.0 Ordering Information
Product Name
AMIS39100AGA
Package
PSOP 300-28 (JEDEC MS-013)
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1
Temperature Range
-40°C…105°C
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
5.0 Block Diagram
VDDN
27
5
Power on
Reset
4
OUT1
Thermal
shutdown
VB1
OUT1
6
OUT2
OUT2
10
DIN
DOUT
CLK
WR
VB2
12
13
2
9
OUT3
SPI
interface
OUT3
3
LOGIC
Control
Diagnostic
11
OUT4
OUT4
19
VB3
18
OUT5
OUT5
Oscillator
20
OUT6
CAPA1
17
24
Chargepump
23
OUT7
OUT6
VB4
OUT7
Bandgap
25
OUT8
OUT8
AMIS-39100
26
1
14
16
7
TEST2
PDB
TEST1
TEST
8
www.amis.com
2
21
22
28
GND3
GND5
GND1
GND4
GND6
GND2
Figure 1: Block Diagram
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PC20070110.4
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
6.0 Typical Application Diagram
CVCC
5V-reg
CVB
CVDDN
VDDN
VCC
27
CCP
CAPA
VBAT
17
5
VB1..4
10
19 24
DIN 12
DOUT 13
Microcontroller
CLK 2
WR 3
AMIS-39100
PDB 26
1 14 16
28 22 21 15
4
Lload1
OUT1
Cout1
6
9
11
18
20
23
25
8 7
OUT8
Lload8
Cout8
GND
Rload1
Rload8
GND1..6
TEST1..2
PC20070110.2
Figure 2: Typical Application Diagram
6.1 External Components
It is important to properly decouple the power supplies of the chip with external capacitors that have good high frequency properties.
The VB1, VB2, VB3, and VB4 pins are shorted on the PCB level. Also GND1, GND2, GND3, GND4, GND5, GND6, TEST, TEST1, and
TEST2 are shorted on the PCB level.
Table 1: External Components
Component
Function
Min.
CVB
Decoupling capacitor; X7R
Ccharge_pump
Charge pump capacitor
(2)
out
C
Value
Max.
100
(1)
0.47
Tol. [%]
Units
± 20
nF
47
nF
EMC capacitor on connector
1
Cout
Decoupling capacitors on OUT 1 to 8; 50V
22
± 20
nF
CVDD
Decoupling capacitors; 50V
22
± 20
nF
RLoad
Load resistance
65
± 10
Ω
LLoad
Load inductance at maximum current
300
(2)
Notes:
(1)
(2)
The capacitor must be placed close to the AMIS-39100 pins on the PCB.
Both capacitors are optional and depend on the final application and board layout.
AMI Semiconductor – Jan. 07, M-20557-002
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3
nF
350
mH
AMIS-39100: Octal High Side Driver with Protection
7.0 Pin Description
1
28
GND6
CLK
2
27
VDDN
WR
3
26
PDB
OUT1
4
25
OUT8
VB1
5
24
VB4
OUT2
6
GND1
7
GND2
8
OUT3
9
VB2
AMIS-39100
TEST1
23
OUT7
22
GND5
21
GND4
20
OUT6
10
19
VB3
OUT4
11
18
OUT5
DIN
12
17
CAPA1
DOUT
13
16
TEST
TEST2
14
15
GND3
PC20070110.1
Figure 3: Pin Description of the AMIS-39100
Table 2: Pin Out
Pin
Name
1
TEST1
2
CLK
3
WR
4
OUT1
5
VB1
6
OUT2
7
GND1
8
GND2
9
OUT3
10
VB2
11
OUT4
12
DIN
13
DOUT
14
TEST2
15
GND3
16
TEST
17
CAPA1
18
OUT5
19
VB3
20
OUT6
21
GND4
22
GND5
23
OUT7
24
VB4
25
OUT8
26
PDB
27
VDDN
28
GND6
Description
Connect to GND
Schmitt trigger SPI CLK input
Schmitt trigger SPI write enable input
HS driver output
Battery supply
HS driver output
Power ground and thermal dissipation path junction-to-PCB
Power ground and thermal dissipation path junction-to-PCB
HS driver output
Battery supply
HS driver output
SPI input pin (Schmitt trigger or CMOS inverter)
Digital three state output for SPI
Connect to GND
Power ground and thermal dissipation path junction-to-PCB
Connect to GND
Charge pump capacitor pin
HS driver output
Battery supply
HS driver output
Power ground and thermal dissipation path junction-to-PCB
Power ground and thermal dissipation path junction-to-PCB
HS driver output
Battery supply
HS driver output
Schmitt trigger power-down input
Digital supply
Power ground and thermal dissipation path junction-to-PCB
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Data Sheet
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.0 Electrical and Environmental Ratings
8.1 Absolute Maximum Ratings
Stress levels above those listed in this paragraph may cause immediate and permanent device failure. It is not recommended that
more than one of these conditions be applied simultaneously.
Table 3: Absolute Maximum Ratings
Symbol
Description
VDDN
Power supply voltage
DC battery supply on pins VB1 to VB4 load dump,
VB
Pulse 5b 400ms
Min.
GND - 0.3
Max.
6
Unit
V
GND - 0.3
35
V
-3000
350
mA
-350
350
mA
-700
0
-0.3
-4
-2
-750
-40
-40
3750
VB+16.5
VDDN+0.3
+4
+2
+750
175
105
mA
V
V
kV
kV
V
°C
°C
(1)
Iout_ON
Iout_OFF
I_OUT_VB
Vcapa1
Vdig_in
VESD
VESD
Tj
Tmr
Notes:
(1)
(2)
(3)
Maximum output current OUTx pins
The HS driver is switched on
(1)
Maximum output current OUTx pins
The HS driver is switched off
Maximum output current VB1, 2, 3, 4 pins
DC voltage on pins capa1
Voltage on digital inputs CLK, PDB, WR, DIN
(2)
Pins that connect the application (pins VB1..4 and Out1..8)
(2)
All other pins
(3)
ESD according charged device model
Junction temperature (T<100 hours)
Ambient temperature under bias
The power dissipation of the chip must be limited not to exceed the maximum junction temperature Tj.
According to HBM standard MIL-STD-883 method 3015.7
According to norm EOS/ESD-STM5.3.1-1999 robotic mode
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.2 Thermal Characteristics
Table 4: Thermal Characteristics of the Package
Symbol
Description
Rth(vj-a)
Thermal resistance from junction to ambient in power-SO28 package
Conditions
In free air
Table 5: Thermal Characteristics of the AMIS-39100 on a PCB
PCB Design
Conductivity Top and Bottom Layer
Two layer (35um)
Copper planes according to Figure 4 + 25% copper for the remaining areas
Two layer (35um)
Copper planes according to Figure 4 + 0% copper for the remaining areas
Four layer JEDEC: 25% copper coverage
EIA/JESD51-7
One layer JEDEC: 25% copper coverage
EIA/JESD51-3
Value
145
Rthja
24
53
25
(1)
46
Unit
K/W
Unit
K/W
K/W
K/W
K/W
Note:
(1)
These values are informative only.
Rthja = Thermal resistance from junction to ambient
Bottom PCB view
Top PCB view
5 mm
5 mm
5 mm
114.3
114.3
5 mm
GND copper
Ground plane GND copper
25 % filled by GND copper
76.2
76.2
Figure 4: Layout Recommendation for Thermal Characteristics
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.3 Electrical Parameters
Operation outside the operating ranges for extended periods may affect device reliability. Total cumulative dwell time above the
maximum operating rating for the power supply or temperature must be less than 100 hours.
The parameters below are independent from load type (see Section 8.4).
8.3.1. Operating Ranges
Table 6: Operating Ranges
Symbol
VDDN
Vdig_in
(1)
VB
Tamb
Notes:
(1)
Description
Digital power supply voltage
Voltage on digital inputs CLK, PDB, WR, DIN
DC battery supply on Pins VB1 to VB4
Ambient temperature
Min.
3.1
-0.3
3.5
-40
Max.
5.5
VDDN
16
105
Unit
V
V
V
°C
Min.
Max.
3.5
Unit
mA
25
µA
40
µA
10
1.6
µA
mA
1
3
2
Ω
Ω
A
µs
170
18
°C
°C
The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj of 130°C.
8.3.2. Electrical Characteristics
Table 7: Electrical Characteristics
Symbol
Description
(1)
I_VB_norm
Consumption on VB without load currents
In normal mode of operation PDB = high
(1)(2)
I_PDB_3.3
Sum of VB and VDDN consumption in power down mode of operation
PDB = low, VDDN 3.3V, VB = 12V, 23°C ambient
CLK and WR are at VDDN voltage
(1)(2)
I_PDB_5
Sum of VB and VDDN consumption in power down mode of operation
PDB = low, VDDN 5V, VB = 24V, 23°C ambient
CLK and WR are at VDDN voltage
I_PDB_MAX_VB
VB consumption in power down mode of operation PDB = low, VB = 16V
(1)
I_VDDN_norm
Consumption on VDDN
In normal mode of operation PDB = high
CLK is 500kHz, VDDN = 5.5V, VB = 16V
R_on_1..8
On resistance of the output drivers 1 through 8
Vb= 16V (normal battery conditions and Tamb = 25°C)
Vb = 4.6V (worst case battery condition and Tamb = 25°C)
(1)
I_OUT_lim_x
Internal over-current limitation of HS driver outputs
T_shortGND_HSdoff
The time from short of HS driver OUTx pin to GND and the driver
de-activation; driver is Off.
Detection works from VB minimum of 7V
VDDN minimum is 3V
(1)
TSD_H
High TSD threshold for junction temperature (temperature rising)
TSD_HYST
TSD hysteresis for junction temperature
Notes:
(1)
(2)
The power dissipation of the chip must be limited not to exceed maximum junction temperature Tj.
The cumulative operation time mentioned above may cause permanent device failure.
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7
0.65
5,4
130
9
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.4 Load Specific Parameters
HS driver parameters for specific loads are specified in following categories:
A. Parameters for inductive loads up to 350mH and Tambient up to 105°C
B. Parameters for inductive loads up to 300mH and Tambient up to 105°C
C. Parameters for resistive loads and Tambient up to 85°C
Table 8: Load Specific Characteristics
A. Inductive Load up to 350mH and Tambient up to 105°C
Symbol
Description
I_OUT_ON_max.
Maximum output per HS driver, all eight drivers might be active
simultaneously
B. Inductive Load up to 300mH and Tambient up to 105°C
I_OUT_ON_max.
Maximum output per HS driver, all eight drivers might be active
simultaneously
C. Resistive Load and Tambient up to 85°C
I_OUT_ON_max.
Maximum output per HS driver, all eight drivers might be active
simultaneously
Maximum output per one HS driver, only one can be active
Maximum output per HS driver, only two HS drivers from a different pair can
be active simultaneously
Maximum output per one HS driver pair
Min.
Max.
240
Unit
mA
275
mA
350
mA
650
500
mA
mA
830
mA
Note: The parameters above are not tested in production but are guaranteed by design.The overall current capability limitations need to be respected at all times.
The maximum current specified in Table 8 cannot always be obtained. The practically obtainable maximum drive current heavily
depends on the thermal design of the application PCB (see Section 8.2).
The available power in the package is: (TSD_H - T_ambient) / Rthja
With TSD_H = 130°C and Rthja according to Table 5.
8.5 Charge Pump
The HS drivers use floating NDMOS transistors as power devices. To provide the gate voltages for the NDMOS of the HS drivers, a
charge pump is integrated. The storage capacitor is an external one. The charge pump oscillator has typical frequency of 4MHz.
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.6 Diagnostics
8.6.1. Short-Circuit Diagnostics
The diagnostic circuit in the AMIS-39100 monitors the actual output status at the pins of the device and stores the result in the
diagnostic register, which is then latched in the output register at the rising edge of the WR-pin. Each driver has its corresponding
diagnostic bit DIAG_x. By comparing the actual output status (DIAG_x) with the requested driver status (CMD_x) you can diagnose the
correct operation of the application according to Table 9.
8.6.2. Thermal Shutdown (TSD) Diagnostic
In case of TSD activation, all bits DIAG 1 to DIAG 8 in the SPI output register are set into the fault state and all drivers will be switched
off (see Table 9). The TSD error condition is active until it is reset by the next correct communication on SPI interface (i.e. number of
clock pulses during WR=0 is divisible by 8), provided that the device has cooled down under the TSD trip point.
Table 9: OUT Diagnostics
Requested driver
status
On
On
Off
Off
CMD_x
Actual output status
DIAG_x
1
1
0
0
High
Low
High
Low
1
0
1
0
Diagnosis
Normal state
(2)
Short to ground or TSD
(1)
(2)
Short to VB or missing load or TSD
(1)
Normal state
Note:
(1)
(2)
The correct diagnostic information is available after T_diagnostic_OFF time.
All 8 diagnostic bits DIAG_x must be in the fault condition to conclude a TSD diagnostic.
8.6.3. Ground Loss
Due to its design, the AMIS-39100 is protected for withstanding module ground loss and driver output shorted to ground at the same
time.
8.6.4. Power Loss
Table 10: Power Loss
VDDN
VB
0
0
0
1
1
0
1
1
Possible Case
System stopped
Start case or sleeping mode with missing VDDN
Missing VB supply
VDDN normally present
System functional
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Action
Nothing
Eight switches in the off-state
Power down consumption on VB
Eight switches in the off-state
Normal consumption on VDDN
Nominal functionality
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
8.7 SPI Interface
The serial peripheral interface (SPI) is used to allow an external microcontroller (MCU) to communicate with the device. The AMIS39100 acts always as a slave and it can’t initiate any transmission.
8.7.1. SPI Transfer Format and Pin Signals
The SPI block diagram and timing characteristics are shown in Figure 6 and Figure 7.
During an SPI transfer, data is simultaneously sent to and received from the device. A serial clock line (CLK) synchronizes shifting and
sampling of the information on the two serial data lines (DIN and DOUT). DOUT signal is the output from the AMIS-39100 to the
external MCU and DIN signal is the input from the MCU to the AMIS-39100. The WR-pin selects the AMIS-39100 for communication
and can also be used as a chip select (CS) in a multiple-slave system. The WR-pin is active low. If AMIS-39100 is not selected, DOUT
is in high impedance state and it does not interfere with SPI bus activities. Since AMIS-39100 always shifts data out on the rising edge
and samples the input data also on the rising edge of the CLK signal, the MCU SPI port must be configured to match this operation.
SPI clock idles high between the transferred bytes.
The diagram in Figure 7 represents the SPI timing diagram for 8-bit communication. Communication starts with a falling edge on the
WR-pin that latches the status of the diagnostic register into the SPI output register. Subsequently, the CMD_x bits – representing the
newly requested driver status – are shifted into the input register and simultaneously, the DIAG_x bits – representing the actual output
status – are shifted out. The bits are shifted with x=1 first and ending with x=8. At the rising edge of the WR-pin, the data in the input
register is latched into the command register and all drivers are simultaneously switching to the newly requested status. SPI
communication is ended.
In case the SPI master does only support 16-bit communication, then the master must first send 8 clock pulses with dummy DIN data
and ignoring the DOUT data. For the next 8 clock pulses the above description can be applied.
The required timing for serial to peripheral interface is shown in Table 11.
Table 11: Digital Characteristics
Symbol
Description
T_CLK
Maximum applied clock frequency on CLK input
T_DATA_ready
Time between falling edge on WR and first bit of data ready on
DOUT output
(driver going from HZ state to output of first diagnostic bit)
T_CLK_first
First clock edge from falling edge on WR
(1)
T_setup
Set-up time on DIN
(1)
T_hold
Hold time on DIN
T_DATA_next
Time between rising edge on CLK and next bit ready on DOUT (capa
(capacitor tied to the DOUT pin is 30pF max.)
T_SPI_END
Time between last CLK edge and WR rising edge
T_risefall
Rise and fall time of all applied signals
(maximum loading capacitance is 30pF)
T_WR
Time between two rising edge on WR
(repetition of the same command)
Min.
Max.
500
2
Unit
kHz
µs
100
µs
ns
ns
ns
20
µs
ns
3
20
20
1
5
300
µs
Note: (1) Guaranteed by design
Normal mode verification:
• The command is the set of eight bits loaded via SPI, which drives the eight HS drivers on or off.
• The command is activated with rising edge on WR pin.
Table 12: Digital Characteristics
Symbol
T_command_L_max.
(1)
(1)
T_command_R
T_PDB_recov
Description
Min.
Minimum time between two opposite commands for inductive
loads and maximum HS driver current of 275mA
Minimum time between two opposite commands for resistive
loads and maximum HS driver current of 350mA
The time between the rising edge on the PDB input and 90
percent of VB-1V on all HS driver outputs. (all drivers are
activated, pure resistive load 35mA on all outputs)
Note: (1) Guaranteed by design
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Max.
Unit
1
s
2
ms
1
ms
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
PD
50%
t_PD_recov
VOUTi
90% {VBi - 1V}
t
PC20070110.7
Figure 5: Timing for Power-down Recovery
DOUT
OUTPUT REGISTER
INPUT REGISTER
DIN
CMD8
CMD DRIVER
COMMAND
CMD8
DIAG
CMD1
8
MEMORY
REGISTER
DIAG
CMD1
MEMOCMD
8
CMDx
DIAGx
High Side
Driver
OUTx
Figure 6: SPI Block Diagram
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STATE DIAG
11
DIAG
1
DIAG
MEMODIAG
DIAG
1
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
Transfer from input registers to
the com m and registers
(Rising edge on W R)
Transfer data from diagnostic registers
to the output registers
Falling edge on W R
WR
CLK
1
2
3
4
5
6
7
8
CM D CM D CMD CM D CMD CMD CMD CM D
5
6
7
3
4
1
2
8
DIN
O UT
DIN : DRIVER COMM AND
DOUT
DIAG DIAG DIAGDIAG DIAG DIAG DIAG DIAG
5
6
7
2
3
4
8
1
High Z
IN
DO UT: O UTPU Ts THE STATE O F DIAG NO STICs
O UT1 to 8
Figure 7: Timing Diagram
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High Z
AMIS-39100: Octal High Side Driver with Protection
9.0 Assembly and Delivery
Figure 8: Package Outline Drawing
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Data Sheet
AMIS-39100: Octal High Side Driver with Protection
Data Sheet
10.0 Soldering
10.1 Introduction to Soldering Surface Mount Packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data
Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for
all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high
population densities. In these situations reflow soldering is often used.
10.2 Re-flow Soldering
Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit
board by screen printing, stenciling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for
example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100
and 200 seconds depending on heating method. Typical re-flow peak temperatures range from 215 to 260°C.
10.3 Wave Soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high
component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave
soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of
the print-circuit board;
o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit
board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit
board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen
printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds
at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 13: Soldering Process
Package
Soldering Method
Wave
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
(3)
PLCC , SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Notes:
1.
2.
3.
4.
5.
Not suitable
(2)
Not suitable
Suitable
(3)(4)
Not recommended
(5)
Not recommended
Re-flow
(1)
Suitable
Suitable
Suitable
Suitable
Suitable
All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
dry pack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal or smaller than 0.65mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
11.0 Revision History
Table 14: Revision History
Revision Date
0.1
Various
0.2
June 2006
0.3
January 2007
Description
Initial document
Document formatted into new AMIS template
Update of some values in Tables 1, 2, 3, 6 and 7. Update of explanation in paragraph
8.6: Diagnostics, and paragraph 8.7: SPI Interface.
Update of Figure 8
Added section 10.0: Soldering
AMI Semiconductor – Jan. 07, M-20557-002
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AMIS-39100: Octal High Side Driver with Protection
Data Sheet
12.0 Company or Product Inquiries
For more information about AMI Semiconductor, our technologies and our products, visit our Web site at: http://www.amis.com
Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no
warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described
devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to
discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for
use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability
applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing
by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc.
AMI Semiconductor – Jan. 07, M-20557-002
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