Data Sheet XFP Optical Transceivers for 40km 10G Serial Applications IGF series IGF-32511J The Bookham IGF-3000 Series optical transceiver modules are high-performance, cost-effective modules for serial optical data communication applications at 10Gb/s. The IGF-32511J is designed to provide SONET/SDH (with or without FEC) and 10Gb/s Ethernet for 40km compliant links. The modules are designed for single mode fibre and operate at a nominal wavelength of 1550nm. They incorporate Bookham’s exclusive optical packaging platform. The modules aid system hardware engineers in implementing low-cost single mode PMD solutions, which are protocol transparent. The “hot pluggable” feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-32511J uses an Electro-absorption Modulated Laser (EML) packaged in conjunction with an optical isolator. This design provides for maximum eye opening, minimized jitter generation, and excellent back reflection performance. The transmitter is fully IEC60825-1 and CDRH Class 1 laser eye safety compliant. Features: • Multi-Protocol Compliant SONET OC-192 IR-2/SDH S-64.2b, IEEE 802.3 10G Ethernet (10GBASE-ER/EW), 10G Fibre Channel • Compliant with the XFP MSA • Ultra small form factor • 10Gb/s serial operation • Hot Pluggable • Supports 40km link distances • Integrated PIN receiver technology • Data rates up to 10.7Gb/s • XFI electrical interface • On board Enhanced Digital Diagnostics providing I2C remote monitoring capability • Typically less than 3.0 W power dissipation • Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches • Duplex LC connector • Low EMI • Transmit disable and loss-of-signal functions • RoHS compliant Applications: • SONET/SDH Metro Networks • 10G Ethernet Metro Links • Metro Storage Networking • Client side interconnection • Inter-office connections 1 Data Sheet Absolute maximum ratings Parameter Symbol Min Max Units Tstg -40 85 °C Supply voltage5 VCC5 0 6 V Supply voltage3 VCC3 0 4.0 V Supply voltage2 VCC2 0 2.2 V Supply voltageE5 VEE5 -6 0 V Data AC volt. differential Tx+, Tx- -0.5 2 Vpp Data DC volt. Tx+, Tx- 0 VCC2 Vpp Optical Damage Threshold Pdamage +5 dBm Storage Temp Notes   VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified Operating conditions Parameter Symbol Baud Rate Min Typical Max Units Notes 10.75 GBd STM-64/OC192; G.709; 10 GbE; 5.0 5.25 V 350 550 mA 3.3 3.47 V 90 200 mA 1.8 1.89 V 750 mA 9.95 Supply Voltage5 VCC5 Supply Current5 ICC5 Supply voltage3 VCC3 Supply Current3 ICC3 Supply voltage2 VCC2 Supply Current2 ICC2 50 Supply voltageE5 VEE5 -5.2 Power Dissipation Pw 2.3 Temperature Case Tcase 4.75 3.13 1.71 -5 Please contact sales for special requirements.  Typical figures for supply current and power dissipation represent start-of-life 40C. Max figures for supply currents and power dissipation are worst case, end-of-life, over temperature. Currents are quiescent values and exclude inrush.  VEE5 supply is not used – if voltage is applied to these pins it must be within the limits specified.  Maximum currents from each supply rail not all present simultaneously. 2   Supplies TEC, current draw depends on temp V  3.5 W  70 °C  Data Sheet Operating specifications – electrical Tcase = -5°C to +70°C Parameter Symbol Value min typical max Units Notes CML Input (differential) VTxDiff 150 n/a 900 mVpp 100 ohm differential CML Output (differential) VRxDiff 360 600 770 mVpp 100 ohm differential Rise/Fall Time Tr/Tf 24 ps 20% - 80% Loss of Signal Output Voltage High Output Voltage Low VOH VOL 2 0 Loss of Signal Timing Assert [Off to On] Deassert [On to Off] TA TD Tx_Disable High VDH Tx_Disable Low VDL VCC3+0.3 0.8 V V 100 100 µs µs 2 VCC3+0.3 V 0 0.8 V The IGF-32511J requires a baud/64 external reference clock. Reference clock requirements are defined by the XFP MSA. Transmitter operating specifications – optical Tcase = -5°C to +70°C Parameter Symbol Value min Optical Transmit Power Po -1.0 Side mode suppression SMSR 30 ER 8.2 Extinction Ratio Jitter Generation TJ Jitter Generation TJp-p Optical Path Penalty OPP Output Optical Eye 3 rms typical Units Notes dBm EOL max +2.0 dB 9.8 dB Compliant to GR-253 Issue 4 UI RMS and ITU-T G.825/G.8251 UI Peak-to-Peak dB 800ps/nm disp. 2 Compliant with Telcordia GR-253, ITU-T G.691/G.959.1 and IEEE802.3ae Data Sheet Receiver operating specifications – optical Tcase = -5°C to +70°C Parameter Symbol Value min Receiver Sensitivity PIN-MIN Stressed Receiver Sensitivity (OMA) Receiver Overload typical -13.5 PIN-MAX Units Notes -15.8 dBm Ave. power at ER=8.2dB -11.4 dBm  dBm Ave. power max +2 Reflectance -27 dB -19 dBm -17 dBm 6 dB Loss of Signal Loss of Signal Assert (Off to On) PA Loss of Signal Deassert (On to Off) PD Hysteresis  BER 1E-12 used for Rx sensitivity measurements 4 PA - PD -32 0.5 Data Sheet Electrical pin out The electrical connection interface of the module and host board is shown below in Figure 1 and Figure 2, respectively. 5 Data Sheet Pin definitions Pin # Symbol Function Plug Seq Notes 1 GND Module Ground; Signal Ground 1 2 VEE5 Optional -5.2V Power Supply 2 3 LVTTL-I Mod_Desel Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands 3 4 LVTTL-O Interrupt_BAR Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface 3 5 LVTTL-I TX_DIS Transmitter Disable; Turns Off Transmitter Laser Source 3 6 VCC5 +5V Power Supply 2 7 GND Module Ground; Signal Ground 1 8 VCC3 +3.3V Power Supply 2 9 VCC3 +3.3V Power Supply 2 1 2 1 10 LVTTL-I SCA Two Wire Interface Clock 3 2 11 LVTTL-I/O SDA Two Wire Interface Data Line 3 2 12 LVTTL-O Mod_Abs Indicates Module Not Present; Grounded in Module 3 2 13 LVTTL-O Mod_NR Module Not Ready or Indicating Module Operational Fault 3 2 14 LVTTL-O RX_LOS Receiver Loss of Signal Indicator 3 2 15 GND Module Ground; Signal Ground 1 1 16 GND Module Ground; Signal Ground 1 1 17 CML-O RD- Receiver Inverted Data Output 3 18 CML-O RD+ Receiver Non-Inverted Data Output 3 19 GND Module Ground; Signal Ground 1 20 VCC2 +1.8V Power Supply 2 P_down/RST Power down; When high, places the module in the low power standby mode of less than 1.5W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. 3 22 VCC2 +1.8V Power Supply 2 23 GND Module Ground; Signal Ground 1 1 21 LVTTL-I 1 24 PECL-I RefCLK+ Reference Clock Non-Inverted Input, AC coupled on Host Board 3 3 25 PECL-I RefCLK- Reference Clock Inverted Input, AC coupled on Host Board 3 3 26 GND Module Ground; Signal Ground 1 1 27 GND Module Ground; Signal Ground 1 1 28 CML-I TD- Transmitter Inverted Data Input 3 29 CML-I TD+ Transmitter Non-Inverted Data Input 3 GND Module Ground; Signal Ground 1 30 6 Logic  Module ground pins are isolated from the module case and chassis ground within the module.  Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board.  Required for the IGF-32511J. 1 Data Sheet Figure 3. Host Board supply filtering. Figure 4. Host Board mechanical layout (mm) 7 Data Sheet Mechanical interface: The XFP module is a pluggable module with its foundation based on the successful SFP package configuration. It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly. Figure 5. Example of clip-on heat sink Thermal interface: One of the unique features of the XFP module is that the module cage is designed with the ability to accommodate a clip-on thermal heat sink, as shown in Figure 5, to enhance the cooling of the module. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air flow direction and desired pressure drop. 8 Figure 6. Mechanical Dimensions (mm) of XFP module. Data Sheet Figure 7. Interface Design with Bezel (mm) Management Interface Digital diagnostics is available on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These “static” and “dynamic” diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which “Enhanced” diagnostics are supported, and monitor module parameters to determine the module and link condition. The module’s “Enhanced Digital Diagnostics” features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h [data address 0 ~ 127] contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and control functions that must be accessed repeatedly. One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map [in the diagnostics space] to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. 9 Data Sheet Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: • Table 01h: Serial ID EEPROM • Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0, INF-8077i, “10 Gigabit Small Form Factor Pluggable Module” found at www.xfpmsa.org; April 13, 2004 Regulatory compliance Bookham IGF-3000 Series 1550 nm XFP transceivers are designed to be Class 1 Laser compliant. They are certified per the following standards: Feature Laser Safety Agency Standard Certificate/Comments FDA/CDRH CDRH 21(J) CFR 1040.10 Laser Safety 0520196-02 TÜV IEC/EN 60950-1:2001 IEC/EN 60825-1/A2:2001 US-TUVR-3130 CAN/CSA-60825-1-03 CU72060154 UL/CSA CAN/CSA-C22.2 No. 60950-1-03 UL 60950-1:2003 UL 94 V-0 CU72060154 ESD IEC MIL-STD-883 Method 3015 IEC61000-4-2 Pass EMI FCC/89/336/EE Part 15 Class B FCC Class B margin = 46.0 dBuV/m [EU Directive] EN55022, EN55024 Class B EN55022 Class B margin = 15.9 dBuV/m EU Directives 73/23/EEC (Low voltage) 89/336/EEC (EMC) Pass Component Safety CE This product meets the requirements of the relevant EMC standards (EN 55022, EN 55024, FCC Part 15). However the EMC performance of the product within the host system may depend on characteristics of the host system over which Bookham has no control. It may therefore be necessary to ensure that the host system provides adequate grounding & shielding of the product. 10 Data Sheet RoHS Compliance Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details. Ordering Information: IGF-32511J TRX 10G XFP 40KM IR MP COM ROHS 5/6 Contact Information North America Bookham Worldwide Headquarters Europe Paignton Office Asia Shenzhen Office 2584 Junction Ave. San Jose CA 95134 USA Brixham Road Paignton Devon TQ4 7BE United Kingdom 2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China • Tel: +1 408 919 1500 • Tel: +44 (0) 1803 66 2000 • Fax: +1 408 919 6083 • Fax: +44 (0) 1803 66 2801 • Fax: +86 755 33305805 +86 755 33305807 • Tel: +86 755 33305888 Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative. www.bookham.com email@example.com 11 BH12981 Rev 2.0 October 2006 ©Bookham 2006. Bookham is a registered trademark of Bookham Inc.