Data Sheet XFP Optical Transceivers for 10km 10G Serial Applications IGF Series IGF-42311J -5 °C to +70 °C Applications IGF-42312J -10 °C to +85 °C Applications The Bookham IGF-4000 Series optical transceiver modules are high-performance, cost-effective modules for serial optical data communication applications at 10Gb/s. They are designed to provide SONET/SDH (with or without FEC), 10Gb/s Ethernet and 10Gb/s Fibre Channel 10 km compliant links. The modules are designed for single mode fiber and operate at a nominal wavelength of 1310nm. They incorporate Bookham’s exclusive optical packaging platform. The IGF-42312J version operates over the extended temperature range of -10 °C to 85 °C. This enables higher port density or allows higher chassis temperature in network equipment installations. The modules aid system hardware engineers in implementing low-cost single mode Physical Media Dependency (PMD) solutions that are protocol transparent. The “hot pluggable” feature built into every module reduces manufacturing cost, inventory costs and allows optical port upgrades at the customer premises. Built-in remote monitoring via digital diagnostics allows user access to static and dynamic data as well as module condition. The IGF-42311J and IGF-42312J use a DFB laser with an integrated electroabsorption modulator packaged in conjunction with an optical isolator. This design provides for maximum eye opening, minimized jitter generation, and excellent back reflection performance. The transmitter is fully EN/IEC60825-1 Class 1/Class I laser eye safety compliant. Features: • Multi-Protocol support: SONET OC-192 SR-1 / SDH I-64.1 IEEE 802.3 10G Ethernet 10GBASE-LR/LW 10G Fibre Channel ITU G.709 • 9.95 to 11.3 Gb/s data rates • Supports 10km link distances • Hot Pluggable • Low EMI for high port density • Low power dissipation • On board Enhanced Digital Diagnostics providing I2C remote monitoring capability • XFI Loop-Back Diagnostic • Integral Signal Conditioning ICs enabling FR4 host board PCB traces up to 8 inches • Duplex LC connector • Transmit disable and loss-of-signal functions • RoHS compliant Applications: • High Port Density Solutions • SONET / SDH OC-192 • 10Gb/s Gigabit Ethernet Networking • Telecom, Datacom and Storage-area networking • Rack-to-rack connectivity • Client side interconnection • Fiber to the X aggregation 1 Data Sheet Absolute maximum ratings Parameter Symbol Min Max Units Tstg -40 85 °C Supply voltage 5 VCC5 0 6 V Supply voltage 3 VCC3 0 4.0 V Supply voltage 2 VCC2 0 2.2 V Supply voltage E5 VEE5 -5.2V Not required Storage Temp V Data AC volt. differential Tx+, Tx- -0.5 2 Vpp Data DC volt Tx+, Tx- 0 VCC2 Vpp Recommended operating conditions Parameter Symbol Baud rate Typ Max Units Notes 11.3 GBd STM-64/OC-192; G.709; 10 GbE; 10G FC 5.0 5.25 V +/- 5% 300 390 mA 3.3 3.47 V 230 250 mA 1.8 1.89 V 0 mA 9.95 Supply voltage 5 VCC5 Supply current 5 ICC5 Supply voltage 3 VCC3 Supply current 3 ICC3 Supply voltage 2 VCC2 Supply current 2 ICC2 0 Supply voltage VEE5 -5.2 E5 Power dissipation 4.75 3.13 1.71 Pw +/- 5% +/- 5% V Not required 2.2 2.5 W IGF-42311J 2.2 2.7 W IGF-42312J Temperature case (IGF-42311J) Ts1 -5 70 °C Temperature case (IGF-42312J) Ts1 -10 85 °C Please contact sales for special requirements 2 Min Data Sheet Operating Specifications – electrical Parameter Symbol Value Typical Min Units Notes Max CML input (differential) VTxDiff 125 700 mVpp 100 ohm differential CML output (differential) VRxDiff 360 770 mVpp 100 ohm differential Tr/Tf 24 Ps 20% - 80% Output voltage high VOH 2 VCC3+0.3 V Output voltage low VOL 0 0.8 V Rise/Fall time Loss of signal Loss of signal timing Assert (off to on) TA 100 µs Deassert (on to off) TD 100 µs Tx_disable high VDH 2 VCC3+0.3 V Tx_disable low VDL 0 0.8 V Mod_NR high VNRH VCC3-0.7 VCC3+0.3 V Mod_NR low VNRL 0 0.6 V Notes: The IGF-42311J and the IGF-42312J require a baud/64 external reference clock. Reference clock requirements defined by the XFP MSA. Transmitter operating specifications – optical Parameter Min Value Typical Max Units 1310 1330 nm -1.0 dBm Center wavelength λc 1290 Optical transmit power Po -6.0 Side mode suppression SMSR 30 dB ER 6 dB Extinction ratio Jitter generation TJ Jitter generation TJp-p Transmitter and dispersion penalty TDP Output optical eye 3 Symbol rms Meets Telcordia GR-253 Issue 4 and ITU-T G.825/G.8251 1.0 Notes EOL UI RMS UI Peak-to-Peak dB 10km SMF Compliant with Telcordia GR-253 & ITU-T G.691/G.959.1 and IEEE 802.3æ Data Sheet Receiver operating specifications – optical Parameter Symbol Min Input operating wavelength λ Receiver sensitivity PIN-MIN Maximum input power PIN-MAX Value Typical 1260 Units 1360 nm -13.4 dBm Ave. power at ER=6dB dBm Ave. power 0.5 Reflectance -14 dB -19 dBm -15 dBm 6 dB Loss of Signal Loss of Signal Assert (Off to On) PA Loss of Signal Deassert (On to Off) PD Hysteresis 4 PA - PD -32 0.5 Notes Max Data Sheet Electrical pin out Top of Board GND 30 2 VEE5 TD+ 29 3 Mod_Desel TD- 28 4 GND 27 GND 26 5 TX_DIS 6 VCC5 RefCLK- 25 7 GND RefCLK+ 24 8 VCC3 GND 23 9 VCC3 VCC2 22 10 SCL P_down/RST 21 11 SDA VCC2 20 12 Mod_Abs GND 19 13 Mod_NR RD+ 18 14 Rx_LOS RD- 17 15 GND GND 16 Figure 1: XFP Module Board Pinout & Names 5 15 Rx_LOS 14 Mod_NR 13 Mod_Abs 12 SDA 11 SCL 10 VCC3 9 VCC3 8 GND 7 VCC5 6 TX_DIS 5 Interrupt_BAR 4 16 GND 1 GND Interrupt_BAR GND 17 RD18 RD+ 19 GND 20 VCC2 21 P_down/RST 22 VCC2 23 GND 24 RefCLK+ 25 RefCLK26 GND 27 GND Mod_Desel 3 28 TDVEE5 2 GND 1 29 TD+ 30 GND Towards Bezel Towards ASIC Figure 2: Host PCB XFP Pinout Top View Data Sheet Pin definitions Pin # Symbol Function Plug Seq Notes 1 GND Module Ground; Signal Ground 1 1 2 VEE5 Optional -5.2V Power Supply—NOT USED 2 Mod_Desel Module De-select; When held low by host allows the module to respond to 2-wire serial interface commands 3 Interrupt_BAR; Indicates the presence of an important condition that can be read over the two wire interface 3 TX_DIS Transmitter Disable; Turns Off Transmitter Laser Source 3 6 VCC5 +5 V Power Supply 2 7 GND Module Ground; Signal Ground 1 8 VCC3 +3.3 V Power Supply 2 9 VCC3 +3.3 V Power Supply 2 3 4 5 Logic LVTTL-I LVTTL-O LVTTL-I Interrupt_BAR 1 10 LVTTL-I SCA Two Wire Interface Clock 3 2 11 LVTTL-I/O SDA Two Wire Interface Data Line 3 2 12 LVTTL-O Mod_Abs Indicates Module Not Present; Grounded in Module 3 2 13 LVTTL-O Mod_NR Module Not ready or Indicating Module Operational Fault 3 2 14 LVTTL-O RX_LOS Receiver Loss of Signal Indicator 3 2 15 GND Module Ground; Signal Ground 1 1 16 GND Module Ground; Signal Ground 1 1 17 CML-O RD- Receiver Inverted Data Output 3 18 CML-O RD+ Receiver Non-Inverted Data Output 3 19 GND Module Ground; Signal Ground 1 20 VCC2 +1.8 V Power Supply 2 P_down/RST Power down; When high, places the module in the low power standby mode of less than 1.5 W with 2-wire interface still operational. Reset; The falling edge of P_Down/RST initiates a complete module reset including the 2-wire interface. 3 21 LVTTL-I 1 22 VCC2 +1.8 V Power Supply 2 23 GND Module Ground; Signal Ground 1 1 24 PECL-I RefCLK+ Reference Clock Non-Inverted Input, AC coupled on Host Board 3 3 25 PECL-I RefCLK- Reference Clock Inverted Input, AC coupled on Host Board 3 3 26 GND Module Ground; Signal Ground 1 1 27 GND Module Ground; Signal Ground 1 1 28 CML-I TD- Transmitter Inverted Data Input 3 29 CML-I TD+ Transmitter Non-Inverted Data Input 3 GND Module Ground; Signal Ground 1 30 Notes: 6 2 1. Module ground pins are isolated from the module case and chassis ground within the module. 2. Open Collector should be pulled up with 4.7K-10Kohms to a voltage between 3.15V and 3.6V on the host board. 3. Required for the IGF-42311J and IGF-42312J. 1 Data Sheet Figure 3. Host Board Supply Filtering Figure 4. Host Board mechanical layout (mm) 7 Data Sheet Mechanical interface The XFP module is a pluggable module with its foundation based on the successful SFP package configuration. It consists of a rectangular package that is approximately 18mm wide and 78mm long. The module interface is a 30 lead connector. The module is inserted into a metal cage assembly. As an option, a heat sink can be clipped to the cage to enhance the cooling of the module. Figure 5. Example of clip-on heat sink Thermal interface One of the unique features of the XFP module is that the module cage is designed with the ability to have a thermal heat sink clipped onto the cage. Thus the equipment manufacturer that designs with the XFP can select a heat sink that is optimized for the particular environmental conditions of vertical space above module, air flow, air flow direction and desired pressure drop. Figure 6. Mechanical Dimensions (mm) of the XFP module. 8 Data Sheet Figure 7. Interface Design with Bezel (mm) Management Interface Digital diagnostics is an available interface on all Bookham XFP transceivers. A 2-wire Serial ID interface provides user access to vendor/module identification, customer specific data, link type, static and dynamic monitor hooks, and a check code mechanism for verifying accuracy in the data registers. These “static” and “dynamic” diagnostics allow users to remotely and accurately identify modules and their vendors, make determinations about its compatibility with the system, verify which “Enhanced” diagnostics are supported, and monitor module parameters to determine the module and link condition. The module’s “Enhanced Digital Diagnostics” features provide real-time monitoring of receiver input power, transmitter power, internal module temperature, laser bias current, and supply voltage parameters. The 2-wire serial ID interface was originally defined by the GBIC (GigaBit Interface Converter) and SFF-8472 specifications. The XFP MSA (Multi-Source Agreement) document further defined the diagnostics features and introduced a new memory map of the diagnostic information. This interface is a 2-wire interface that allows read-only access to separate memory locations. The memory location starting at A0h (data address 0 ~ 127) contains the Digital Diagnostic Functions. The normal 256 Byte I2C address space is divided into lower and upper blocks of 128 Bytes. The lower block of 128 Bytes is always directly available and is used for the diagnostics and 9 control functions that must be accessed repeatedly. One exception to this is that the standard module identifier Byte defined in the GBIC and SFP is located in Byte 0 of the memory map (in the diagnostics space) to allow software developed for multiple module types to have a common branching decision point. This Byte is repeated in the Serial ID section so that it also appears in the expected relationship to other serial ID bits. Multiple blocks of memories are available in the upper 128 Bytes of the address space. These are individually addressed through a table select Byte which the user enters into a location in the lower address space. Thus, there is a total available address space of 128 * 256 = 32Kbytes in this upper memory space. The upper address space tables are used for less frequently accessed functions such as serial ID, user writable EEPROM, reserved EEPROM and diagnostics and control spaces for future standards definition, as well as ample space for vendor specific functions. These are allocated as follows: • Table 01h: Serial ID EEPROM • Table 02h: User writable EEPROM The details of each memory space are found in the XFP MSA specification Chapter 5. Reference Documents: 1. XFP MSA revision 4.0 found at www.xfpmsa.org; April 13, 2004 Data Sheet Regulatory compliance Bookham IGF-4000 Series 1310nm XFP transceivers are designed to be Class I Laser compliant. They are certified per the following standards: Feature Agency Standard Certificate/Comments Laser Safety FDA/CDRH Complies with 21 CFR 1040.10 and 1040.11 0520953-00 IEC/EN 60950 IEC/EN 60825-1:1993 +A1:2001 +A2:2001 US-TUVR-2963 CAN/CSA-60825-1-03 CU72060916 01 IEC/EN 60950-1:2001 US-TUVR-2963 Needle Flame Test to IEC60950-1:2003/A2 2850381_001 UL 60950-1:2003 CAN/CSA-C22.2 No.60950-1-03 CU72060916 01 MIL MIL-STD 883 Method 3015.7 Pass IEC EN55024 / IEC61000-4-2 Class B FCC Emissions 1-40 GHz Class B Noise frequency range up to 13GHz. Greater than 9dB margin over tested range using PRBS pattern. IEC EN55022 Emissions 30-1000 MHz Pass Class B EN61000-4-3 Immunity 80-1000 MHz 3V/m Pass Class A TÜV Product Safety TÜV UL/CSA ESD EMI 10 Data Sheet RoHS Compliance Bookham is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compliance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details. Ordering Information: IGF-42311J TRX 10G XFP 10KM SR MP4 COM ROHS 5/6 IGF-42312J TRX 10G XFP 10KM SR MP EXT ROHS 5/6 Contact Information North America Bookham Worldwide Headquarters Europe Paignton Office Asia Shenzhen Office 2584 Junction Ave. San Jose CA 95134 USA Brixham Road Paignton Devon TQ4 7BE United Kingdom 2 Phoenix Road Futian Free Trade Zone Shenzhen 518038 China • Tel: +1 408 919 1500 • Tel: +44 (0) 1803 66 2000 • Fax: +1 408 919 6083 • Fax: +44 (0) 1803 66 2801 • Fax: +86 755 33305805 +86 755 33305807 • Tel: +86 755 33305888 Important Notice Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by Bookham before they become applicable to any particular order or contract. In accordance with the Bookham policy of continuous improvement specifications may change without notice. The publication of information in this data sheet does not imply freedom from patent or other protective rights of Bookham or others. Further details are available from any Bookham sales representative. www.bookham.com email@example.com 11 BH12953 Rev 2.0 July 2006 ©Bookham 2005. Bookham is a registered trademark of Bookham Inc.