DATA SHEET Solid State Relay OCMOS FET PS7801J-1A 4-PIN ULTRA SMALL FLAT-LEAD, LOW C×R 3pF • Ω , 1-ch Optical Coupled MOS FET DESCRIPTION The PS7801J-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. An ultra small flat-lead package has been provided which realizes a reduction in mounting area of about 50% compared with the PS72xx series. It is suitable for high-frequency signal control, due to its low C×R 3pF • Ω, low output capacitance, and low off-state leakage current. FEATURES PIN CONNECTION (Top View) • Ultra small flat-lead package (4.2 (L) × 2.5 (W) × 1.85 (H) mm) • Low C × R (C × R = 2.9 pF • Ω) • Low output capacitance (Cout = 1.3 pF TYP.) 4 3 • 1 channel type (1 a output) 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET • Designed for AC/DC switching line changer • Low offset voltage • Ordering number of taping product: PS7801J-1A-F3, F4 (3 500 pcs/reel) • Pb-Free product • UL awaiting approval 1 2 APPLICATIONS • Measurement equipment Document No. Date Published Printed in Japan © NEC Compound Semiconductor Devices, Ltd. 2006 PS7801J-1A PACKAGE DIMENSIONS (UNIT: mm) 2.5±0.3 0.2 MAX. 3.6 +0.3 –0.4 0.2±0.1 N 4.2±0.2 3 4 4.6±0.2 0.36 0.15 +0.1 –0.05 1.85±0.05 1 2 3.0 MAX. 0.4±0.1 0.2±0.1 1.27 MARKING EXAMPLE Last number of type No. : 1J *1 1J Bar : Pb-Free N 603 No.1 pin mark (Nicked corner) An initial of "NEC" Assembly lot 6 03 (Marking details) Week assembled Year assembled *1 The marking corresponds to the last two digits of the part number below. PS7801J-1A 2 Preliminary Data Sheet PS7801J-1A ORDERING INFORMATION Part Number Order Number Solder Plating Packing Style Safety Standard Specification PS7801J-1A-F3 PS7801J-1A-F3-A P S 7 8 0 1 J - 1 A -F 4 P S 7 8 0 1 J - 1 A- F 4 - A Pb-Free Approval Embossed Tape 3 500 pcs/reel UL awaiting Application *1 Part Number PS7801J-1A ap p ro v a l *1 For the application of the Safety Standard, following part number should be used. ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Diode Symbol Ratings Unit Forward Current (DC) IF 50 mA Reverse Voltage VR 5.0 V PD 50 mW IFP 1 A Power Dissipation Peak Forward Current MOS FET *1 Break Down Voltage VL 20 V Continuous Load Current IL 160 mA ILP 240 mA *2 Pulse Load Current (AC/DC Connection) Power Dissipation PD 250 mW BV 500 Vr.m.s. Total Power Dissipation PT 300 mW Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −40 to +100 °C Isolation Voltage *2 *1 PW = 100 μs, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25°C, RH = 60% between input and output Pins 1-2 shorted together, 3-4 shorted together. RECOMMENDED OPERATING CONDITIONS (TA = 25°C) Parameter Symbol MIN. TYP. MAX. Unit LED Operating Current IF 2 5 20 mA L E D O f f V o lt a ge VF 0 0.5 V Preliminary Data Sheet 3 PS7801J-1A ELECTRICAL CHARACTERISTICS (TA = 25°C) Parameter Diode MOS FET Symbol Conditions Forward Voltage VF IF = 5 m A Reverse Current IR VR = 5 V Off-state Leakage ILoff V D = 20 V Output Capacitance Cout VD = 0 V, f = 1 MHz, LED On-state Current IFon IL = 1 6 0 m A On-state Resistance MIN. TYP. 1.1 MAX. 1.4 V 5.0 μA 0. 01 0. 25 1.3 1.7 pF 2.0 mA nA Current Coupled 1 Unit Ron IF = 5 mA, IL = 160 mA, t ≤ 10 ms 2.2 3.2 Ω *1, 2 ton IF = 5 mA, VL = 5 V, RL = 500 Ω, 0.05 0.5 ms *1, 2 toff PW ≥ 10 ms 0. 03 0. 5 Turn-on Time Turn-off Time Isolation Resistance RI-O VI-O = 0.5 kVDC Isolation Capacitance CI-O V = 0 V, f = 1 MH z 10 9 Ω 0.3 pF *1 Test Circuit for Switching Time IF Pulse Input VL 50% Input 0 VO = 5 V Input monitor 90% VO monitor Output Rin RL 10% ton toff *2 The turn-on time and turn-off time are specified as input-pulse width ≥ 10 ms. Be aware that when the device operates with an input-pulse width less than 10 ms, the turn-on time and turn-off time will increase. 4 Preliminary Data Sheet PS7801J-1A TAPING SPECIFICATIONS (UNIT: mm) 1.5+0.1 –0 2.9 MAX. 12.0±0.2 5.5±0.05 4.0±0.1 5.3±0.1 2.0±0.05 1.75±0.1 Outline and Dimensions (Tape) 0.3 1.55±0.05 2.4±0.1 2.9±0.1 4.0±0.1 Tape Direction PS7801J-1A-F4 PS7801J-1A-F3 N N N N N N N N Outline and Dimensions (Reel) R 1.0 q 21.0±0.8 q13.0±0.2 2.0±0.5 q13.0±0.2 q 330±2.0 q 100±1.0 2.0±0.5 13.5±1.0 17.5±1.0 Packing: 3 500 pcs/reel Preliminary Data Sheet 11.9 to 15.4 Outer edge of flange 5 PS7801J-1A RECOMMENDED MOUNT PAD DIMENSIONS (UNIT: mm) 5.3 4.4 3.6 0.6 (0.35) 1.27 0.8 ( ) : Reference value 24-R0.1 Remark All dimensions in this figure must be evaluated before use. 6 Preliminary Data Sheet PS7801J-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature 260°C or below (package surface temperature) • Time of peak reflow temperature 10 seconds or less • Time of temperature higher than 220°C 60 seconds or less • Time to preheat temperature from 120 to 180°C 120±30 s • Number of reflows Three • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) 3DFNDJH6XUIDFH7HPSHUDWXUH7Ý& Recommended Temperature Profile of Infrared Reflow KHDWLQJ to 10 s Ý&0$; Ý& to 60 s Ý& Ý& 120±30 s SUHKHDWLQJ 7LPHV (2) Wave soldering • Temperature 260°C or below (molten solder temperature) • Time 10 seconds or less • Preheating conditions 120°C or below (package surface temperature) • Number of times One • Flux Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent. Preliminary Data Sheet 7 PS7801J-1A When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 8 Preliminary Data Sheet PS7801J-1A Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. 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Restricted Substance per RoHS Concentration Limit per RoHS (values are not yet fixed) Concentration contained in CEL devices -A Not Detected Lead (Pb) < 1000 PPM Mercury < 1000 PPM Not Detected Cadmium < 100 PPM Not Detected Hexavalent Chromium < 1000 PPM Not Detected PBB < 1000 PPM Not Detected PBDE < 1000 PPM Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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