IR-Lumineszenzdiode (880 nm) im TO-46-Gehäuse Infrared Emitter (880 nm) in TO-46 Package Lead (Pb) Free Product - RoHS Compliant SFH 4881 SFH 4883 SFH 4881 SFH 4883 Wesentliche Merkmale Features • Hergestellt im Schmelzepitaxieverfahren • Anode galvanisch mit dem Gehäuseboden verbunden • Hohe Zuverlässigkeit • Gute spektrale Anpassung an Si-Fotoempfänger • Hermetisch dichtes Metallgehäuse • • • • • Anwendungen Applications • Lichtschranken für Gleich- und Wechsellichtbetrieb • IR-Gerätefernsteuerungen • Sensorik • Photointerrupters • IR remote control • Sensor technology Fabricated in a liquid phase epitaxy process Anode is electrically connected to the case High reliability Matches all Si-Photodetectors Hermetically sealed package Typ Type Bestellnummer Ordering Code Strahlstärke (IF = 100 mA, tp = 20 ms) Radiant Intensity) Ie (mW/sr) SFH 4881 Q62702P5302 ≥ 40 (typ. 72) SFH 4883 Q62702P5303 ≥ 4 (typ. 8) 2008-02-25 1 SFH 4881, SFH 4883 Grenzwerte (TC = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top; Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Durchlaßstrom Forward current IF 200 mA Stoßstrom Surge current tp = 10 µs, D = 0.01 IFSM 2.5 A Verlustleistung Power dissipation Ptot 470 mW Wärmewiderstand Thermal resistance RthJA RthJC 450 160 K/W K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength of peak emission λpeak 880 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax ∆λ 80 nm ϕ ϕ ±5 ± 35 Grad deg. Aktive Chipfläche Active chip area A 0.16 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L×B L×W 0.4 × 0.4 mm² Kennwerte (TA = 25 °C) Characteristics Abstrahlwinkel Half angle SFH 4881 SFH 4883 2008-02-25 2 SFH 4881, SFH 4883 Kennwerte (TA = 25 °C) (cont’d) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10% Switching times, Ie from 10% to 90% and from 90% to 10% IF = 100 mA, RL = 50 Ω t r , tf 500 ns Kapazität Capacitance VR = 0 V, f = 1 MHz Co 25 pF VF VF VF 1.5 (≤ 1.8) 2.4 (≤ 3.0) 2.9 (≤ 3.4) V V V IR 0.01 (≤ 10) µA Φe Φe 12 15 mW mW Durchlaβspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs IF = 1.5 A, tp = 100 µs Sperrstrom Reverse current VR = 5 V Gesamtstrahlungsfluß Total radiant flux IF = 100 mA, tp = 20 ms SFH 4881 SFH 4883 Strahlstärke Ie in Achsrichtung gemessen bei einem Raumwinkel von Ω = 0.01 sr Radiant Intensity Ie in Axial Direction measured at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Symbol Wert Value SFH 4881 SFH 4883 Einheit Unit Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie typ 40 72 4 8 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1 A, tp = 100 µs Ie typ 630 70 mW/sr 2008-02-25 3 SFH 4881, SFH 4883 Relative Spectral Emission Ierel = f (λ) OHR01171 100 Ι erel Radiant Intensity Ie/Ie (100 mA) = f (IF) Max. Permissible Forward Current IF = f (TA, TC) OHR01172 10 2 Ιe Ι e (100 mA) % IF 10 60 10 0 R thJC = 160 K/W 200 1 80 OHF03900 240 mA 160 120 10 -1 40 R thJA = 450 K/W 80 10 -2 20 0 750 800 850 900 950 nm 1000 10 -3 10 0 10 1 10 2 λ Forward Current IF = f (VF) 0 10 3 mA 10 4 ΙF 0 20 40 60 80 ˚C 100 TA , TC Radiation Characteristics SFH 4881, Ierel = f (ϕ) OHR01173 10 1 ΙF 40 40˚ 30˚ 20˚ 10˚ ϕ A 0˚ OHR01178 1.0 50˚ 10 0 0.8 60˚ 0.6 10 -1 10 -2 70˚ 0.4 80˚ 0.2 0 90˚ 10 -3 0 1 2 3 4 5 100˚ VF Permissible Pulse Handling Capability IF = f (τ), TC = 25 °C, RthJC = 160 K/W,duty cycle D = parameter 2.6 IF A 0.8 0.6 0.4 40˚ 30˚ 20˚ tP D = TP IF T 1.6 1.4 1.2 1.0 0.8 0.6 10˚ ϕ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 0˚ OHR01186 1.0 50˚ 0.8 2.0 1.8 0˚ Radiation Characteristics SFH 4883, Ierel = f (ϕ) OHF03756 t 1.0 D= 60˚ 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 0.4 0.2 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 100˚ 1.0 0.8 0.6 tp 2008-02-25 4 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ SFH 4881, SFH 4883 Maßzeichnungen Package Outlines SFH 4881 ø4.8 (0.189) ø4.6 (0.181) 1 ø5.6 (0.220) ø5.3 (0.209) 2.54 (0.100) spacing ø0.43 (0.017) 6.2 (0.244) 5.4 (0.213) Chip position (1.1 (0.043)) 2 0.9 ) 43 0.35 (0.014) max. 20 (0.787) 18 (0.709) 1.1 5.2 (0.205) 4.9 (0.193) .0 (0 0.9 1.1 (0 .04 .03 3) 5) (0 5) 3 0.0 ( GEMY6049 5) 0.35 (0.014) max. 3.8 (0.150) 3.5 (0.138) 2.54 (0.100) spacing 1.1 0.9 3) .03 (0 2 20 (0.787) 18 (0.709) .04 (0 0.9 1 1.1 ø0.43 (0.017) Chip position (1.1 (0.043)) (0 (0 .043 .03 ) 5) ø4.8 (0.189) ø4.6 (0.181) SFH 4883 ø5.6 (0.220) ø5.3 (0.209) GEMY6050 Maße in mm (inch) / Dimensions in mm (inch). Package TO-46-Metallgehäuse, Glaslinse, hermetisch dicht, Anschlüsse im 2.54-mm-Raster (1/10’’) TO-46-metal-package, glass lens, hermetically sealed, solder tabs lead spacing 2.54 mm (1/10’’) Anschlussbelegung Pin configuration Anschluss 2: Kathode Pin 2 : cathode Gehäuse 2008-02-25 5 SFH 4881, SFH 4883 Lötbedingungen Soldering Conditions Wellenlöten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskühlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2008-02-25 6