BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1514TU 16 GHz INPUT DIVIDE BY 8 PRESCALER IC FOR SATELLITE COMMUNICATIONS DESCRIPTION The µPB1514TU is a silicon germanium (SiGe) monolithic integrated circuit designed as a divide by 8 prescaler IC for satellite communications and point-to-point/multi-point radios. The package is 8-pin lead-less minimold suitable for surface mount. This IC is manufactured using our 50 GHz fmax UHS2 (Ultra High Speed Process) SiGe bipolar process. FEATURES • Operating frequency : fin = 8 to 16 GHz • Low current consumption : ICC = 50 mA @ VCC = 5.0 V • High-density surface mounting : 8-pin lead-less minimold • Supply voltage : VCC = 4.5 to 5.5 V • Division ratio :8 APPLICATIONS • Point-to-point/Multi-point radios • VSAT radios ORDERING INFORMATION Part Number Order Number Package Markin Supplying Form g µPB1514TU-E2 µPB1514TU-E2-A 8-pin lead-less minimold (Pb-Free) Note 1514 • 8 mm wide embossed taping • Pin 5, 6, 7, 8 indicates pull-out direction of tape • Qty 5 kpcs/reel Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPB1514TU Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PU10541EJ02V0DS (2nd edition) Date Published March 2005 CP(K) The mark shows major revised points. © NEC Compound Semiconductor Devices, Ltd. 2004, 2005 µPB1514TU INTERNAL BLOCK DIAGRAM AND PIN CONNECTIONS (Top View) 1 Regulator Pin Name 1 VCC1 2 IN 3 GND 4 IN 5 OUT 6 GND 7 OUT 8 VCC2 7 2 3 8 Pin No. 1/2 1/2 1/2 6 5 4 SYSTEM APPLICATION EXAMPLE LNA Down-Converter µ PB1514TU 16 GHz Prescaler 1/8 PLL Diplexer PA 2 Up-Converter Data Sheet PU10541EJ02V0DS µPB1514TU PIN EXPLANATION Pin No. Pin Name Applied Voltage Function and Applications (V) 1 VCC1 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. 2 IN − Signal input pin. This pin should be coupled to signal source with capasitor (example : 100 pF) for DC cut. 3 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 4 IN − Signal input bypass pin. This pin must be equipped with bypass capacitor (example : 100 pF) to minimize ground impedance. 5 OUT − Divided frequency output pin. This pin shoud be coupled to load device with capasitor (example : 100 pF) for DC cut. 6 GND 0 Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. 7 OUT − Divided frequency output pin. This pin should be coupled to load device with capasitor (example : 100 pF) for DC cut. 8 VCC2 5 Power supply pin. This pin must be equipped with bypass capacitor (example : 100 pF and 10 nF) to minimize ground impedance. Data Sheet PU10541EJ02V0DS 3 µPB1514TU ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit 6 V Supply Voltage VCC TA = +25°C Total Power Dissipation PD TA = +85°C Note 867 mW Rth(j-c) TA = +85°C Note 75 °C/W Thermal Resistance (junction to ground paddle) Operating Ambient Temperature TA −40 to +85 °C Storage Temperature Tstg −55 to +150 °C Note Mounted on 33 × 21 × 0.4 mm polyimide PCB, with copper patterning on both sides. RECOMMENDED OPERATING RANGE Parameter Symbol MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (VCC = 4.5 to 5.5 V, TA = −40 to +85°C, ZS = ZL = 50 Ω) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Circuit Current ICC No Signals − 50 75 mA Input Sensitivity Pin1 fin = 8 to 13.5 GHz −2 − +6 dBm Pin2 fin = 13.5 to 16 GHz −5 − +6 dBm Pout fin = 8 to 16 GHz, Pin = 0 dBm −11 −5 +2 dBm Output Power 4 Data Sheet PU10541EJ02V0DS µPB1514TU TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY 15 5 Output Power Pout (dBm) Input Sensitivity Pin (dBm) 10 Guaranteed operating range 0 –5 –10 –15 –20 –25 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V –30 –35 5 10 15 20 Pin = 0 dBm Guaranteed operating range 10 15 VCC = 4.5 V VCC = 5.0 V VCC = 5.5 V 20 Frequency f (GHz) Frequency f (GHz) INPUT SENSITIVITY vs. FREQUENCY OUTPUT POWER vs. FREQUENCY 15 5 Output Power Pout (dBm) 10 Input Sensitivity Pin (dBm) 3 2 1 0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10 –11 –12 5 Guaranteed operating range 0 –5 –10 –15 –20 –25 –30 –35 5 VCC = 5.0 V TA = –40˚C TA = +25˚C TA = +85˚C 10 15 20 3 2 1 0 –1 –2 –3 –4 –5 –6 –7 –8 –9 –10 –11 –12 VCC = 5.0 V Pin = 0 dBm Guaranteed operating range 5 Frequency f (GHz) 10 15 TA = –40˚C TA = +25˚C TA = +85˚C 20 Frequency f (GHz) CIRCUIT CURRENT vs. SUPPLY VOLTAGE 55 Circuit Current ICC (mA) 50 45 40 35 30 25 20 15 10 5 0 1 2 3 4 TA = –40˚C TA = +25˚C TA = +85˚C 5 6 Supply Voltage VCC (V) Remark The graphs indicate nominal characteristics. Data Sheet PU10541EJ02V0DS 5 µPB1514TU S-PARAMETERS (TA = +25°C, VCC = 5.0 V) S11−FREQUENCY 1 START : 8.0 GHz STOP : 16.0 GHz 2 FREQUENCY S11 GHz MAG ANG 3 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 4 5 0.667 0.718 0.768 0.752 0.700 0.733 0.779 0.726 0.705 70.3 57.8 51.2 46.0 36.8 38.1 34.0 27.6 20.0 1 : 9.0 GHz 2 : 10.0 GHz 3 : 12.0 GHz 4 : 14.0 GHz 5 : 15.0 GHz S22−FREQUENCY START : 1.0 GHz STOP : 2.0 GHz FREQUENCY S22 GHz MAG 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 6 Data Sheet PU10541EJ02V0DS 0.011 0.009 0.012 0.018 0.026 0.034 0.045 0.053 0.063 0.064 0.028 ANG 18.3 51.4 88.8 99.5 105.6 106.6 103.7 99.1 89.9 80.5 60.9 µPB1514TU MEASUREMENT CIRCUIT 100 pF 10 nF 5V 8 1 Power Supply 100 pF 50 Ω VCC1 VCC2 IN OUT GND GND 7 2 6 3 50 Ω 5 4 IN Signal Generator 100 pF OUT 100 pF 51 Ω 100 pF Spectrum Analyzer 51 Ω The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet PU10541EJ02V0DS 7 µPB1514TU ILLUSTRATION OF THE MEASUREMENT CIRCUIT ASSEMBLED ON EVALUATION BOARD 100 pF 100 pF 10 nF 8 7 6 5 1 2 3 4 100 pF 100 pF 51 Ω 100 pF 51 Ω Remarks 1. 33 × 21 × 0.4 mm double-sided copper-clad polyimide PCB 2. Back side: GND pattern 3. Solder plated on pattern 4. 5. 8 represents cutout : Through holes Data Sheet PU10541EJ02V0DS µPB1514TU PACKAGE DIMENSIONS 8-PIN LEAD-LESS MINIMOLD (UNIT: mm) (Top View) (Bottom View) (0.65) (0.65) (0.6) (0.3) 3 4 8 0.4±0.1 (0.6) 2.0±0.1 7 0.4±0.1 2 6 (1.4) 1 5 (0.35) (0.35) 5 (0.35)(0.35) 6 (0.5) (0.5) 7 (0.6) 8 0.16±0.05 0.125+0.1 –0.05 (0.25) (0.25) 0.5±0.03 2.2±0.05 2.0±0.1 Data Sheet PU10541EJ02V0DS (0.75) 4 3 (0.75) 2 1 9 µPB1514TU NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground terminals as short as possible. (4) Bypass capacitance must be attached to VCC line. (5) Exposed heatsink at bottom on package must be soldered to PCB RF/DC ground. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PU10541EJ02V0DS HS350 µPB1514TU When the product(s) listed in this document is subject to any applicable import or export control laws and regulation of the authority having competent jurisdiction, such product(s) shall not be imported or exported without obtaining the import or export license. • The information in this document is current as of March, 2005. 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M8E 00. 4 - 0110 Data Sheet PU10541EJ02V0DS 11 µPB1514TU For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: firstname.lastname@example.org (sales and general) email@example.com (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: firstname.lastname@example.org (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. 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