Data Sheet XFP Optical Transceivers for 40km 10G Datacom & Storage Applications IGF Series IGF-17511J Features: The Bookham IGF Series optical transceiver modules are highperformance, cost-effective modules for serial optical data communication applications at 10Gb/s. The IGF-17511J is designed to provide 10Gb/s Ethernet for 40km compliant links. The modules are designed for single mode fibre and operate at a nominal wavelength of 1550nm. The modules aid system hardware engineers in implementing low-cost single mode PMD solutions, which are protocol transparent. The “hot pluggable” feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-17511J uses an Externally Modulated Laser (EML) packaged in conjunction with an optical isolator for excellent back reflection performance. The Bookham IGF series of modules have been extensively tested utilizing industry standard single mode fibers in order to ensure compatibility with enterprise, access and metro systems. • Compliant IEEE802.3 10G Ethernet (10GBASE-ER/EW) 10GFC INCITS Project 1413-D • Compliant with the XFP MSA • Ultra small form factor • 10Gb/s serial operation • Hot Pluggable • Supports 40km link distances • Integrated PIN receiver technology • Data rates from 9.9Gb/s to 10.52Gb/s • XFI electrical interface • On board Enhanced Digital Diagnostics providing I2C remote monitoring capability • Typically less than 3.0 W power dissipation • Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches • Duplex LC connector • Low EMI • Transmit disable and loss-of-signal functions • RoHS compliant Applications: • 10Gb/s Gigabit Ethernet 10GBASE-ER/EW, 10G Fibre Channel • Client side interconnection • Inter-office connections 1 Data Sheet Absolute maximum ratings Parameter Symbol Min Max Units Tstg -40 85 °C Supply voltage 5 VCC5 0 6 V Supply voltage 3 VCC3 0 4.0 V Supply voltage 2 VCC2 0 2.2 V Supply voltage E5 VEE5 0 -6 V Data AC volt. differential Tx+, Tx- -0.5 2 Vpp Data DC volt. Tx+, Tx- 0 VCC2 Vpp Optical Damage Threshold PDamage +5 dBm Storage Temp Notes   VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified Recommended operating conditions Parameter Symbol Baud rate Min Typ Max Units Notes 10.5 GBd STM-64/OC192; G.709; 10 GbE; 5.0 5.25 V 350 550 mA 3.3 3.47 V 90 200 mA 1.8 1.89 V 750 mA Supplies TEC, current draw depends on temp  V  3.5 W  70 °C 9.95 4.75 Supply voltage 5 VCC5 Supply current 5 ICC5 Supply voltage 3 VCC3 Supply current 3 ICC3 Supply voltage 2 VCC2 Supply current2 ICC2 50 Supply voltage VEE5 -5.2 Power dissipation Pw 2.3 Temperature case Tcase E5 3.13 1.71 -5 Please contact sales for special requirements  Typical figures for supply current and power dissipation represent start-of-life 40C. Max figures for supply currents and power dissipation are worst case, end-of-life, over temperature. Currents are quiescent values and exclude inrush.  VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified.  Maximum currents from each supply rail not all present simultaneously. 2   Data Sheet Operating Specifications – electrical Tcase = -5oC to +70oC Parameter Symbol Value Typical Min Units Notes Max CML input (differential) VTxDiff 150 900 mVpp 100 ohm differential CML output (differential) VRxDiff 360 770 mVpp 100 ohm differential Tr/Tf 24 ps 20% - 80% VOH VOL 2 0 Rise/Fall time Loss of signal Output voltage high Output voltage low VCC3+0.3 0.8 V V 100 100 µs µs Loss of signal timing Input voltage high Input voltage low TA TD Tx_Disable High VDH 2 VCC3+0.3 V Tx_Disable Low VDL 0 0.8 V Transmitter operating specifications – optical Tcase = -5oC to +70oC Parameter Value Typical Max 1550 1565 nm +2.0 dBm Center wavelength λc 1530 Optical transmit power Po -1.0 Side mode suppression SMSR 30 dB ER 8.2 dB Extinction ratio Optical path penalty Output optical eye 3 Units Min Symbol OPP 2 dB Notes EOL 800 ps/nm disp. Compliant with IEEE 802.3æ and 10GFC INCITS Project 1413-Deye mask Data Sheet Receiver operating specifications – optical Tcase = -5oC to +70oC Parameter Symbol Min λ Input operating wavelength Receiver sensitivity Value Typical 1290 Units 1565 nm PIN-MIN -19.0 -15.8 dBm Stressed receiver sensitivity in OMA SRS -13.5 -11.4 dBm  Maximum input power (overload) PIN-MAX dBm Ave. power +2 Reflectance -27 dB -19 dBm -17 dBm 6 dB Loss of Signal Loss of Signal Assert (Off to On) PA Loss of Signal Deassert (On to Off) PD Hysteresis PA - PD  BER 1E-12 used for Rx sensitivity measurements. 4 Notes Max -32 0.5 Ave. power at ER=8.2dB Data Sheet Electrical pin out Bottom of Board as viewed through top of board Top of Board 1 GND GND 30 2 VEE5 TD+ 29 3 Mod_Desel TD- 28 4 Interrupt GND 27 5 TX_DIS GND 26 6 VCC5 RefCLK- 25 7 GND RefCLK+ 24 8 VCC3 GND 23 9 VCC3 VCC2 22 10 SCL P_down/RST 21 11 SDA VCC2 20 12 Mod_Abs GND 19 13 Mod_NR RD+ 18 14 Rx_LOS RD- 17 15 GND GND 16 Figure 1: XFP Module Board Pinout & Names 5 1 GND 2 VEE5 3 Mod_Desel 4 Interrupt 5 TX_DIS 6 VCC5 7 GND 8 VCC3 9 VCC3 GND 30 TD+ 29 TD- 28 GND 27 GND 26 RefCLK- 25 RefCLK+ 24 GND 23 VCC2 22 P_down/RST 21 VCC2 20 GND 19 RD+ 18 RD- 17 GND 16 10 SCL 11 SDA 12 Mod_Abs 13 Mod_NR 14 Rx_LOS 15 GND Towards Bezel Towards ASIC Figure 2: Host Board Connector Pinout Top View Data Sheet Pin definitions Pin # Symbol Function Plug Seq Notes 1 GND Module Ground; Signal Ground 1 1 2 VEE5 Optional -5.2V Power Supply 2 Mod_Desel Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands 3 Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface 3 TX_DIS Transmitter Disable; Turns Off Transmitter Laser Source 3 6 VCC5 +5V Power Supply 2 7 GND Module Ground; Signal Ground 1 8 VCC3 +3.3V Power Supply 2 9 VCC3 +3.3V Power Supply 2 3 4 5 LVTTL-I LVTTL-O LVTTL-I Interrupt 2 1 10 LVTTL-I SCA Two Wire Interface Clock 3 2 11 LVTTL-I/O SDA Two Wire Interface Data Line 3 2 12 LVTTL-O Mod_Abs Indicates Module Not Present; Grounded in Module 3 2 13 LVTTL-O Mod_NR Module Not Ready or Indicating Module Operational Fault 3 2 14 LVTTL-O RX_LOS Receiver Loss of Signal Indicator 3 2 15 GND Module Ground; Signal Ground 1 1 16 GND Module Ground; Signal Ground 1 1 17 CML-O RD- Receiver Inverted Data Output 3 18 CML-O RD+ Receiver Non-Inverted Data Output 3 19 GND Module Ground; Signal Ground 1 20 VCC2 +1.8V Power Supply 2 P_down/RST Power down; When high, places the module in the low power standby mode of less than 1.5W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. 3 21 LVTTL-I 1 22 VCC2 +1.8V Power Supply 2 23 GND Module Ground; Signal Ground 1 1 24 PECL-I RefCLK+ Reference Clock Non-Inverted Input, AC coupled on Host Board 3 3 25 PECL-I RefCLK- Reference Clock Inverted Input, AC coupled on Host Board 3 3 26 GND Module Ground; Signal Ground 1 1 27 GND Module Ground; Signal Ground 1 1 28 CML-I TD- Transmitter Inverted Data Input 3 29 CML-I TD+ Transmitter Non-Inverted Data Input 3 GND Module Ground; Signal Ground 1 30 6 Logic  Module ground pins are isolated from the module case and chassis ground within the module.  Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board.  Reference clock is required for IGF-17511J. 1 Data Sheet Figure 3. Host Board Supply Filtering Figure 4. Host Board mechanical layout (mm) 7 Data Sheet Mechanical interface The XFP module is a pluggable module with its foundation based on the successful SFP package configuration It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly. Figure 5. Example of clip-on heat sink Thermal interface One of the unique features of the XFP module is that the module cage is designed with the ability to accommodate a clip-on thermal heat sink, as shown in Figure 5, to enhance the cooling of the module. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air-flow direction and desired pressure drop. Figure 6. Mechanical Dimensions (mm) of the XFP module. 8 Data Sheet Figure 7. Interface Design with Bezel (mm) Management Interface Digital diagnostics is available on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These “static” and “dynamic” diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which “Enhanced” diagnostics are supported, and monitor module parameters to determine the module and link condition. The module’s “Enhanced Digital Diagnostics” features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h (data address 0 ~ 127) contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly. One 9 exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map (in the diagnostics space) to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: • Table 01h: Serial ID EEPROM • Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0, INF-8077i, “10 Gigabit Small Form Factor Pluggable Module” found at www.xfpmsa.org; April 13, 2004. Data Sheet Regulatory compliance Bookham IGF-3000 Series 1550 nm XFP transceivers are designed to be Class 1 Laser compliant. They are certified per the following standards: Feature Laser Safety Agency Standard Certificate/Comments FDA/CDRH CDHR 21(J) CFR 1040.10 0520196-02 US-TUVR-3130 TÜV IEC/EN 60950-1:2001 IEC/EN 60825-1/A2:2001 CAN/CSA-60825-1-03 CU72060154 CAN/CSA-C22.2 No. 60950-1-03 UL 60950-1:2003 UL 94 V-0 U8V 06 06 54880 002 Component Safety UL/CSA ESD IEC MIL-STD-883 Method 3015 Part 15 Class B FCC Class B margin = 46.0 dBuV/m [EU Directive] EN55022, EN55024 Class B EN55022 Class B margin = 15.9 dBuV/m EU Directives 73/23/EEC (Low voltage) 89/336/EEC (EMC) Pass FCC/89/336/EE EMI CE Pass IEC61000-4-2 This product meets the requirements of the relevant EMC standards (EN 55022, EN 55024, FCC Part 15). However the EMC performance of the product within the host system may depend on characteristics of the host system over which Bookham has no control. It may therefore be necessary to ensure that the host system provides adequate grounding & shielding of the product. 10 Data Sheet RoHS Compliance Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details. Ordering Information: TRx 10G 40KM XFP GE COM IGF-17511J Contact Information North America Bookham Worldwide Headquarters Europe Paignton Office Asia Shenzhen Office 2584 Junction Ave. San Jose CA 95134 USA Brixham Road Paignton Devon TQ4 7BE United Kingdom 2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China • Tel: +1 408 919 1500 • Tel: +44 (0) 1803 66 2000 • Fax: +1 408 919 6083 • Fax: +44 (0) 1803 66 2801 • Fax: +86 755 33305805 +86 755 33305807 • Tel: +86 755 33305888 Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative. www.bookham.com [email protected] 11 BH13399 Rev 1.0 February 2007 ©Bookham 2005. Bookham is a registered trademark of Bookham Inc.