FMM5829X K-Band Power Amplifier MMIC FEATURES •High Output Power; P1dB = 31 dBm (Typ.) •High Linear Gain; GL = 23 dB(Typ.) •Frequency Band ; 21.0 - 27.0 GHz •High Linearity ; OIP3 = 39dBm •Impedance Matched Zin/Zout = 50Ω DESCRIPTION The FMM5829X is a power amplifier MMIC that contains a four stage amplifier, internally matched, for standard communications band in 21.0 to 27.0GHz frequency range. This product is well suited for point-to-point radio applications. Device photo Eudyna’s stringent Quality Assurance Program assures the highest reliability and consistent performance. ABSOLUTE MAXIMUM RATING Item Drain-Source Voltage Gate-Source Voltage Input Power Storage Temperature Symbol VDD VGG Pin Tstg RECOMMENDED OPERATING CONDITIONS Symbol Item Drain-Source Voltage VDD Input Power Pin Operating Backside Temperature Top This Product should be hermetically packaged. Condition Rating 10 -3 22 -55 ~ +125 Unit V V dBm degC Condition Recommend ≦7 12 -40 ~ +85 Unit V dBm degC ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25℃ ℃) Item Symbol Test Conditions VDD=6V Frequency Range f IDD(DC)=800mA(typ) Output Power at 1dB G.C.P. P1dB Zs=Zl=50ohm Power Gain at 1dB G.C.P. G1dB Power-added Efficiency at 1dB G.C.P. Nadd *df=10MHz,Po=20dBm (SCL) Third Order Intermodulation* IM3* Drain Current at 1dB G.C.P. Iddrf Input Return Loss (at Pin=-20dBm) RLin Output Return Loss (at Pin=-20dBm) RLout Note : RF parameter sample size 10ps. Criteria (accept/reject)=(0/1) ESD Class 0 Unit Limits Min. Typ. Max. 21 27 GHz 29.0 31.0 dBm 19 22 25 dB 21 % -34 -38 dBc 1000 1500 mA -8 dB -8 dB G.C.P. : Gain Compression Point S.C.L. : Single Carrier Level ~ 199V Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5kΩ) Edition 2.0 April 2006 1 http://www.eudyna.com/ FMM5829X K-Band Power Amplifier MMIC Output Power vs. Frequency Output Power, Drain Current vs. Input Power VDD=6V, IDD(DC)=800mA VDD=6V, IDD(DC)=800mA 34 33 32 Pin=12dBm P1dB 27 Pin=8dBm 25 23 Pin=4dBm 21 Output Power [dBm] Output Power [dBm] 31 29 2200 21GHz 23GHz 25GHz 27GHz 30 2000 1800 Pout 28 1600 26 1400 24 1200 22 1000 19 Pin=0dBm 17 15 800 Drain Current 18 19 20 21 22 23 24 25 26 27 28 29 Frequency [GHz] VDD=6V, IDD(DC)=800mA 30 25 Pin=12dBm 20 P1dB 15 Pin=8dBm 10 Pin=4dBm 5 Pin=0dBm 0 19 20 21 22 23 24 25 600 -4 -2 0 2 4 6 8 10 Input Power [dBm] Power Added Efficiency vs. Frequency Power Added Efficiency [%] 20 26 27 28 29 Frequency [GHz] 2 12 14 16 Drain Current [mA] 35 FMM5829X K-Band Power Amplifier MMIC IMD vs. Frequency IMD vs. Output Power VDD=6V, IDD(DC)=800mA VDD=6V, IDD(DC)=800mA, Pout=20dBm S.C.L. -10 21GHz 23GHz 25GHz 27GHz -15 Intermodulation Distortion [dBc] Intermodulation Distortion [dBc] -30 -35 IM3 -40 -45 IM5 -50 -55 -20 -25 -30 -35 -40 IM3 -45 IM5 -50 -55 -60 20 21 22 23 24 25 26 27 28 -60 29 16 Frequency [GHz] 20 22 24 26 28 2-tone Total Output Power [dBm] 30 Output Power, Gain vs. Drain Voltage Output Power, Gain vs. Drain Current IDD(DC)=800mA VDD=6V 36 34 30 32 34 30 32 28 P1dB 28 26 G1dB 26 24 P1dB [dBm] 32 36 G1dB [dB] 21GHz 23GHz 25GHz 27GHz 34 P1dB [dBm] 18 32 34 21GHz 23GHz 25GHz 27GHz 32 30 30 28 P1dB 28 26 26 24 G1dB 24 22 24 22 22 20 22 20 18 20 500 20 3 4 5 6 7 8 9 Drain Voltage [V] 600 700 800 900 Drain Current [mA] 3 1000 18 1100 G1dB [dB] 19 FMM5829X K-Band Power Amplifier MMIC Output Power, Drain Current vs. Input Power by Drain Voltage Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=800mA, f=21GHz IDD(DC)=800mA, f=23GHz 1800 30 1600 26 1400 Pout 24 1200 Drain Current 1200 1000 20 800 20 600 18 0 2 4 6 8 10 12 14 16 600 -4 -2 0 2 2200 2000 32 1800 30 1600 1400 Pout 24 1200 22 Drain Current 18 0 2 4 6 8 10 12 14 Output Power [dBm] Output Power [dBm] 28 -2 10 12 14 16 34 Drain Current [mA] 4V 5V 6V 7V 8V -4 8 IDD(DC)=800mA, f=27GHz 34 20 6 Output Power, Drain Current vs. Input Power by Drain Voltage IDD(DC)=800mA, f=25GHz 26 4 Input Pow er [dBm ] Output Power, Drain Current vs. Input Power by Drain Voltage 30 800 Drain Current Input Pow er [dBm ] 32 1400 Pout 24 22 -2 1600 26 1000 -4 1800 28 22 18 2000 Drain Current [mA] 28 32 2200 4V 5V 6V 7V 8V 2200 4V 5V 6V 7V 8V 2000 1800 28 1600 26 1400 Pout 24 1200 1000 22 1000 800 20 600 18 16 600 -4 Input Pow er [dBm ] -2 0 2 4 6 8 Input Pow er [dBm ] 4 800 Drain Current 10 12 14 16 Drain Current [mA] 30 2000 Output Power [dBm] 32 Output Power [dBm] 34 2200 4V 5V 6V 7V 8V Drain Current [mA] 34 FMM5829X K-Band Power Amplifier MMIC Output Power, Drain Current vs. Input Power by Drain Current Output Power, Drain Current vs. Input Power by Drain Current VDD=6V, f=21GHz VDD=6V, f=23GHz 28 32 1600 30 1400 Pout 26 1200 24 1000 22 800 18 -4 -2 0 2 4 6 8 10 12 14 1800 1600 28 26 1200 24 1000 22 800 600 20 400 18 16 600 400 -4 -2 0 2 Input Pow er [dBm ] 8 32 1600 30 1400 26 1200 24 1000 22 Output Power [dBm] Pout 1800 Drain Current [mA] 30 20 18 0 2 4 6 8 14 16 2000 600m A 800m A 1000m A 1800 1600 Pout 28 1400 26 1200 24 1000 800 22 600 20 10 12 14 400 18 600 400 -4 16 -2 0 2 4 6 8 Input Pow er [dBm ] Input Pow er [dBm ] 5 800 Drain Current Drain Current -2 12 34 2000 600m A 800m A 1000m A -4 10 VDD=6V, f=27GHz 34 Output Power [dBm] 6 Output Power, Drain Current vs. Input Power by Drain Current VDD=6V, f=25GHz 28 4 Input Pow er [dBm ] Output Power, Drain Current vs. Input Power by Drain Current 32 1400 Pout Drain Current Drain Current 20 2000 600m A 800m A 1000m A 10 12 14 16 Drain Current [mA] Output Power [dBm] 30 1800 Output Power [dBm] 32 34 Drain Current [mA] 2000 600m A 800m A 1000m A Drain Current [mA] 34 FMM5829X K-Band Power Amplifier MMIC IMD vs. Output Power by Drain Voltage IMD vs. Output Power by Drain Voltage IDD(DC)=800mA, f=21GHz IDD(DC)=800mA, f=23GHz -10 5V 6V 7V 8V -15 -20 Intermodulation Distortion [dBc] Intermodulation Distortion [dBc] -10 -25 -30 -35 IM3 -40 -45 -50 IM5 -55 -60 5V 6V 7V 8V -15 -20 -25 -30 -35 IM3 -40 -45 -50 IM5 -55 -60 16 18 20 22 24 26 28 30 32 16 18 2-tone Total Pout [dBm] 22 24 26 28 30 32 30 32 2-tone Total Pout [dBm] IMD vs. Output Power by Drain Voltage IMD vs. Output Power by Drain Voltage IDD(DC)=800mA, f=25GHz IDD(DC)=800mA, f=27GHz -10 -10 5V 6V 7V 8V -15 -20 Intermodulation Distortion [dBc] Intermodulation Distortion [dBc] 20 -25 -30 -35 IM3 -40 -45 -50 IM5 -55 5V 6V 7V 8V -15 -20 -25 -30 -35 IM3 -40 -45 -50 IM5 -55 -60 -60 16 18 20 22 24 26 28 30 16 32 18 20 22 24 26 28 2-tone Total Pout [dBm] 2-tone Total Pout [dBm] 6 FMM5829X K-Band Power Amplifier MMIC IMD vs. Output Power by Drain Current IMD vs. Output Power by Drain Current VDD=6V, f=23GHz VDD=6V, f=21GHz -10 600mA 800mA 1000mA -15 -20 Intermodulation Distortion [dBc] Intermodulation Distortion [dBc] -10 -25 IM3 -30 -35 -40 -45 -50 IM5 -55 -60 600mA 800mA 1000mA -15 -20 -25 -30 IM3 -35 -40 -45 -50 IM5 -55 -60 16 18 20 22 24 26 28 30 32 16 18 2-tone Total Pout [dBm] 20 24 26 28 30 32 IMD vs. Output Power by Drain Current IMD vs. Output Power by Drain Current VDD=6V, f=27GHz VDD=6V, f=25GHz -10 -10 600mA 800mA 1000mA -15 -20 Intermodulation Distortion [dBc] Intermodulation Distortion [dBc] 22 2-tone Total Pout [dBm] -25 -30 IM3 -35 -40 -45 IM5 -50 -55 -60 600mA 800mA 1000mA -15 -20 -25 -30 -35 IM3 -40 IM5 -45 -50 -55 -60 16 18 20 22 24 26 28 30 32 16 2-tone Total Pout [dBm] 18 20 22 24 26 28 2-tone Total Pout [dBm] 7 30 32 FMM5829X K-Band Power Amplifier MMIC ■S-PARAMETER @VDD=6V, IDD=800mA Sxx [dB] 35 30 25 S21 20 15 S22 S11 10 5 0 -5 -10 -15 -20 -25 -30 0 5 10 15 20 25 30 35 40 Frequency [GHz] Sxx [dB] @VDD=6V, IDD=800mA 35 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 S21 19 20 S11 21 22 S22 23 24 25 Frequency [GHz] 8 26 27 28 29 FMM5829X K-Band Power Amplifier MMIC ■S-PARAMETER VDD=6V, IDD=800mA Frequency [GHz] 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 21.2 21.4 21.6 21.8 22.0 22.2 22.4 22.6 22.8 23.0 23.2 23.4 23.6 23.8 24.0 24.2 24.4 24.6 24.8 25.0 25.2 25.4 25.6 25.8 26.0 26.2 26.4 26.6 26.8 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0 S11 MAG 0.95 0.93 0.93 0.93 0.94 0.94 0.95 0.95 0.95 0.95 0.90 0.85 0.83 0.80 0.78 0.73 0.67 0.58 0.45 0.31 0.25 0.26 0.28 0.29 0.32 0.34 0.36 0.39 0.41 0.43 0.45 0.47 0.49 0.51 0.52 0.52 0.53 0.53 0.52 0.51 0.50 0.48 0.45 0.41 0.36 0.29 0.21 0.10 0.04 0.17 0.31 0.76 0.87 0.92 0.93 0.94 0.94 0.94 0.95 0.94 0.95 0.95 0.94 0.95 ANG -46.52 -82.53 -109.37 -130.21 -146.80 -160.74 -172.97 175.84 164.96 153.37 141.87 133.80 125.44 115.80 104.59 91.67 76.49 57.35 30.88 -11.12 -81.26 -95.83 -110.02 -122.42 -133.00 -142.44 -151.02 -158.21 -165.59 -172.08 -178.18 176.15 170.83 165.17 159.85 154.19 149.03 143.99 139.08 133.70 128.47 122.94 116.83 111.18 104.32 97.35 90.19 84.65 -148.03 -135.67 -144.63 170.55 144.56 128.25 115.72 105.45 97.03 88.32 81.22 74.36 67.41 61.06 55.13 48.92 S21 MAG ANG 0.02 22.82 0.04 56.73 0.10 67.04 0.13 -58.16 0.07 -118.46 0.04 -138.70 0.04 -134.08 0.10 -130.87 0.27 171.39 0.35 144.98 1.01 78.71 1.28 1.73 1.36 -55.99 1.58 -104.99 2.02 -152.62 2.80 157.35 4.10 103.03 6.14 42.40 9.07 -25.14 12.64 -101.25 14.97 175.66 15.15 158.89 15.23 142.20 15.18 125.41 15.02 108.90 14.78 92.74 14.52 76.77 14.22 61.07 13.90 45.49 13.59 30.13 13.28 14.94 12.98 -0.03 12.74 -14.96 12.55 -29.90 12.35 -44.98 12.17 -60.13 12.03 -75.24 11.92 -90.38 11.89 -105.69 11.88 -121.55 11.93 -137.63 12.05 -154.24 12.21 -171.38 12.41 170.66 12.63 151.62 12.83 131.32 12.93 109.68 12.80 86.82 12.48 62.47 11.81 36.74 10.79 10.29 4.20 -118.89 0.80 128.02 0.08 53.68 0.01 118.01 0.01 95.87 0.00 43.09 0.00 -59.06 0.00 -165.76 0.00 -125.92 0.00 115.52 0.00 -78.22 0.01 -170.29 0.00 -79.65 9 S12 MAG ANG 0.00 75.66 0.00 -144.46 0.00 12.27 0.00 -164.67 0.00 -130.04 0.00 139.94 0.00 54.63 0.00 -4.39 0.00 -90.07 0.00 -158.98 0.00 150.77 0.00 85.46 0.00 91.85 0.00 30.67 0.00 29.14 0.00 43.85 0.00 1.77 0.00 -66.66 0.00 59.15 0.00 59.30 0.00 -113.49 0.00 18.99 0.00 136.79 0.00 123.31 0.00 57.33 0.00 81.33 0.00 -16.38 0.00 113.20 0.00 87.24 0.00 63.06 0.00 79.64 0.00 30.87 0.00 35.39 0.00 6.94 0.00 15.72 0.00 -45.32 0.00 5.77 0.00 -3.23 0.00 5.71 0.00 -55.25 0.00 -13.22 0.00 17.56 0.00 -1.67 0.00 -40.60 0.00 -120.63 0.00 -56.34 0.00 -86.35 0.00 4.47 0.00 10.48 0.00 -7.20 0.00 70.86 0.00 1.80 0.00 -54.60 0.00 -83.60 0.00 60.51 0.00 -108.88 0.00 -113.34 0.00 -12.11 0.00 -27.51 0.00 -145.32 0.00 124.56 0.00 -179.38 0.00 -70.65 0.00 115.57 S22 MAG ANG 1.00 -34.80 0.98 -66.71 0.96 -94.62 0.94 -113.92 0.97 -133.59 0.98 -151.02 0.97 -166.40 0.97 179.94 0.97 167.40 0.97 155.21 0.96 143.27 0.96 131.39 0.95 119.43 0.94 106.90 0.92 93.46 0.89 78.27 0.84 60.95 0.76 39.80 0.62 12.21 0.41 -27.35 0.17 -103.83 0.16 -130.13 0.16 -157.96 0.17 177.04 0.20 158.15 0.23 142.94 0.25 130.63 0.28 119.89 0.30 110.55 0.31 101.86 0.33 94.02 0.34 86.18 0.34 79.76 0.35 72.97 0.35 65.85 0.35 58.54 0.35 51.37 0.34 44.29 0.33 37.47 0.33 29.73 0.32 21.96 0.31 13.58 0.29 3.97 0.28 -5.76 0.26 -15.50 0.25 -25.73 0.24 -36.56 0.23 -49.93 0.22 -62.47 0.20 -74.09 0.19 -85.15 0.25 -114.71 0.48 -152.28 0.62 171.26 0.69 147.18 0.74 129.01 0.77 114.56 0.79 102.54 0.82 91.08 0.83 81.44 0.84 71.65 0.85 62.52 0.85 54.05 0.86 45.74 FMM5829X K-Band Power Amplifier MMIC ΔTch vs. Drain Voltage (Reference) IDD(DC)=800mA 80 70 Δ Tch [℃ ℃] 60 50 40 30 20 10 0 4 5 6 MTTF vs. Tch 7 8 9 MTTF [ hrs ] VDD [V] 1.E+12 1.E+11 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 1.E+01 Ea=1.56eV 50 100 150 o Tch [ C ] 10 200 250 FMM5829X K-Band Power Amplifier MMIC ■ Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters) VDD1 VDD2 (VGG3) 1170 0 120 450 800 VDD3 1840 (VGG5) 2990 VDD5 3430 3905 4025 2235 2115 2100 2235 2040 RF-IN RF-OUT 1290 1405 195 120 0 195 0 0 120 240 VGG1 830 1170 (VGG2) (VGG4) 1840 VDD4 2990 (VGG6) 3430 3905 4025 VDD6 Chip Size : 4025± ±30um x 2235± ±30um Chip Thickness : 60± ±20um Bonding Pad Size : RF-Pad : 120um x 80um VGG-Pad : 80um x 80um VDD-Pad : 100um x 100um Ｎｏｔｅ : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2~6). 11 FMM5829X K-Band Power Amplifier MMIC ■ Assembly Diagrams Recommended assembly 100pF 100pF 100pF 100pF 1 uF VDD 50ohm Line 50ohm Line VDD VGG 1 uF 100pF 100pF 100pF 1 uF “Copper” is the recommended material for the package or carrier. 12 FMM5829X K-Band Power Amplifier MMIC ■DIE ATTACH 1) The die-attach station must have accurate temperature control and an inert forming gas should be used. 2) Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Preform Volume : per next Figure Volume of Au-Sn Perform (10 -3/mm 3) 2500 2000 FMM5829X 1500 1000 500 0 0 2 4 6 8 10 12 14 16 18 20 Area of Chip Bach Surface (mm^2) ■ WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N ± 0.0196 N Stage Temperature : 215 deg.C ± 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond 13 FMM5829X K-Band Power Amplifier MMIC For further information please contact : Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: +1 408 232-9500 FAX: +1 408 428-9111 CAUTION Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: ・Do not put these products into the mouth. Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 ・Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. ・Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices International Srl Via Teglio 8/2 - 20158 Milano, Italy TEL: +39-02-8738-1695 Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others. © 2006 Eudyna Devices Inc. Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc. 1000 Kamisukiahara, showa-cho Nakakomagun, Yamanashi 409-3883, Japan (Kokubo Industrial Park) TEL +81-55-275-4411 FAX +81-55-275-9461 Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170 14