### AGILENT HSMS-2865

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Absolute Maximum Ratings, Ta = +25°C, Single Diode
Symbol
Absolute Maximum[1]
Parameter
HSMS-285x
HSMS-286x
75 mW
250 mW
PT
Total Device Dissipation[2]
PIV
Peak Inverse Voltage
2.0 V
4.0 V
TJ
Junction Temperature
150°C
150°C
TSTG
Storage Temperature
-65°C to 150°C
-65°C to 150°C
TOP
Operating Temperature
-65°C to 150°C
-65°C to 150°C
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. CW Power Dissipation at TLEAD = +25°C. Derate linearly to zero at
maximum rated temperature.
ESD WARNING: Handling Precautions Should Be Taken To Avoid Static Discharge.
Equivalent Circuit Model
HSMS-2850, HSMS-2860;
Singles
0.08 pF
Rj
2 nH
SPICE Parameters
Parameter
Units
HSMS-285X
HSMS-286X
BV
V
3.8
7.0
CJ0
pF
0.18
0.18
EG
eV
0.69
0.69
IBV
A
3 x 10E-4
10E-5
IS
A
3 x 10E-6
5.0 x 10E-8
1.06
1.08
N
RS
0.18 pF
RS = series resistance (see Table of SPICE parameters)
Rj =
8.33 X 10-5 nT
Ib + I s
where
Ib = externally applied bias current in amps
Is = saturation current (see table of SPICE parameters)
T = temperature, °K
n = identity factor (see table of SPICE parameters)
RS
Ω
25
5.0
PB (VJ)
V
0.35
0.65
PT (XTI)
2
2
M
0.5
0.5
4
1
0.1
TA = +85°C
TA = +25°C
TA = –55°C
10
1
.1
.01
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
VF – FORWARD VOLTAGE (V)
5.8 GHz
-30
2.45 GHz
5.8 GHz
1
POWER IN (dBm)
-40
-30
Figure 5. +25°C Expanded Output
Voltage vs. Input Power. See Figure 4.
3.1
40
2.9
OUTPUT VOLTAGE (mV)
35
30
25
20
Input Power =
–30 dBm @ 2.45 GHz
Data taken in fixed-tuned
FR4 circuit
.1
1
10
FREQUENCY = 2.45 GHz
PIN = -40 dBm
RL = 100 KΩ
2.5
2.3
2.1
1.9
1.7
1.5
1.3
RL = 100 KΩ
5
2.7
100
BIAS CURRENT (µA)
Figure 7. Voltage Sensitivity as a
Function of DC Bias Current,
HSMS-2860.
Applications Information
See the HSMS-285A data sheet.
10 µA
1000
5 µA
100
Frequency = 2.45 GHz
Fixed-tuned FR4 circuit
10
RL = 100 KΩ
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
POWER IN (dBm)
Figure 4. +25°C Output Voltage vs.
Input Power, HSMS-2850 at Zero Bias,
HSMS-2860 at 3 µA Bias.
OUTPUT VOLTAGE (mV)
20 µA
10
0.3
-50
0
-10
-20
1
0.25
10,000
DIODES TESTED IN FIXED-TUNED
FR4 MICROSTRIP CIRCUITS.
10
0.20
Figure 3. Typical Forward Voltage
Match, HSMS-2860 Pairs.
VOLTAGE OUT (mV)
VOLTAGE OUT (mV)
VOLTAGE OUT (mV)
915 MHz
10
15
0.15
915 MHz
2.45 GHz
-40
0.10
RL = 100 KΩ
1000
0.1
-50
∆VF (right scale)
FORWARD VOLTAGE (V)
30
RL = 100 KΩ
1
10
1
0.05
Figure 2. Typical Forward Current vs.
Forward Voltage at Temperature,
HSMS-2860 Series.
10000
10
IF (left scale)
FORWARD VOLTAGE (V)
Figure 1. Typical Forward Current vs.
Forward Voltage, HSMS-2850 Series.
100
FORWARD CURRENT (µA)
10
0.01
100
100
FORWARD CURRENT (mA)
IF – FORWARD CURRENT (mA)
100
FORWARD VOLTAGE DIFFERENCE (mV)
Typical Parameters, Single Diode
1.1 FR4 MICROSTRIP CIRCUIT.
0.9
0 10 20 30 40 50 60 70 80 90 100
TEMPERATURE (°C)
Figure 8. Output Voltage vs.
Temperature, HSMS-2850 Series.
1
–40
–30
–20
–10
0
10
POWER IN (dBm)
Figure 6. Dynamic Transfer
Characteristic as a Function of DC Bias,
HSMS-2860.
5
Ordering Information
Profile Option
Descriptions
Specify part number followed by option. For example:
H
SMS - 285X #X XX
Bulk or Tape and Reel Option
Profile: Low = L
Part Number
Surface Mount Schottky
Hewlett-Packard
Package Dimensions
Outline 23 (SOT-23)
1.02 (0.040)
0.89 (0.035)
0.54 (0.021)
0.37 (0.015)
PACKAGE
MARKING
CODE
3
1.40 (0.055)
1.20 (0.047)
XX
2
1
0.50 (0.024)
0.45 (0.018)
2.65 (0.104)
2.10 (0.083)
2.04 (0.080)
1.78 (0.070)
TOP VIEW
0.152 (0.006)
0.066 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.69 (0.027)
0.45 (0.018)
0.10 (0.004)
0.013 (0.0005)
SIDE VIEW
END VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Outline 143 (SOT-143)
0.92 (0.036)
0.78 (0.031)
PACKAGE
MARKING
CODE
E
C
1.40 (0.055)
1.20 (0.047)
XX
B
2.65 (0.104)
2.10 (0.083)
E
0.60 (0.024)
0.45 (0.018)
2.04 (0.080)
1.78 (0.070)
0.54 (0.021)
0.37 (0.015)
0.15 (0.006)
0.09 (0.003)
3.06 (0.120)
2.80 (0.110)
1.02 (0.041)
0.85 (0.033)
0.10 (0.004)
0.013 (0.0005)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
0.69 (0.027)
0.45 (0.018)
#L30 = Bulk
#L31 = 3K pc. Tape and Reel,
Device Orientation
Figures 9, 10
Tape and Reeling conforms to
Electronic Industries RS-481,
“Taping of Surface Mounted
Components for Automated
Placement.”
Package Characteristics
Alloy 42
Max. Soldering Temp.
260°C for 5 sec.
2 pounds pull
Typical Package Inductance
Typical Package Capacitance
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
END VIEW
4 mm
8 mm
Figure 9. Option L31 for SOT-23 Packages.
4 mm
8 mm
Figure 10. Option L31 for SOT-143 Packages.
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