ICMIC X24320S8-1.8

ICmic
TM
This X24320 device has been acquired by
IC MICROSYSTEMS from Xicor, Inc.
IC MICROSYSTEMS
4K x 8 Bit
X24320
32K
2
400KHz 2-Wire Serial E PROM with Block Lock
FEATURES
TM
DESCRIPTION
2
The X24320 is a CMOS Serial E PROM, internally
organized 4K x 8. The device features a serial inter-
•Save Critical Data with Programmable
Block Lock Protection
2
—Block Lock (0, 1/4, 1/2, or all of E PROM Array)
—Software Write Protection
face and software protocol allowing operation on a
simple two wire bus. The bus operates at 400 KHz all
the way down to 1.8V.
—Programmable Hardware Write Protect
•In Circuit Programmable ROM Mode
•400KHz 2-Wire Serial Interface
Three device select inputs (S0–S2) allow up to eight
devices to share a common two wire bus.
—Schmitt Trigger Input Noise Suppression
—Output Slope Control for Ground Bounce
A Write Protect Register at the highest address location,
FFFFh, provides three write protection features:
Software Write Protect, Block Lock Protect, and
Programmable Hardware Write Protect. The Software
Noise Elimination
•Longer Battery Life With Lower Power
—Active Read Current Less Than 1mA
—Active Write Current Less Than 3mA
—Standby Current Less Than 1µA
•1.8V to 3.6V, 2.5V to 5.5V and 4.5V to 5.5V
Power Supply Versions
•32 Word Page Write Mode
—Minimizes Total Write Time Per Word
Write Protect feature prevents any nonvolatile writes to the
device until the WEL bit in the Write Protect
Register is set. The Block Lock Protection feature gives
the user four array block protect options, set by
programming two bits in the Write Protect Register. The
Programmable Hardware Write Protect feature
allows the user to install the device with WP tied to
VCC, write to and Block Lock the desired portions of
•Internally Organized 4K x 8
•Bidirectional Data Transfer Protocol
•Self-Timed Write Cycle
the memory array in circuit, and then enable the In
Circuit Programmable ROM Mode by programming the
—Typical Write Cycle Time of 5ms
•High Reliability
—Endurance: 100,000 Cycles
—Data Retention: 100 Years
WPEN bit HIGH in the Write Protect Register. After this,
the Block Locked portions of the array, including
the Write Protect Register itself, are permanently
protected from being erased.
•8-Lead SOIC
•14-Lead TSSOP
•8-Lead PDIP
FUNCTIONAL DIAGRAM
DATA REGISTER
2
SERIAL E PROM DATA
AND ADDRESS (SDA)
Y DECODE LOGIC
SCL
2
COMMAND
DECODE
AND
CONTROL
PAGE
DECODE
SERIAL E PROM
ARRAY
4K x 8
LOGIC
LOGIC
1K x 8
BLOCK LOCK AND
WRITE PROTECT
CONTROL LOGIC
1K x 8
S2
S1
DEVICE
SELECT
WRITE
PROTECT
LOGIC
REGISTER
2K x 8
S0
WRITE VOLTAGE
CONTROL
WP
7035 FM 01
Xicor, 1995, 1996 Patents Pending
7035-1.2 4/25/97 T0/C2/D0 SH
1
Characteristics subject to change without notice
X24320
2
PIN NAMES
Xicor E PROMs are designed and tested for applications
requiring extended endurance. Inherent data
Symbol
retention is greater than 100 years.
Description
S0, S1, S2
Device Select Inputs
PIN DESCRIPTIONS
Serial Clock (SCL)
SDA
Serial Data
SCL
Serial Clock
The SCL input is used to clock all data into and out of the
device.
WP
Write Protect
VSS
Ground
Serial Data (SDA)
SDA is a bidirectional pin used to transfer data into and
out of the device. It is an open drain output and
may be wire-ORed with any number of open drain or open
collector outputs.
VCC
Supply Voltage
NC
No Connect
7035 FM T01
PIN CONFIGURATION
An open drain output requires the use of a pull-up
resistor. For selecting typical values, refer to the Pull-
Not to scale
up resistor selection graph at the end of this data
sheet.
8-Lead DIP/SOIC
Device Select (S0, S1, S2)
The device select inputs (S0, S1, S2) are used to set the first
three bits of the 8-bit slave address. This
* .197”
S
0
1
8
S
2
7
S
1
2
V
SS
allows up to eight devices to share a common bus. These
inputs can be static or actively driven. If used
statically they must be tied to VSS or VCC as appropriate.
If actively driven, they must be driven with
CMOS levels (driven to VCC or VSS).
X24320
6
3
4
5
V
CC
WP
SCL
SDA
* .244”
14-Lead TSSOP
S
0
1
14
S
2
13
3
4
X24320 11
NC
NC
5
10
NC
6
9
SCL
7
8
SDA
1
NC
Write Protect (WP)
The Write Protect input controls the Hardware Write
Protect feature. When held LOW, Hardware Write
Protection is disabled. When this input is held HIGH, and the
WPEN bit in the Write Protect Register is set
.200”
NC
NC
S
2
V
SS
HIGH, the Write Protect Register is protected, preventing
changes to the Block Lock Protection and
12
V
CC
WP
.252”
WPEN bits.
* SOIC Measurement
2
7035 FM 02
X24320
Clock and Data Conventions
Data states on the SDA line can change only during
SCL LOW. SDA state changes during SCL HIGH are
reserved for indicating start and stop conditions. Refer to
Figures 1 and 2.
DEVICE OPERATION
The device supports a bidirectional bus oriented
protocol. The protocol defines any device that sends
data onto the bus as a transmitter, and the receiving device
as the receiver. The device controlling the
transfer is a master and the device being controlled is the
slave. The master will always initiate data transfers
Start Condition
All commands are preceded by the start condition,
which is a HIGH to LOW transition of SDA when SCL
and provide the clock for both transmit and receive
operations. Therefore, the device will be
is HIGH. The device continuously monitors the SDA and
SCL lines for the start condition and will not
respond to any command until this condition has been met.
considered a slave in all applications.
Figure 1. Data Validity
SCL
SDA
DATA STABLE
DATA
CHANGE
7035 FM 03
Figure 2. Definition of Start and Stop
SCL
SDA
START BIT
STOP BIT
3
7035 FM 04
X24320
when SCL is HIGH. The stop condition is also used to place
the device into the standby power mode after a
The device will respond with an acknowledge after
recognition of a start condition and its slave address. If
both the device and a write operation have been selected,
the device will respond with an acknowledge
after the receipt of each subsequent 8-bit word.
read sequence. A stop condition can only be issued after
the transmitting device has released the bus.
In the read mode the device will transmit eight bits of data,
release the SDA line and monitor the line for an
Stop Condition
All communications must be terminated by a stop
condition, which is a LOW to HIGH transition of SDA
acknowledge. If an acknowledge is detected and no stop
condition is generated by the master, the device
will continue to transmit data. If an acknowledge is not
detected, the device will terminate further data trans-
Acknowledge
Acknowledge is a software convention used to indicate
successful data transfer. The transmitting device,
either master or slave, will release the bus after trans- mitting
eight bits. During the ninth clock cycle the
missions. The master must then issue a stop condition
return the device to the standby power mode and
place the device into a known state.
receiver will pull the SDA line LOW to acknowledge that
it received the eight bits of data. Refer to Figure 3.
Figure 3. Acknowledge Response From Receiver
SCL FROM
MASTER
1
8
9
DATA OUTPUT
FROM
TRANSMITTER
DATA
OUTPUT
FROM
RECEIVER
START
ACKNOWLEDGE
7035 FM 05
4
to
X24320
device select input pins. If the compare is not successful, no
acknowledge is output during the ninth clock cycle
and the device returns to the standby mode.
DEVICE ADDRESSING
Following a start condition, the master must output the
address of the slave it is accessing. The first four bits
of the Slave Address Byte are the device type identifier bits.
These must equal “1010”.
The next 3 bits are the
device select bits S0, S1, and S2. This allows up to 8 devices
to share a single bus. These bits are
The word address is either supplied by the master or
obtained from an internal counter, depending on the
operation. The master must supply the two Word Address
Bytes as shown in figure 4.
compared to the S0, S1, and S2 device select input pins.
The last bit of the Slave Address Byte defines the
2
The internal organization of the E array is 128 pages by 32
bytes per page. The page address is partially
operation to be performed. When the R/W bit is a one, then
a read operation is selected. When it is zero then
contained in the Word Address Byte 1 and partially in bits 7
through 5 of the Word Address Byte 0. The byte
a write operation is selected. Refer to figure 4. After
loading the Slave Address Byte from the SDA bus, the
address is contained in bits 4 through 0 of the Word
Address Byte 0. See figure 4.
device compares the device type bits with the value
“1010” and the device select bits with the status of the
Figure 4. Device Addressing
DEVICE
SELECT
DEVICE TYPE
IDENTIFIER
1
0
1
S
2
0
S
1
S
0
R/W
SLAVE ADDRESS BYTE
HIGH ORDER WORD ADDRESS
0
0
0
0
A11
A10
A9
A8
X24320 WORD ADDRESS BYTE 1
LOW ORDER WORD ADDRESS
A7
A6
A5
A4
A3
A2
A1
A0
D1
D0
WORD ADDRESS BYTE 0
D7
D6
D5
D4
D3
DATA BYTE
5
D2
7035 FM 06
X24320
master can transmit up to thirty-one more words. The device
will respond with an acknowledge after the
WRITE OPERATIONS
Byte Write
receipt of each word, and then the byte address is
internally incremented by one. The page address
remains constant. When the counter reaches the end of the
page, it “rolls over” and goes back to the first byte of the
current page. This means that the master can write 32 words
to the page beginning at any byte.
For a write operation, the device requires the Slave
Address Byte, the Word Address Byte 1, and the Word
Address Byte 0, which gives the master access to any one
of the words in the array. Upon receipt of the Word
Address Byte 0, the device responds with an acknowledge,
and waits for the first eight bits of data. After
If the master begins writing at byte 16, and loads 32 words,
then the first 16 words are written to bytes 16
receiving the 8 bits of the data byte, the device again
responds with an acknowledge. The master then
terminates the transfer by generating a stop condition, at
which time the device begins the internal write cycle
through 31, and the last 16 words are written to bytes
0 through 15. Afterwards, the address counter would
point to byte 16. If the master writes more than 32 words,
then the previously loaded data is overwritten
by the new data, one byte at a time.
to the nonvolatile memory. While the internal write cycle
is in progress the device inputs are disabled
and the device will not respond to any requests from the
master. The SDA pin is at high impedance. See
figure 5.
The master terminates the data byte loading by
issuing a stop condition, which causes the device to
begin the nonvolatile write cycle. As with the byte write
operation, all inputs are disabled until completion of
Page Write
The device is capable of a thirty-two byte page write
operation. It is initiated in the same manner as the byte
the internal write cycle. Refer to figure 6 for the
address, acknowledge, and data transfer sequence.
write operation; but instead of terminating the write
operation after the first data word is transferred, the
Figure 5. Byte Write Sequence
S
T
SIGNALS
FROM THE
MASTER
A
R
WORD ADDRESS
BYTE 1
SLAVE
ADDRESS
WORD ADDRESS
BYTE 0
S
T
DATA
O
P
T
SDA BUS
S1010
0
SIGNALS
FROM THE
SLAVE
P
A
C
A
C
A
C
A
C
K
K
K
K
7035 FM 07
Figure 6. Page Write Sequence
(0=n=31)
SIGNALS
FROM THE
MASTER
S
T
A
R
WORD ADDRESS
BYTE 1
SLAVE
ADDRESS
DATA
(n)
DATA
(0)
WORD ADDRESS
BYTE 0
S
T
O
P
T
SDA BUS
SIGNALS
FROM THE
SLAVE
S 1010
0
P
A
C
A
C
A
C
A
C
A
C
K
K
K
K
K
7035 FM 08
6
X24320
Acknowledge Polling
The maximum write cycle time can be significantly
reduced using Acknowledge Polling. To initiate
READ OPERATIONS
Acknowledge Polling, the master issues a start condition
followed by the Slave Address Byte for a write or
read operation. If the device is still busy with the
internal write cycle, then no ACK will be returned. If the
the Slave Address Byte is set to one. There are three basic
read operations: Current Address Reads,
Random Reads, and Sequential Reads.
device has completed the internal write operation, an ACK
will be returned and the host can then proceed
Current Address Read
Internally, the device contains an address counter that
maintains the address of the last word read or written
Read operations are initiated in the same manner as write
operations with the exception that the R/W bit of
with the read or write operation. Refer to figure 7 .
incremented by one. After a read operation from the last
address in the array, the counter will “roll over” to the first
address in the array. After a write operation to
the last address in a given page, the counter will “roll
Figure 7. Acknowledge Polling Sequence
BYTE LOAD COMPLETED
BY ISSUING STOP.
over” to the first address on the same page.
ENTER ACK POLLING
Upon receipt of the Slave Address Byte with the R/W bit set
to one, the device issues an acknowledge and
then transmits the eight bits of the Data Byte. The
master terminates the read operation when it does not
ISSUE
START
respond with an acknowledge during the ninth clock and
then issues a stop condition. Refer to figure 8 for the address
acknowledge, and data transfer sequence.
ISSUE SLAVE
ADDRESS BYTE
ISSUE STOP
(READ OR WRITE)
ACK
RETURNED?
It should be noted that the ninth clock cycle of the read
operation is not a “don’t care "
.” To terminate a read
operation, the master must either issue a stop condition
during the ninth cycle or hold SDA HIGH during
the ninth clock cycle and then issue a stop condition.
NO
YES
HIGH
VOLTAGE
CYCLE COMPLETE.
CONTINUE
Figure 8. Current Address Read Sequence
NO
SEQUENCE?
SIGNALS
FROM THE
MASTER
YES
A
R
S
T
SLAVE
ADDRESS
O
P
T
SDA BUS
CONTINUE NORMAL
READ OR WRITE
S
T
ISSUE STOP
SIGNALS
FROM THE
SLAVE
COMMAND SEQUENCE
S 1 01 0
1
P
A
C
K
DATA
7035 FM 10
PROCEED
7035 FM 09
7
X24320
Random Read
Random read operation allows the master to access any
memory location in the array. Prior to issuing the
The next Current Address Read operation will read from
the newly loaded address.
Slave Address Byte with the R/W bit set to one, the
master must first perform a “Dummy” write operation.
The master issues the start condition and the Slave
Address Byte with the R/W bit low, receives an
Sequential Read
Sequential reads can be initiated as either a current
address read or random read. The first Data Byte is
transmitted as with the other modes; however, the
master now responds with an acknowledge, indicating
acknowledge, then issues the Word Address Byte 1,
receives another acknowledge, then issues the Word
it requires additional data. The device continues to
output data for each acknowledge received. The
Address Byte 0. After the device acknowledges receipt of
the Word Address Byte 0, the master issues another
start condition and the Slave Address Byte with the R/W bit
set to one. This is followed by an acknowledge
master terminates the read operation by not
with an acknowledge and then issuing a
stop condition.
responding
and then eight bits of data from the device. The master
terminates the read operation by not responding with
The data output is sequential, with the data from address n
followed by the data from address n + 1. The address
an acknowledge and then issuing a stop condition. Refer
to figure 9 for the address, acknowledge, and
data transfer sequence.
counter for read operations increments through all byte
addresses, allowing the entire memory contents to be
read during one operation. At the end of the address
space the counter “rolls over ” to address 0000h and the
device continues to output data for each acknowledge
received. Refer to figure 10 for the acknowledge and
The device will perform a similar operation called “Set Current
Address” if a stop is issued instead of the
second start shown in figure 9. The device will go into standby
mode after the stop and all bus activity will be
data transfer sequence.
ignored until a start is detected. The effect of this operation is
that the new address is loaded into the
address counter, but no data is output by the device.
Figure 9. Random Read Sequence
SIGNALS
FROM THE
MASTER
S
T
A
R
WORD ADDRESS
BYTE 1
SLAVE
ADDRESS
S
T
WORD ADDRESS
BYTE 0
A
R
T
SDA BUS
SLAVE
ADDRESS
S
T
O
P
T
S1 0 1 0
0
SIGNALS
FROM THE
SLAVE
1
S
P
A
C
A
C
A
C
A
C
K
K
K
K
DATA
7035 FM 11
Figure 10. Sequential Read Sequence
SIGNALS
FROM THE
MASTER
SLAVE
ADDRESS
SDA BUS
S
SIGNALS
FROM THE
SLAVE
A
C
A
C
A
C
K
K
K
S
T
O
P
1
P
A
C
K
DATA
(1)
DATA
(2)
DATA
(n–1)
DATA
(n)
(n is any integer greater than 1)
7035 FM 12
8
X24320
WRITE PROTECT REGISTER (WPR)
Writing to the Write Protect Register
WPEN: Write Protect Enable Bit (Nonvolatile)
The Write Protect (WP) pin and the Write Protect Enable
(WPEN) bit in the Write Protect Register
The Write Protect Register can only be modified by
performing a “ByteWrite” operation directly to the
address FFFFh as described below.
control the Programmable Hardware Write Protection
feature. Hardware Write Protection is enabled when
the WP pin is HIGH and the WPEN bit is HIGH, and disabled
when either the WP pin is LOW or the WPEN
The Data Byte must contain zeroes where indicated in the
procedural descriptions below; otherwise the oper-
bit is LOW. Figure 12 defines the write protect status for
each combination of WPEN and WP. When the
ation will not be performed. Only one Data Byte is
allowed for each register write operation. The part will
not acknowledge any data bytes after the first byte is entered.
The user then has to issue a stop to initiate
chip is Hardware Write Protected, nonvolatile writes are
disabled to the Write Protect Register, including
the Block Lock Protect bits and the WPEN bit itself, as well
as to the Block Lock protected sections in the
memory array. Only the sections of the memory array that are
not Block Lock protected, and the volatile bits
WEL and RWEL, can be written.
the nonvolatile write cycle that writes BL0, BL1, and
WPEN to the nonvolatile bits. A stop must also be
issued after volatile register write operations to put the device
into Standby.
The state of the Write Protect Register can be read by
performing a random byte read at FFFFh at any time.
In Circuit Programmable ROM Mode
Note that when the WPEN bit is write protected, it
cannot be changed back to a LOW state; so write
The part will reset itself after the first byte is read. The master
should supply a stop condition to be consistent
protection is enabled as long as the WP pin is held HIGH.
Thus an In Circuit Programmable ROM function
can be implemented by hardwiring the WP pin to VCC, writing
to and Block Locking the desired portion of the
with the protocol, but a stop is not required to end this
operation. After the read, the address counter contains
0000h.
array to be ROM, and then programming the WPEN bit
HIGH.
Write Protect Register: WPR (ADDR = FFFFh)
7
6
5
4
3
WPEN
0
0
BL1
BL0
2
1
RWEL WEL
0
Unused Bit Positions
Bits 0, 5 & 6 are not used. All writes to the WPR must have
zeros in these bit positions. The data byte output
during a WPR read will contain zeros in these bits.
0
WEL: Write Enable Latch (Volatile)
0 = Write Enable Latch reset, writes disabled.
Writing to the WEL and RWEL bits
WEL and RWEL are volatile latches that power up in the
LOW (disabled) state. While the WEL bit is LOW,
1 = Write Enable Latch set, writes enabled.
writes to any address other than FFFFh will be ignored (no
acknowledge will be issued after the Data Byte).
RWEL: Register Write Enable Latch (Volatile)
0 = Register Write Enable Latch reset, writes to the Write
Protect Register disabled.
The WEL bit is set by writing 00000010 to address
FFFFh. Once set, WEL remains HIGH until either it is
reset to 0 (by writing 00000000 to FFFFh) or until the part
powers up again. Writes to WEL and RWEL do
1 = Register Write Enable Latch set, writes to the Write
Protect Register enabled.
not cause a nonvolatile write cycle, so the device is ready
for the next operation immediately after the stop
condition.
BL0, BL1: Block Lock Protect Bits (Nonvolatile) The
Block Lock Protect Bits, BL0 and BL1, determine
which blocks of the array are protected. A write to a
protected block of memory is ignored, but will receive
an acknowledge. The master must issue a stop to put the part
into standby, just as it would for a valid write;
The RWEL bit controls writes to the Block Lock Protect bits,
BL0 and BL1, and the WPEN bit. If RWEL is 0
but the stop will not initiate an internal nonvolatile write
cycle. See figure 11.
after any nonvolatile write, including writes to the Block
Lock Protect bits, WPEN bit, or any bytes in the
memory array. When RWEL is set, WEL cannot be
then no writes can be performed on BL0, BL1, or
WPEN. RWEL is reset when the device powers up or
9
X24320
reset, nor can RWEL and WEL be reset in one write
operation. RWEL can be reset by writing 00000010 to
step 2. RWEL is reset to zero in step 3 so that user is
required to perform steps 2 and 3 to make another
change. RWEL must be 0 in step 3. If the RWEL bit in the data
byte for step 3 is a one, then no changes are
FFFFh; but this is the same operation as in step 3
described below, and will result in programing BL0,
BL1, and WPEN.
made to the Write Protect Register and the device
remains at step 2.
Writing to the BL and WPEN Bits
A 3 step sequence is required to change the nonvola- tile
Block Lock Protect or Write Protect Enable bits:
1) Set WEL=1, Write 00000010 to address FFFFh
(Volatile Write Cycle.)
The WP pin must be LOW or the WPEN bit must be LOW
before a nonvolatile register write operation is
initiated. Otherwise, the write operation will abort and the
device will go into standby mode after the master
issues the stop condition in step 3.
2) Set RWEL=1, Write 00000110 to address FFFFh
(Volatile Write Cycle.)
Step 3 is a nonvolatile write operation, requiring tWC to
complete (acknowledge polling may be used to reduce
this time requirement). It should be noted that step 3 MUST
end with a stop condition. If a start condition is
3) Set BL1, BL0, and/or WPEN bits, Write u00xy010 to
address FFFFh, where u=WPEN, x=BL1, and y=BL0.
(Nonvolatile Write Cycle.)
issued during or at the end of step 3 (instead of a stop
condition) the device will abort the nonvolatile register
The three step sequence was created to make it diffi cult to change the contents of the Write Protect
Register accidentally. If WEL was set to one by a
write and remain at step 2. If the operation is aborted with a
start condition, the master must issue a stop to
put the device into standby mode.
previous register write operation, the user may start at
ABSOLUTE MAXIMUM RATINGS*
Figure 11. Block Lock Protect Bits and Protected Addresses
BL1
BL0
Protected Addresses
Array Location
0
0
None
No Protect
0
1
C00h - FFFh
Upper 1/4
1
0
800h - FFFh
Upper 1/2
1
1
000h - FFFh
Full Array
7003 FRM T02
Figure 12. WP Pin and WPEN Bit Functionality
WP
WPEN
Memory Array Not
Lock Block Protected
0
X
Writable
X
0
1
1
Memory Array Block
Lock Protected
Block Lock Bits
WPEN
Bit
Protected
Unprotected
Unprotected
Writable
Protected
Unprotected
Unprotected
Writable
Protected
Protected
Protected
7003 FRM T03
10
X24320
Temperature under Bias
X24320 ....................................... –65°C to +135°C
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only and the functional operation
Storage Temperature ........................ –65°C to +150°C
Voltage on any Pin with
Respect to VSS .................................... –1V to +7V
D.C. Output Current ..............................................5mA
Lead Temperature (Soldering,
.............................. 300°C
10 seconds)
of the device at these or any other conditions above
those indicated in the operational sections of this
specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
RECOMMENDED OPERATING CONDITIONS
Supply Voltage
Limits
Temperature
Min.
Max.
X24320
4.5V to 5.5V
Commercial
0°C
+70°C
2.5V to 5.5V
Industrial
–40°C
+85°C
X24320–2.
5
X24320–1.
1.8V to 3.6V
8
7003 FRM T04
7003 FRM T05
D.C. OPERATING CHARACTERISTICS
Limits
Symbol
Parameter
Min.
Max.
Units
ICC1
VCC Supply Current (Read)
1
mA
ICC2
VCC Supply Current (Write)
3
mA
ISB1 (1)
VCC Standby Current
5
∝A
1
∝A
Test Conditions
SCL = VCC X 0.1/VCC X 0.9 Levels @
400KHz, SDA = Open, All Other
Inputs = VSS or VCC – 0.3V
SCL = SDA = VCC, All Other
Inputs = VSS or VCC – 0.3V,
VCC = 5V ± 10%
ISB2 (1)
VCC Standby Current
SCL = SDA = VCC, All Other
Inputs = VSS or VCC – 0.3V,
VCC = 2.5V
ILI
Input Leakage Current
10
∝A
VIN = VSS to VCC
ILO
Output Leakage Current
10
∝A
VOUT = VSS to VCC
VlL (2)
Input LOW Voltage
–0.5
VCC x 0.3
V
VIH (2)
Input HIGH Voltage
VCC x 0.7
VCC + 0.5
V
VOL
Output LOW Voltage
0.4
V
Vhys (3)
Hysteresis of Schmitt
Trigger Inputs
VCC x 0.05
IOL = 3mA
V
7003 FRM T06
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol
Parameter
Max.
Units
Test Conditions
CI/O (3)
Input/Output Capacitance (SDA)
8
pF
VI/O = 0V
CIN (3)
Input Capacitance (S0, S1, S2, SCL, WP)
6
pF
VIN = 0V
7003 FRM T07
Notes: (1)Must perform a stop command prior to measurement.
(2)VIL min. and VIH max. are for reference only and are not 100% tested. (3)This
parameter is periodically sampled and not 100% tested.
11
X24320
EQUIVALENT A.C. LOAD CIRCUIT
A.C. CONDITIONS OF TEST
VCC x 0.1 to VCC x 0.9
Input Pulse Levels
Input Rise and
Fall Times
5V
10ns
Input and Output
Timing Levels
1.53KΟ
OUTPUT
VCC X 0.5
7003 FRM T08
100pF
7035 FM 13
A.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions, unless otherwise specified.) Read
& Write Cycle Limits
Symbol
Parameter
Min.
Max.
Units
0
400
KHz
fSCL
SCL Clock Frequency
tI
Noise Suppression Time
Constant at SCL, SDA Inputs
50
tAA
SCL LOW to SDA Data Out Valid
0.1
tBUF
Time the Bus Must Be Free Before a
New Transmission Can Start
1.2
∝s
tHD:STA
Start Condition Hold Time
0.6
∝s
tLOW
Clock LOW Period
1.2
∝s
tHIGH
Clock HIGH Period
0.6
∝s
tSU:STA
Start Condition Setup Time
a Repeated Start Condition)
0.6
∝s
tHD:DAT
Data In Hold Time
0
∝s
tSU:DAT
Data In Setup Time
100
ns
tR
SDA and SCL Rise Time
300
ns
tF
SDA and SCL Fall Time
300
ns
tSU:STO
Stop Condition Setup Time
0.6
tDH
Data Out Hold Time
50
tOF
Output Fall Time
(for
ns
∝s
0.9
∝s
300
ns
20+0.1Cb (5)
7003 FRM T09
POWER-UP TIMING
(4)
Symbol
Parameter
Max.
Units
tPUR
Power-up to Read Operation
1
ms
tPUW
Power-up to Write Operation
5
ms
7003 FRM T10
Notes: (4)tPUR and tPUW are the delays required from the time VCC is stable until the specified operation can be initiated.
These parameters are periodically sampled and not 100% tested.
12
X24320
Bus Timing
t
t
F
t
HIGH
t
LOW
R
SCL
t
t
SU:STA
HD:STA
t
t
HD:DAT
t
SU:DAT
SU:STO
SDA IN
t
t
AA
t
DH
BUF
SDA OUT
7035 FM 14
Write Cycle Limits
Symbol
tWC
Parameter
(6)
(5)
Min.
Typ.
Write Cycle Time
5
Max.
Units
10
ms
7003 FRM T11
Notes: (5)Typical values are for TA = 25°C and nominal supply voltage (5V).
(6)tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum
time the device requires to automatically complete the internal write operation.
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/write cycle.
During the write cycle, the X24320 bus interface circuits are disabled, SDA is allowed to remain HIGH, and the device does
not respond to its slave address.
Bus Timing
SCL
SDA
ACK
8th BIT
WORD n
t
WC
STOP
CONDITION
RESISTANCE (KΟ)
WAVEFORM
V
R
MIN
100
80
=
R
MAX
=
CC MAX
I
OL MIN
=1.8KΟ
t
R
C
BUS
MAX.
RESISTANCE
60
40
20
MIN.
RESISTANCE
0
0
20
40
60
80 100120
BUS CAPACITANCE (pF)
7035 FM 15
SYMBOL TABLE
Guidelines for Calculating Typical Values of
Bus Pull-Up Resistors
120
START
CONDITION
7035 FM 16
INPUTS
OUTPUTS
Must be
steady
Will be
steady
May change
from Low to
Will change
from Low to
High
High
May change
from High to
Will change
from High to
Low
Low
Don’t Care:
Changes
Changing:
State Not
Allowed
N/A
Known
Center Line
is High
Impedance
13
7035 FM 17
X24320
PACKAGING INFORMATION
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S
0.150 (3.80)
0.158 (4.00)
0.228 (5.80)
0.244 (6.20)
PIN 1 INDEX
PIN 1
0.014 (0.35)
0.019 (0.49)
0.188 (4.78)
0.197 (5.00)
(4X) 7°
0.053 (1.35)
0.069 (1.75)
0.004 (0.19)
0.010 (0.25)
0.050 (1.27)
0.050" TYPICAL
0.010 (0.25)
X 45°
0.020 (0.50)
0.050"
TYPICAL
0° – 8°
0.0075 (0.19)
0.010 (0.25)
0.250"
0.016 (0.410)
0.037 (0.937)
0.030"
TYPICAL
FOOTPRINT
8 PLACES
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
7035 FM 19
14
X24320
PACKAGING INFORMATION
14-LEAD PLASTIC, TSSOP, PACKAGE TYPE V
.025 (.65) BSC
.169
(4.3) .177
(4.5)
.252 (6.4) BSC
.193
(4.9) .200
(5.1)
.047 (1.20)
.0075
(.19) .0118
(.30)
.002
(.05) .006
(.15)
.010 (.25)
Gage Plane
0° – 8°
Seating Plane
.019
(.50) .029
(.75)
Detail A (20X)
.031
(.80) .041
(1.05)
See Detail “A”
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
7035 FM 20
15
X24320
PACKAGING INFORMATION
8-LEAD PLASTIC DUAL IN-LINE PACKAGE TYPE P
0.430 (10.92)
0.360 (9.14)
0.260 (6.60)
0.240 (6.10)
PIN 1 INDEX
PIN 1
0.300
(7.62) REF.
HALF SHOULDER WIDTH ON
ALL END PINS OPTIONAL
0.060 (1.52)
0.020 (0.51)
0.145 (3.68)
0.128 (3.25)
SEATING
PLANE
0.025 (0.64)
0.015 (0.38)
0.150 (3.81)
0.125 (3.18)
0.065 (1.65)
0.045 (1.14)
0.110 (2.79)
0.090 (2.29)
0.015 (0.38)
MAX.
TYP
.
0.020 (0.51)
0.016 (0.41)
0.325 (8.25)
0.300 (7.62)
0°
15°
0.010 (0.25)
NOTE:
1.ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS) 2.
PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
7040 FM 18
16
X24320
ORDERING INFORMATION
X24320
P
T G -V
Device
VCC Range
Blank = 5V ±10%
2.5 = 2.5V to 5.5V
1.8 = 1.8V to 3.6V
G=RoHS Compliant Lead Free package
Blank = Standard package. Non lead free
Temperature Range
Blank = 0°C to +70°C
I = –40°C to +85°C
Package
X24320
S8 = 8-Lead SOIC
V14 = 14-Lead TSSOP
P = 8-Lead PDIP
Part Mark Convention
X24320
XG
X
Blank = 8-Lead SOIC
V = 14-Lead TSSOP
P = 8-Lead PDIP
G = RoHS compliant lead free
Blank = 4.5V to 5.5V, 0°C to +70°C
I = 4.5V to 5.5V, –40°C to +85°C
AE = 2.5V to 5.5V, 0°C to +70°C
AF = 2.5V to 5.5V, –40°C to +85°C
AG = 1.8V to 3.6V, 0°C to +70°C
AH = 1.8V to 3.6V, –40°C to +85°C
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no
warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from
patent infringement. Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production
and change specifications and prices at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses
are implied.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475;
4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign
patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with
appropriate error detection and correction, redundancy and back-up features to prevent such an occurence.
Xicor's products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected
to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of
the life support device or system, or to affect its safety or effectiveness.
17